| Patent application number | Description | Published |
|---|
| 20080217312 | METHOD FOR FABRICATING WORKPIECE AND LASER PROCESSING APPARATUS - According to an aspect of an embodiment, a method for fabricating a workpiece comprises the steps of: irradiating the workpiece with a laser light to raise a temperature of the workpiece at an elevated level under which at least a part of the workpiece is melted, and maintaining at least a part of the workpiece to be melted until the part of the workpiece is separated. | 09-11-2008 |
| 20090042392 | Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing apparatus is configured to simultaneously polish both surfaces of a work and includes a sun gear provided around a rotational axis of one of a pair of polishing surfaces, a carrier having a hole configured to house the work, and including teeth so as to serve as a planetary gear which rotates and revolves around the sun gear, and a first dustproof mechanism that includes a first elastic member that contacts one surface of the carrier opposite to one of the polishing surfaces between the sun gear and the hole in the carrier. | 02-12-2009 |
| 20090042486 | Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus. | 02-12-2009 |
| 20090042487 | Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units configured to detect rotation rates of the stools, a pressurizing unit configured to compress the work between the pair of the stools, a slurry supply unit configured to supply a slurry to the stool, and a control unit configured to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stool, and a supply amount of the slurry supplied by the slurry supply unit. | 02-12-2009 |
| 20100038560 | LASER CLEANING APPARATUS AND LASER CLEANING METHOD - A probe cleaning apparatus includes a cleaning-conditions database. The probe cleaning apparatus removes contamination from a probe by irradiating the probe by a laser beam, refers to the cleaning-conditions database based on information about the probe, such as material and shape, and controls properties of the laser beam, such as output intensity, pulse interval, wavelength, and pulse width, so that the probe cleaning apparatus removes the contamination from the probe without damaging the probe by heat. | 02-18-2010 |
| 20110073577 | ELECTRONIC COMPONENT LEAD MANUFACTURING METHOD AND MANUFACTURING DEVICE - An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer. | 03-31-2011 |
| 20110075386 | ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE - An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion. | 03-31-2011 |
| 20110133365 | Film substrate processing method and film substrate processing aparatus - A method of processing a film substrate includes removing a portion of the film substrate; and fusing a part of the film substrate around the removed portion to seal scraps of the film substrate, which are generated when removing the portion of the film substrate, in the fused part of the film substrate. | 06-09-2011 |
