| Patent application number | Description | Published |
|---|
| 20090221215 | ADHESIVE SHEET FOR GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER USING THE SAME - The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 μm. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer. | 09-03-2009 |
| 20090311474 | ADHESIVE SHEET FOR WATER JET LASER DICING - An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber. | 12-17-2009 |
| 20090314417 | METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SHEET FOR USE IN THE METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER - The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500. | 12-24-2009 |
| 20100028662 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES - An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 μm. | 02-04-2010 |
| 20100230036 | SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF SEMICONDUCTOR WAFER, METHOD FOR GRINDING BACK SIDE OF SEMICONDUCTOR WAFER USING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa. | 09-16-2010 |
| 20100255299 | METHOD OF APPLYING PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROTECTION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROTECTION FOR USE IN THE APPLICATION METHOD - The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surface of a semiconductor wafer a pressure-sensitive adhesive sheet for semiconductor wafer protection including a substrate, at least one interlayer, and a pressure-sensitive adhesive layer superposed in this order, in which the pressure-sensitive adhesive sheet is applied to the semiconductor wafer at an application temperature in the range of from 50° C. to 100° C. and the interlayer in contact with the pressure-sensitive adhesive layer has a loss tangent (tan δ) of 0.5 or larger at the application temperature. | 10-07-2010 |
| 20100313667 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR TESTING - Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection. | 12-16-2010 |
| 20110065217 | PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE HAVING SAME - A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test. | 03-17-2011 |
| 20110159642 | TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP - The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region. | 06-30-2011 |
