| Patent application number | Description | Published |
|---|
| 20080272479 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DEVICE CAVITY - An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation. | 11-06-2008 |
| 20080315411 | INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING - An integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system. | 12-25-2008 |
| 20100123227 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof; molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, includes having the contact pads exposed; and forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface. | 05-20-2010 |
| 20100123230 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a first terminal having a cavity; mounting a first integrated circuit over the first terminal and connected in the cavity; forming a second terminal adjacent to the first terminal; connecting a second integrated circuit, over the first integrated circuit, and the second terminal; and forming a first encapsulation over the first integrated circuit with the first terminal exposed. | 05-20-2010 |
| 20100314731 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire bonding a die to the outer lead and the inner lead; encapsulating the die and portions of the outer lead and the inner lead; removing the peel strip to expose a bottom surface of the inner lead; and removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead. | 12-16-2010 |
| 20100320591 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: attaching contact pads to a base structure; connecting a base die to the base structure; connecting a supporting die over the base die by conductive balls to the contact pads on two sides of the base die; encapsulating the contact pads, the base die, the supporting die, and the conductive balls; and removing the base structure. | 12-23-2010 |
| 20110012270 | INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system. | 01-20-2011 |
| 20110140261 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway. | 06-16-2011 |
| 20110147899 | INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING - A method of manufacturing an integrated circuit packaging system includes: providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour; forming a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa; mounting a first device adjacent to the inner lead; connecting a second device to the mesa; and forming an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device. | 06-23-2011 |
