| Patent application number | Description | Published |
|---|
| 20080206519 | Component assembly - The present invention provides a possibility of mounting conventionally capped components, that saves much space. The component assembly includes at least one component having a cap, a substrate for the component and connecting means for mounting the component on the substrate and for the electrical connection of the component. The substrate has at least one recess. The component is mounted on the substrate in flip-chip technique, so that the cap is inserted into the recess and the component is connected to the substrate via connecting bumps in the edge region of the recess. | 08-28-2008 |
| 20090027861 | Enclosure including an electrical module - A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected. | 01-29-2009 |
| 20090072333 | SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY - In a sensor array having a substrate and a housing, and in a method for manufacturing a sensor array are proposed, the housing substantially completely surrounds the substrate in a first substrate area, the housing is provided in a second substrate area at least partly open via an opening, and the second substrate area is provided protruding from the housing in the area of the opening. | 03-19-2009 |
| 20090194860 | Chip Housing Having Reduced Induced Vibration - A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure. | 08-06-2009 |
| 20100001432 | APPARATUS FOR PASSIVATING A COMPONENT AND METHOD FOR PRODUCING THE APPARATUS - An apparatus for passivating a component in a housing, the component including a substrate; the housing completely surrounding the substrate in a first substrate region; the housing being provided opened in a second substrate region, using an opening; the diepad completely surrounding the substrate in a plane parallel to the principal plane of extension of the substrate. | 01-07-2010 |
| 20100107769 | SENSOR MODULE AND METHOD FOR PRODUCING A SENSOR MODULE - A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element. | 05-06-2010 |
| 20100252939 | CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE - A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing. | 10-07-2010 |
| 20100283147 | METHOD FOR PRODUCING A PLURALITY OF CHIPS AND A CHIP PRODUCED ACCORDINGLY - A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated. | 11-11-2010 |
| 20110151620 | METHOD FOR MANUFACTURING CHIPS - A method for manufacturing chips ( | 06-23-2011 |
