| Patent application number | Description | Published |
|---|
| 20080248296 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING - The present invention relates to a pressure-sensitive adhesive sheet for processing, which includes a substrate; a pressure-sensitive adhesive layer containing a radiation-polymerizable compound; and an interlayer containing an acrylic polymer having a glass transition temperature of 20° C. or higher as a main component, the interlayer being disposed between the substrate and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet of the invention is excellent in pressure-sensitive adhesive properties, releasability, and expansibility. | 10-09-2008 |
| 20080261038 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES - An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer. | 10-23-2008 |
| 20100028669 | RE-RELEASABLE ADHESIVE AGENT AND RE-RELEASABLE ADHESIVE SHEET - A re-releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator, the radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula (1): CH | 02-04-2010 |
| 20100032087 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND LASER PROCESSING METHOD - In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(μm/pulse)/(J/cm | 02-11-2010 |
| 20100080989 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND METHOD FOR LASER PROCESSING - The present invention provides a pressure-sensitive adhesive sheet for laser processing, which includes a base and a pressure-sensitive adhesive layer provided on one surface of the base, the pressure-sensitive adhesive layer having an absorption coefficient at a wavelength of 355 nm of from 50 cm | 04-01-2010 |
| 20110008597 | SURFACE PROTECTIVE SHEET - A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 μm height on its surface. | 01-13-2011 |
| 20110008949 | ADHESIVE SHEET FOR DICING SEMICONDUCTOR WAFER AND METHOD FOR DICING SEMICONDUCTOR WAFER USING THE SAME - An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer. | 01-13-2011 |
| 20110030881 | ADHESIVE SHEET FOR SUPPORTING AND PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK OF SEMICONDUCTOR WAFER - An adhesive sheet for supporting and protecting a semiconductor wafer has an adhesive layer formed on one side of a base film, the adhesive layer having a thickness of 4 to 42 μm and an elastic modulus at 25° C. of 0.5 to 9 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable. | 02-10-2011 |
| 20110030882 | ADHESIVE SHEET FOR SUPPORTING AND PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK OF SEMICONDUCTOR WAFER - An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 μm and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 μm and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable. | 02-10-2011 |
| 20110076490 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR RETAINING ELEMENTS AND METHOD OF PRODUCING ELEMENTS - A pressure-sensitive adhesive sheet for retaining elements according to an embodiment of the present invention includes abase material layer and a pressure-sensitive adhesive layer provided on the base material layer and capable of being cured by an external stimulus. A crack-generating elongation represented by the following equation in a case where the pressure-sensitive adhesive sheet is elongated in a state where the pressure-sensitive adhesive layer is cured is larger than 115%. | 03-31-2011 |
| 20110097576 | RE-PEELABLE ADHESIVE SHEET - A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 10 | 04-28-2011 |
