| Patent application number | Description | Published |
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| 20080203633 | Linear filament compression and torsion spring - A spring including a wire having an elasticity by which the wire is compressible by an external force to a first position at which first and second ends thereof of are separated by a first distance and when the force is removed or an electrical current applied, the wire is extensible in response to an internal spring force to a second position at which the wire is substantially straight. A spring assembly is disclosed including a plurality of inventive wires cross-coupled with a support structure consisting of a plurality of coaxial rings. In the assembly, the wires extend parallel to an axis through a center of the rings. | 08-28-2008 |
| 20090314890 | COLLAPSIBLE SHAPE MEMORY ALLOY (SMA) NOSE CONES FOR AIR VEHICLES, METHOD OF MANUFACTURE AND USE - A nose cone formed from a shape memory alloy (SMA) having a recoverable strain of at least 2% collapses about the dome for storage, deploys at launch to protect the sensor dome and reduce drag during atmospheric flight and is shed to allow sensing for terminal maneuvers. The SMA is shape-set at elevated temperatures in its Austenite phase with a memorized shape having a radius of curvature greater than that of the sensor dome to reduce aerodynamic drag. The temperature is reduced and the SMA collapsed to conform to the curvature of the sensor dome within the recoverable strain for storage. A first mechanism is configured to return the collapsed SMA to its memorized shape at launch or prior to going supersonic. In one embodiment, the SMA is stored below its Martensite finish temperature in a temperature-induced Martensite phase in which case the mechanism heats the SMA above the Austenite finish temperature to return the material to its memorized shape. In another embodiment, the SMA is stored above its Austenite finish temperature in which case collapsing the SMA places the material in a strain-induced Martensite phase. The mechanism holds the collapsed SMA in place and the releases the stored energy allowing the SMA to return to the memorized shape. | 12-24-2009 |
| 20100128244 | GIMBALED SYSTEM WITH OPTICAL COUDE PATH AND METHOD TRANSFERRING DATA - Embodiments of a gimbaled system with an optical coudé path and method for transferring data are generally described herein. In some embodiments, the gimbaled system includes optical coudé path to provide a data communication path with a gimbaled payload, an on-gimbal communication laser to transmit modulated camera data via the coudé path, and an off-gimbal communication detector to detect the camera data received via the coudé path. In some embodiments, the optical coudé path may include at least two mirrors to provide a bi-directional communication path through an azimuth axis and an elevation axis of the gimbaled payload. | 05-27-2010 |
| 20100139264 | SHAPE MEMORY ALLOY SEPARATING APPARATUSES - Embodiments of separating apparatuses are generally described herein. Other embodiments may be described and claimed. In an embodiment, a separating apparatus is provided that comprises a pre-strained member formed from a shape memory alloy that is configured to separate upon application of heat. | 06-10-2010 |
| 20110163487 | LINEAR FILAMENT COMPRESSION AND TORSION SPRING - A spring including a wire having an elasticity by which the wire is compressible by an external force to a first position at which first and second ends thereof of are separated by a first distance and when the force is removed or an electrical current applied, the wire is extensible in response to an internal spring force to a second position at which the wire is substantially straight. A spring assembly is disclosed including a plurality of inventive wires cross-coupled with a support structure consisting of a plurality of coaxial rings. In the assembly, the wires extend parallel to an axis through a center of the rings. | 07-07-2011 |
| 20110232278 | SHAPE MEMORY STORED ENERGY ASSEMBLIES AND METHODS FOR USING THE SAME - A shape memory stored energy assembly includes a projectile housing having a projectile lumen. A projectile is within the projectile lumen and the projectile is movable relative to the projectile housing. A shape memory actuator is coupled between the projectile anchored end and the projectile housing. The shape memory actuator is configured to transition from a strained energy stored configuration to a fractured kinetic delivery configuration at a specified temperature range to propel the projectile through the projectile lumen. A method includes storing energy in a shape memory actuator coupled with a projectile. The stored energy in the shape memory actuator is released and propels the projectile. Releasing the stored energy includes heating the shape memory actuator, tensioning the shape memory actuator, and fracturing the tensioned shape memory actuator at a fracture locus to propel the projectile away from the fracture locus. | 09-29-2011 |
| 20110232562 | SHAPE MEMORY THERMAL SENSORS - Embodiments of separating apparatuses are generally described herein. Other embodiments may be described and claimed. In one embodiment, a thermal sensor assembly includes a shape memory substrate anchored within an isolation housing and braced between first and second anchors. The shape memory substrate is configured to transition from the strained configuration to the fractured configuration at a specified temperature range, and the first substrate end fractures from the second substrate end at the specified temperature. In another embodiment, a fracture indicator is coupled with the shape memory substrate, and the fracture indicator is configured to indicate the fractured configuration corresponding to meeting or exceeding of the specified temperature. In one example, the specified temperature range includes a range of temperatures or a single temperature. | 09-29-2011 |
| 20110234362 | SHAPE MEMORY CIRCUIT BREAKERS - A shape memory circuit breaker includes a shape memory substrate having first and second opposed substrate ends. The shape memory substrate is configured to transition from a strained conductive configuration to a fractured non-conductive configuration. An isolation housing is coupled with the shape memory substrate. The isolation housing includes first and second anchors coupled near the first and second substrate ends. A brace extends between the first and second anchors, and the brace statically positions the first and second anchors and the respective first and second substrate ends. The shape memory substrate is configured to transition from the strained conductive configuration to the fractured non-conductive configuration at or above a specified temperature range corresponding to a specified overload current range or voltage range, and the first substrate end fractures from the second substrate end at or above the specified temperature range resulting in an open circuit. | 09-29-2011 |
