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Fujimura, Ibaraki

Chisato Fujimura, Ibaraki JP

Patent application numberDescriptionPublished
20100068438COATING LIQUID, GAS-BARRIER MULTILAYER STRUCTURE AND GAS-BARRIER SHAPED ARTICLE THEREFROM, AND PROCESS FOR PRODUCING GAS-BARRIER MULTILAYER STRUCTURE - Gas-barrier multilayer structures and gas-barrier shaped articles are sufficiently prevented from clouding even when exposed to cold water at 30° C. or below and have excellent gas barrier properties. Processes for producing such gas-barrier multilayer structures, and coating liquids (A) of excellent coating properties that are used to produce the multilayer structures are also provided. A coating liquid (A) includes a solvent mixture of water and an organic solvent and a polycarboxylic acid polymer partially neutralized with a polyvalent metal wherein the polymer is both dissolved and dispersed as particles in the solvent mixture and wherein the particles dispersed account for 5 to 80 wt % of 100 wt % of the polycarboxylic acid polymer partially neutralized with a polyvalent metal.03-18-2010
20100136350GAS BARRIER MULTILAYER STRUCTURE PRECURSOR,GAS BARRIER MULTILAYER STRUCTURE AND PROCESSES FOR PRODUCING THE SAME - Gas barrier multilayer structure precursors are not clouded even when exposed to cold water and have excellent abuse resistance. Gas barrier multilayer structures are obtained from the gas barrier multilayer structure precursors.06-03-2010

Isao Fujimura, Ibaraki JP

Patent application numberDescriptionPublished
20080308812Ga-Containing Nitride Semiconductor Single Crystal, Production Method Thereof, and Substrate and Device Using the Crystal - A Ga-containing nitride semiconductor single crystal characterized in that (a) the maximum reflectance measured by irradiating the Ga-containing nitride semiconductor single crystal with light at a wavelength of 450 nm is 20% or less and the difference between the maximum reflectance and the minimum reflectance is within 10%, (b) the ratio of maximum value to minimum value (maximum value/minimum value) of the dislocation density measured by a cathode luminescence method is 10 or less, and/or (c) the lifetime measured by a time-resolved photoluminescence method is 95 ps or more.12-18-2008
20090026488NITRIDE SEMICONDUCTOR MATERIAL AND PRODUCTION PROCESS OF NITRIDE SEMICONDUCTOR CRYSTAL - A nitride semiconductor material comprising a semiconductor or dielectric substrate having thereon a first nitride semiconductor layer group, wherein the surface of the first nitride semiconductor layer group has an RMS of 5 nm or less, a variation of X-ray half-width within ±30%, a light reflectance of the surface of 15% or more, and a variation thereof of ±10% or less, and the thickness of said first nitride semiconductor layer group is 25 μm or more. This nitride semiconductor material is excellent in uniformity and stability, assured of a low production cost, and useful as a substrate for a nitride semiconductor-type device.01-29-2009

Tsuyoshi Fujimura, Ibaraki JP

Patent application numberDescriptionPublished
20090299225BIOSENSOR CHIP - There is provided a biosensor chip where the collecting amount necessary for the measurement is made small whereby burden of a user is reduced and, at the same time, a sample at a puncture opening is able to be easily collected and measured without an operation of making the sample collection opening nearer the puncture opening. When an end of a main body chip is pushed onto a test body, an elastic body installed at an end of the main body chip is compressed and a device for puncture is produced whereby the test body is able to be punctured. When the pushing force is made weak, the device for puncture is pulled out from the test body due to resilience of the elastic body and a sample is flown out from the puncture opening. At that time, since the puncture opening and the sample collection opening installed in the main body chip are enclosed in a tightly-closed space formed by the elastic body, even small amount of the sample is able to be easily collected by the sample collection opening without conducting the positioning of the sample collection opening.12-03-2009
20100004559BIOSENSOR CARTRIDGE, METHOD OF USING BIOSENSOR CARTRIDGE, BIOSENSOR DEVICE, AND NEEDLE INTEGRAL SENSOR - A biosensor cartridge capable of making the collected amount of a sample required for measurement into a small quantity to reduce a user's burden, and easily collecting and measuring a sample of a puncture hole without requiring the operation of bringing a sample collection opening close to the puncture hole is provided. When one end portion of biosensor chip is pushed against subject, elastic body is compressed, and puncturing tool can protrude and perform puncturing. Additionally, if a pushing force is weakened, puncturing tool is extracted from subject by the restoring force of elastic body, and blood (sample) flows out of the puncture hole. In this case, since the puncture hole, and sample collection opening provided at biosensor chip are contained in enclosed half-open space formed by elastic body, even a small amount of blood (sample) can also be easily collected. Additionally, elastic body is formed with a groove which forms a ventilation passage, so that enclosed half-open space can be opened to the atmosphere.01-07-2010
20100069792BIOSENSOR CARTRIDGE, BIOSENSOR DEVICE, SAMPLE COLLECTING METHOD, MANUFACTURING METHOD OF BIOSENSOR CARTRIDGE, AND NEEDLE INTEGRAL SENSOR - A biosensor cartridge capable of performing puncturing in an exact position, and easily collecting and measuring a sample of a puncture hole without requiring the operation of bringing a sample collection opening close to the puncture hole is provided. When tip portion 03-18-2010
20100228149SENSOR DEVICE - A sensor device has a needle-integrated type sensor element which is detachably mounted therein and which has a sensor chip, a lancet needle fixed to an end portion of the sensor chip, and a flow path forming element provided compressibly and restorably at the end portion of the sensor chip, to which the lancet needle is fixed. The sensor device includes a puncture mechanism (a drive spring) configured to cause the sensor element to puncture a target, and a pressing mechanism (a pressure spring) configured to urge the sensor element to the extent that the sensor element is prevented from being detached from the target by a restoring force of the flow path forming element after the target is punctured.09-09-2010