| Patent application number | Description | Published |
|---|
| 20080311751 | Method for Etching a Layer on a Substrate - A method for etching a layer that is to be removed on a substrate, in which a Si | 12-18-2008 |
| 20090026561 | Micromechanical component and corresponding method for its manufacture - A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method. | 01-29-2009 |
| 20090171524 | Method and Device for Controlling a Drive Unit of a Vehicle - A method and a device for controlling a drive unit of a vehicle are provided in which, starting from the comparison of a first acceleration variable, which is calculated at least from the operating state of the drive unit, and a second acceleration variable, an error is detected. The second acceleration variable includes a first component, in the direction of the vehicle longitudinal axis, and a second component, perpendicular to the vehicle longitudinal axis. | 07-02-2009 |
| 20090200262 | Method for Producing Porous Microneedles and their Use - A method for producing porous microneedles ( | 08-13-2009 |
| 20090210111 | Method for Detecting the State of a Tire - A method for detecting the state of a vehicle tire and/or a roadway, in which at least one sensor, in particular an acceleration sensor, disposed in the tire interior generates a signal that is assigned to physical variables of the vehicle tire and/or the roadway. A tire state and/or characteristics of the roadway are/is determined on the basis of the signal. | 08-20-2009 |
| 20090236610 | Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure - A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided. | 09-24-2009 |
| 20100007246 | Bending transducer device for generating electrical energy from deformations and circuit module - A bending transducer device for generating electrical energy includes at least one elastically deformable support structure, one piezoelectric element, and a bearing device. The piezoelectric element is configured and situated on the support structure in such a way that the piezoelectric element is deformable due to a deformation of the support structure caused by vibration, and the support structure is supported vibration-capably in at least one bearing of the bearing device, the bearing being configured as an articulated receptacle, e.g., a hinge. | 01-14-2010 |
| 20100009077 | Method for Treating a Material Having Nanoscale Pores - A method and a device for treating a material having nanoscale pores), especially implant material for the treatment of living cells, as provided. The method distinguished in that the surface tension of a substance ( | 01-14-2010 |
| 20100033060 | BENDING TRANSDUCER FOR GENERATING ELECTRICAL ENERGY FROM MECHANICAL DEFORMATIONS - A bending transducer device for generating electrical energy from deformations, and a circuit module which has such a bending transducer. The bending transducer includes at least one electrically deformable, vibration-capable, electrically conductive support structure, one piezoelectric element and a first contacting element, the conductive support structure having a first restraining area and a second restraining area for restraining the support structure, the piezoelectric element being designed and situated on the support structure in such a way that the piezoelectric element is deformable due to the deformation of the support structure caused by vibrations, and a first electrode for picking up the voltage generated by the deformation of the piezoelectric element is formed and contacted by the support structure, the first contacting element being connected electrically conductively to the support structure outside the first restraining area and the second restraining area. | 02-11-2010 |
| 20100035068 | Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type - A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material. | 02-11-2010 |
| 20100127339 | MICROMECHANICAL COMPONENT HAVING AN ANTI-ADHESIVE LAYER - A micromechanical component, having a substrate and a functional element, the functional element having a functional surface which has an anti-adhesion layer, that has been applied at least in regions, for reducing the surface adhesion forces, and in which the anti-adhesion layer is stable to a temperature of more than 800° C. | 05-27-2010 |
| 20100203739 | METHOD FOR ETCHING A LAYER ON A SILICON SEMICONDUCTOR SUBSTRATE - A method for selective etching of an SiGe mixed semiconductor layer on a silicon semiconductor substrate by dry chemical etching of the SiGe mixed semiconductor layer with the aid of an etching gas selected from the group including ClF | 08-12-2010 |
| 20110012248 | Method for producing a capping wafer for a sensor - A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material. | 01-20-2011 |
| 20110034873 | METHOD FOR MANUFACTURING A MICROPUMP AND MICROPUMP - A method for manufacturing a micropump, which may be for the metered delivery of insulin, multiple layers being situated on the front side of a first carrier layer, which has a front side and a rear side, and microfluidic functional elements being formed by structuring at least one of the layers. It is provided that the structuring of the at least one layer for manufacturing all microfluidic functional elements is exclusively performed by front side structuring. Furthermore, a micropump is disclosed. | 02-10-2011 |
| 20110137254 | Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite - A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips. | 06-09-2011 |
| 20110163398 | METHOD FOR MANUFACTURING SEPARATED MICROMECHANICAL COMPONENTS SITUATED ON A SILICON SUBSTRATE AND COMPONENTS MANUFACTURED THEREFROM - A method for manufacturing separated micromechanical components situated on a silicon substrate includes the following steps of a) providing separation trenches on the substrate via an anisotropic plasma deep etching method, b) irradiating the area of the silicon substrate which forms the base of the separation trenches using laser light, the silicon substrate being converted from a crystalline state into an at least partially amorphous state by the irradiation in this area, and c) inducing mechanical stresses in the substrate. In one specific embodiment, cavities are etched simultaneously with the etching of the separation trenches. The etching depths can be controlled via the RIE lag effect. | 07-07-2011 |
