Fukumi
Fukumi Shimizu, Tachikawa JP
Patent application number | Description | Published |
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20090004779 | FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By clamping the mold in a state such that the distal ends of the movable pins are pushed against a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities in thickness of the multi-cavity boards. Accordingly, it is possible to prevent insufficient filling of resin in the cavity, the leaking of resin or defective welding, whereby the yield rate of products can be enhanced. | 01-01-2009 |
20100233857 | FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By clamping the mold in a state such that the distal ends of the movable pins are pushed against a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities in thickness of the multi-cavity boards. Accordingly, it is possible to prevent insufficient filling of resin in the cavity, the leaking of resin or defective welding, whereby the yield rate of products can be enhanced. | 09-16-2010 |
Fukumi Shimizu, Tokyo JP
Patent application number | Description | Published |
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20090160084 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A lead frame is equipped between an upper die with which a gate port and an air vent part are not formed in a cavity part | 06-25-2009 |
Fukumi Shimizu, Itami JP
Patent application number | Description | Published |
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20120009737 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - When chip-scale molding system is employed for QFP, the number of semiconductor devices available from a leadframe decreases because cavities each requires a runner portion. This problem can be overcome by employing MAP system, but use of a laminate tape increases the production cost. In through mold system, each cavity needs an ejector pin, which however makes it difficult to place a support pillar. The present application provides a manufacturing method of a semiconductor device by filling, while sandwiching a leadframe between mold dies having a matrix-state cavity group in which cavity columns obtained by linking mold cavities in series via a through gate have been placed in rows, a sealing resin in the cavities. In this method, the matrix-state cavity group has, at the cavity corner portions thereof, a support pillar having a cross-section striding over all the cavities adjacent to the cavity corner portions when viewed planarly. | 01-12-2012 |
Fukumi Usui, Kanagawa JP
Patent application number | Description | Published |
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20100199461 | PIECE FOR ATTACHING BUTTONS OR THE LIKE AND BUTTON FOR ATTACHMENT THERETO - An object of the present invention is to provide a piece for attaching buttons or the like, capable of using standard buttons and of attaching buttons which can be easily detached and which impart a usage sensation no different from standard buttons. In order to resolve the above-described problem, the present invention is a piece ( | 08-12-2010 |