| Patent application number | Description | Published |
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| 20090262555 | CURRENT-MODE CONTROLLED DC-DC CONVERTER - A current-mode controlled DC-DC converter includes a comparator comparing a first or second current detection signal with a first or second reference current that is based on an error voltage of a voltage detection signal, a pulse generator generating a first pulse signal whose ON time is longer than an interval between when the second current detection signal reaches a minimum value and when the second current detection signal reaches the second reference current, a pulse generator generating a second pulse signal whose ON time is longer than an interval between when the first current detection signal reaches a minimum value and when the first current detection signal reaches the first reference current, the second pulse signal being behind the first pulse signal by a half period, and a PWM circuit generating a first or second PWM signal according to the pulse signal and an output signal from the comparator, thereby turning on/off a switch. | 10-22-2009 |
| 20090262557 | BI-DIRECTIONAL DC-DC CONVERTER - A bi-directional DC-DC converter includes a first series circuit connected to ends of a first DC power source and including a first winding of a first reactor and a first switch; a second series circuit connected to ends of the first switch and including a second winding of the first reactor, a second reactor, a second switch, a third switch, and a second DC power source; a third series circuit connected to the ends of the first switch and including a fourth switch and the second DC power source; and a control circuit configured to turn on/off the switches and thereby carry out step-up and step-down operations between the first and second DC power sources. | 10-22-2009 |
| 20100019743 | DC-DC CONVERTER - The present invention provides a DC-DC converter including a first series circuit connected to both ends of a first switch and formed of a winding of a first transformer, a first reactor, a first diode, and a smoothing capacitor, a second diode connected to a connection point of a primary winding of the first transformer, the winding of the first transformer and the first switch, and to one end of the smoothing capacitor, a second series circuit connected to both ends of a second switch and formed of a winding of a second transformer, a second reactor, a third diode, and the smoothing capacitor, a fourth diode connected to a connection point of a primary winding of the second transformer, the winding of the second transformer and the second switch, and to the one end of the smoothing capacitor, a third reactor connected to both ends of a series circuit of a secondary winding of the first transformer and a secondary winding of the second transformer, and a control circuit which alternately turns on the first switch and the second switch every ½ cycle, turns off the first switch during an on-period of the second switch, and turns off the second switch during an on-period of the first switch. | 01-28-2010 |
| Patent application number | Description | Published |
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| 20110050044 | METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodes | 03-03-2011 |
| 20110179613 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method capable of manufacturing a package easily and efficiently. The package manufacturing method includes a jig disposing step of disposing a covering jig covering an outer peripheral portion on one surface of a first board so as to expose a hole forming region through a jig opening formed on the covering jig; and a filling step of filling a filling material constituting at least a part of penetration electrodes into holes. The filling step includes a metal mask disposing step of disposing a metal mask | 07-28-2011 |
| 20110199162 | PACKAGE, METHOD OF MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate. | 08-18-2011 |
| 20110203084 | METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode at a low cost without conduction defects while maintaining the airtightness of a cavity, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. In a glass frit application step, a glass frit is applied onto a first surface so that a first opening on the first surface side of a penetration hole is blocked under a depressurized atmosphere in a state where a second surface side of the penetration hole is blocked. In a glass frit filling step, an atmospheric pressure is increased so that the glass frit is filled in the penetration hole by a pressure difference which is generated between the inside of the penetration hole and the outside of the penetration hole. | 08-25-2011 |
| 20110204986 | METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity by suppressing the occurrence of voids in a baked glass, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. The package manufacturing method includes a second glass frit filling step of filling a second glass frit in a penetration hole to be overlapped on a first glass frit and temporarily drying the second glass frit; and a baking step of baking and curing the first and second glass frits filled in the penetration hole. The second particle size of the second glass particles contained in the second glass frit is larger than the first particle size of the first glass particles contained in the first glass frit. | 08-25-2011 |
| 20110226731 | CRYSTAL SUBSTRATE ETCHING METHOD, PIEZOELECTRIC VIBRATING REED, A PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a crystal substrate etching method capable of processing with high accuracy, a piezoelectric vibrating reed of which the outer shape is formed by the method, a piezoelectric vibrator having the piezoelectric vibrating reed, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezo-electric vibrator. A crystal substrate and an auxiliary substrate are successively dry-etched from a second surface side of the crystal substrate in a state where the auxiliary substrate having approximately the same etching rate as the crystal substrate is bonded to a first surface of the crystal substrate. | 09-22-2011 |
| 20110249535 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole. | 10-13-2011 |
| 20110253305 | PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A method of manufacturing a package in which generation of voids in the interior of glass frit is restrained, so that maintenance of hermeticity in a cavity and improvement of mechanical strength of through electrodes are achieved, such a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio timepiece are provided. The invention is characterized by including baking glass frit filled in through holes and solidifying the same, and the baking step is performed by a decompressed atmosphere, which is set to a pressure lower than the atmospheric pressure. | 10-20-2011 |
| 20110255378 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a package capable of sealing an electronic component in a cavity formed between a plurality of substrates bonded to each other includes a penetration electrode forming step of forming a penetration electrode which passes through a first substrate of the plurality of substrates in the thickness direction and which electrically connects the inside of the cavity and the outside of the package to each other. The package manufacturing method is characterized in that the penetration electrode forming step includes a through hole forming step of forming a through hole for disposing the penetration electrode in the first substrate and a filling step of filling a filler into the through hole under a decompressed atmosphere. | 10-20-2011 |
| 20110261658 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit. | 10-27-2011 |
