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Fukumitsu, JP
Jin Fukumitsu, Tochigi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110023667 | METHOD AND DEVICE FOR BORING NON-ROUND HOLE - A non-round hole boring device capable of machining a work in a desired cross sectional shape by a simple configuration. The non-round hole boring device ( | 02-03-2011 |
Katsumi Fukumitsu, Kawasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090028580 | Optical reception apparatus and controlling method thereof - The optical reception apparatus of the invention branches into two an RZ-DQPSK optical signal input from an optical transmission path via an optical amplifier, respectively sends this to delay interferometers and photoelectric converters on a pair of arms, separately detects a number of generated errors for the signals propagating through the arms in an error-number detection circuit, obtains a difference in the respective number of generated errors in an error-number detector, and controls phase shift in the delay interferometers so that the difference is within a preset tolerance. By so doing, it is possible to realize excellent reception performance by suppressing the occurrence of the burst error. | 01-29-2009 |
| 20090257756 | Optical receiver and optical phase control method thereof - An optical receiver includes: delay interferometers respectively provided in at least two branches that branch a reception signal; a phase shift amount control device that controls a phase shift amount of the delay interferometer in accordance with an optical phase control value; a balanced optical detecting section that respectively photoelectrically converts respective branch signals output from the delay interferometers; a data regenerating section that regenerates transmission data from the photoelectrically converted branch signals output from the balanced optical detecting section; a control section that outputs the optical phase control value based on a signal of the data regenerating section; and a memory that stores therein the optical phase control value output from the control section at the time of signal communication, as a history of control values, wherein the control section refers to the history of control values during a signal communication operation to determine the optical phase control value. | 10-15-2009 |
| 20100027988 | FRAME PROCESSING APPARATUS, OPTICAL RECEIVING APPARATUS, OPTICAL TRANSCEIVING APPARATUS, OPTICAL TRANSMISSION SYSTEM, AND FRAME PROCESSING CONTROLLING METHOD - The technique for improving the efficiency in use of power resources while maintaining the received signal quality that satisfies the requirement during a system operation is disclosed. The frame processing apparatus disclosed in the present case includes: a frame processing unit which performs frame processing on an input signal in the designated error processing mode; and a controlling unit which receives the monitoring result relating to the signal quality of the input signal and performs switching control of the designation of the above error processing mode in the frame processing unit based on the received monitoring result. | 02-04-2010 |
Kenshi Fukumitsu, Shizuoka JP
| Patent application number | Description | Published |
|---|---|---|
| 20080218735 | Laser Processing Method And Device - A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. | 09-11-2008 |
| 20090166808 | LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. | 07-02-2009 |
| 20090236324 | LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM - An object to be processed | 09-24-2009 |
| 20100240159 | MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT - Starting point regions for cutting | 09-23-2010 |
Masako Fukumitsu, Kanagawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20100052142 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a first electrode and a second electrode of a semiconductor element, the first electrode and the second electrode being configured on a first surface and a second surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, the surface portion being other than regions, each of the regions connecting with the first second electrodes, each of inner electrodes being connected with the first or the second electrodes, a thickness of the inner electrode from the first surface or the second surface being the same thickness as the encapsulating material from the first surface or the second surface, respectively, outer electrodes, each of the outer electrodes being formed on the encapsulating material and connected with the inner electrode, a width of the outer electrode being at least wider than a width of the semiconductor chip, and outer plating materials, each of the outer plating materials covering five surfaces of the outer electrode other than one surface of the outer electrode being connected with the inner electrode. | 03-04-2010 |
| 20100052185 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material. | 03-04-2010 |
Masako Fukumitsu, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090209065 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS - An example of the invention is a method of manufacturing a semiconductor device including, pressing a part of the connection conductor having a plate-like shape or a belt-like shape against a lead terminal which is formed on a lead frame, is formed into a thin and long plate-like shape, and is supported only at one end in a longitudinal direction of the terminal, in such a manner that the part of the conductor is brought into contact with the lead terminal, and applying ultrasonic vibration substantially in the longitudinal direction in a plane perpendicular to the pressing direction to the connection conductor in the state where the part of the connection conductor is pressed against the lead terminal. | 08-20-2009 |