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| 20090026615 | SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTION TERMINALS AND METHOD OF MANUFACTURING THE SAME - In one embodiment, a semiconductor device has a semiconductor element made up of a semiconductor chip, first solder balls provided on the semiconductor chip and a BGA substrate on which the semiconductor chip is mounted via the first solder balls. Furthermore, the semiconductor device has external terminals on a surface of the BGA substrate opposing to a surface on which the semiconductor chip is mounted. The external terminals include oxide films provided with through holes. | 01-29-2009 |
| 20090230175 | Flux for soldering and method for manufacturing an electronic device using the same - A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a compound, which is represented by a general formula (1) and having a boiling point of 218° C. or higher and 240° C. or lower: R | 09-17-2009 |
| 20100105170 | Method for manufacturing a semiconductor device having a heat spreader - A method for manufacturing a semiconductor device includes cutting a resin sealing body into a plurality of pieces. The resin sealing body includes a plurality of semiconductor chips mounted on a wiring board, a heat spreader disposed above the plurality of the semiconductor chips, and sealing resin filled between the wiring board and the heat spreader. The cutting the resin sealing body includes shaving the resin sealing body from a side of the heat spreader and shaving the resin sealing body from a side of the wiring board. The method prevents the heat spreader from generation of burrs. | 04-29-2010 |
| 20110042802 | Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal - A semiconductor device includes an electrode pad and an external connection terminal. The external connection terminal contains Sn equal to or more than 50 wt %, Sn and Pb equal to or more than 90 wt % in total, or Pb equal to or more than 85 wt %, and the surface thereof is coated with an Au layer. The thickness of the Au layer is preferably equal to or more than 10 nm and equal to or less than 1 μm. The weight of the Au layer is preferably equal to or less than 0.6% of the weight of the external connection terminal. | 02-24-2011 |
| 20110104872 | Method of manufacturing a semiconductor device having a heat spreader - A semiconductor device manufacturing method includes cutting a resin sealing body into a plurality of pieces, in which the resin sealing body includes a plurality of semiconductor chips mounted on a wiring board, a heat spreader disposed above the plurality of the semiconductor chips, and a sealing resin filled between the wiring board and the heat spreader. The cutting the resin sealing body includes shaving the resin sealing body from a side of the heat spreader, and shaving the resin sealing body from a side of the wiring board. The shaving the resin sealing body from the side of the heat spreader includes etching the heat spreader. | 05-05-2011 |
| 20110215462 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing semiconductor devices is provided, in which a resin sealing structure includes an interconnection substrate board, semiconductor chips, a heat radiation plate, and sealing resin. The method is achieved by cutting the heat radiation plate by a plate cutting blade in a first direction along a first heat radiation plate cutting line; by cutting the heat radiation plate by the plate cutting blade in a second direction along a second heat radiation plate cutting line, after cutting in the first direction by the plate cutting blade; and by cutting the interconnection substrate board and the sealing resin along first and second interconnection substrate board cutting lines by a substrate board cutting blade in the first direction and the second direction, respectively. The second heat radiation plate cutting line and the second interconnection substrate board cutting line correspond to each other in position in a third direction orthogonal to the first direction and the second direction. The first heat radiation plate cutting line is displaced from the first interconnection substrate board cutting line by a preset displacement amount in a direction opposite to the second direction. | 09-08-2011 |
| 20110233768 | SEMICONDUCTOR DEVICE - A semiconductor device includes: an interconnection substrate on which a semiconductor chip is mounted; electrodes formed on a surface of the interconnection substrate; and solder bumps formed on the electrodes. The solder bump includes a base section and a surface layer section that covers the base section. The surface layer section includes conductive metal selected from the group consisting of Cu, Ni, Au, and Ag, and Sn at least and a ratio of the number of atoms of the conductive metal to the number of Sn atoms per a unit volume is more than 0.01. | 09-29-2011 |
| 20110237065 | SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - Soldering flux includes: a solvent of which solubility in water is more than 0.01% by weight and less than 6.8% by weight; an organic acid component; and amine counteracting the organic acid component. A solubility of the amine in water is more than 5.0% by weight, and the amine is able to be linked to a conductive metal via a coordination linkage. A solder bump is formed by heating a solder ball with the soldering flux. The residue of the flux on the surface of the solder bump has water solubility, and is easily eliminated. Further, the conductive metal coordinated to the amine is deposited on the surface of the solder bump by water washing. As a result, when testing the semiconductor device having the solder bump | 09-29-2011 |
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| 20110134179 | INKJET RECORDING DEVICE - An inkjet recording apparatus is presented. The inkjet recording apparatus includes an ink head configured to move in left and right directions, comprising a plurality of nozzles arranged in a front-rear direction for discharging ink on a recording medium, wherein the ink is curable when irradiated with light from a first light emitting device or a second light emitting device, and a conveyor device configured to feed the recording medium in a direction, wherein the first light emitting device is configured to move integrally with the ink head and to apply light to the recording medium, and wherein the second light emitting device, disposed offset from the plurality of nozzles in the front-rear direction, is configured to turn on independent of the first light emitting device and to apply light to the recording medium. | 06-09-2011 |
| 20110157272 | INK JET TYPE RECORDING DEVICE AND COMPUTER PROGRAM - In accordance with an embodiment, an inkjet recording apparatus is presented. The inkjet apparatus includes a recording head configured to eject an ink on a recording medium, an ink curing device configured to cure the ink ejected on the recording medium, a moving device configured to move the recording medium in a first direction and a second direction opposite to the first direction, a control device configured to control the recording head, the ink curing device, and the moving device. | 06-30-2011 |
| 20110235069 | INKJET PRINTER - An object is to shorten the printing time of an inkjet printer capable of forming a plurality of ink layers on a medium. An inkjet printer ( | 09-29-2011 |
