Patent application number | Description | Published |
20090008769 | SEMICONDUCTOR MODULE - A semiconductor module is disclosed. One embodiment provides a first electrically conductive carrier composed of a first material, a second electrically conductive carrier composed of the first material, an electrically insulating element composed of a second material, which connects the first carrier and the second carrier to one another, a first semiconductor substrate applied to the first carrier, a second semiconductor substrate applied to the second carrier, and an electrically conductive layer applied above the first carrier, the second carrier and the insulating element. The electrically conductive layer electrically conductively connects the first semiconductor substrate to the second semiconductor substrate. | 01-08-2009 |
20100084768 | ELECTRONIC COMPONENT, A SEMICONDUCTOR WAFER AND A METHOD FOR PRODUCING AN ELECTRONIC COMPONENT - An electronic component includes a semiconductor substrate defined by a generally planar first face, a generally planar second face and side faces extending between the generally planar second face and the generally planar first face. The semiconductor substrate has a curved contour between the generally planar second face and the side faces. | 04-08-2010 |
20110304047 | Method for Producing a Composite Material, Associated Composite Material and Associated Semiconductor Circuit Arrangements - A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first electrically conducting material particles are applied to a carrier substrate and a second electrically conducting material is galvanically deposited on a surface of the first material particles in such a way that the second material mechanically and electrically bonds the plurality of first material particles to one another. | 12-15-2011 |
20120032295 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SUCH A DEVICE - A semiconductor device and method for producing such a device is disclosed. One embodiment provides a semiconductor functional wafer having a first and second main surface. Component production processes are performed for producing a component functional region at the first main surface, wherein the component production processes produce an end state that is stable up to at least a first temperature. A carrier substrate is fitted to the first main surface. Access openings are produced to the first main surface. At least one further component production process is performed for producing patterned component functional regions at the first main surface of the functional wafer in the access openings. The end state produced in this process is stable up to a second temperature, which is less than the first temperature. | 02-09-2012 |
20120126926 | Transformer Device and Method for Manufacturing a Transformer Device - A transformer device includes a glass substrate having a first side and a second side arranged opposite the first side. A first recess is formed at the first side of the glass substrate. A second recess is formed at the second side of the glass substrate. The first and second recesses are arranged opposite to each other. A first coil is arranged in the first recess and a second coil is arranged in the second recess. | 05-24-2012 |
20130333203 | Method for Manufacturing a Transformer Device on a Glass Substrate - A method for manufacturing a transformer device includes providing a glass substrate having a first side and a second side arranged opposite the first side, forming a first recess in the glass substrate at the first side of the glass substrate, forming a second recess in the glass substrate at the second side of the glass substrate opposite to the first recess, forming a first coil in the first recess, and forming a second coil in the second recess. | 12-19-2013 |
20140054020 | METHOD FOR FABRICATING A HEAT SINK, AND A HEAT SINK - A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings. | 02-27-2014 |
20140057127 | METHOD FOR PROCESSING AT LEAST ONE CARBON FIBER, METHOD FOR FABRICATING A CARBON COPPER COMPOSITE, AND CARBON COPPER COMPOSITE - A method for processing at least one carbon fiber according to an embodiment may include: electroplating a metal layer over at least one carbon fiber, wherein the metal layer contains a metal, which forms a common phase with carbon and a common phase with copper; and annealing the at least one carbon fiber and the metal layer. A method for processing at least one carbon fiber according to another embodiment may include: electroplating a first metal layer over at least one carbon fiber, wherein the first metal layer contains a metal, which forms a common phase with carbon and a common phase with nickel; electroplating a second metal layer over the first metal layer, wherein the second metal layer contains nickel; and annealing the at least one carbon fiber, the first metal layer and the second metal layer. | 02-27-2014 |
20140131224 | SENSOR DEVICE, A METHOD AND A SENSOR TO DETERMINE A RELATIVE CONCENTRATION OF A FIRST KIND OF IONS WITH RESPECT TO A SECOND KIND OF IONS SOLUTE IN A DROP OF LIQUID - A sensor device according to an embodiment includes a semiconductor substrate including a plurality of channels, the channels connecting a cavity and a measurement electrode, and a counter electrode arranged to be in contact with the cavity, wherein the cavity, the measurement electrode and the counter electrode are arranged to accommodate a drop of a liquid and to allow a voltage to be applied to the drop of liquid. | 05-15-2014 |
20140206163 | ELECTRONIC COMPONENT, A SEMICONDUCTOR WAFER AND A METHOD FOR PRODUCING AN ELECTRONIC COMPONENT - An electronic component includes a semiconductor substrate defined by a generally planar first face, a generally planar second face and side faces extending between the generally planar second face and the generally planar first face. The semiconductor substrate has a curved contour between the generally planar second face and the side faces. | 07-24-2014 |
20150068918 | WAFER CONTACTING DEVICE, AND ARRANGEMENT AND METHOD FOR ELECTROCHEMICAL ETCHING OF A WAFER - A wafer contacting device may include: a receiving region configured to receive a wafer; and an elastically deformable carrier disposed in the receiving region and including an electrically conductive surface region. | 03-12-2015 |