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Fukaya
Hiroshi Fukaya, Hong Kong CN
| Patent application number | Description | Published |
|---|---|---|
| 20100328820 | Dimple forming apparatus and dimple forming method - A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mould with a concave surface, a heating unit and a forming pin with a spherical surface. The base mould is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly. | 12-30-2010 |
Hiroshi Fukaya, Hong Kong HK
| Patent application number | Description | Published |
|---|---|---|
| 20080237313 | SOLDERING METHOD AND APPARATUS - To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step. | 10-02-2008 |
Kazuyuki Fukaya, Clamart Cedex FR
| Patent application number | Description | Published |
|---|---|---|
| 20080244566 | METHOD FOR INSTALLING A PRINTER DRIVER ON AN END USER'S COMPUTER - The invention relates to a method for installing a driver of a target device on an end user's computer, wherein a network couples the end user's computer and target device. | 10-02-2008 |