Patent application number | Description | Published |
20110026882 | LENSED OPTICAL CONNECTOR WITH PASSIVE ALIGNMENT FEATURES - A simply constructed and economical optical connector, wherein a fiber ribbon or waveguide ribbon cable incorporates a plurality of projecting fiber or waveguide ends adapted to engage into a guiding feature in a structure that incorporates an array of microlenses, upon said structure being aligned with and attached to a ferrule housing the ribbon cable. The guiding feature enables apertures in the ferrule within which the projecting fiber or waveguide ends are guides towards engagement with guiding feature in the microlens containing structure, to be formed or dimensioned with relaxed tolerances relative to the fiber or waveguide ends, thereby considerable reducing manufacturing costs for the ferrule. | 02-03-2011 |
20110044367 | 3D OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board. | 02-24-2011 |
20110044369 | SILICON CARRIER OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. | 02-24-2011 |
20110108316 | AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION - A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact. | 05-12-2011 |
20120325541 | AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION - A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact. | 12-27-2012 |
20120326290 | SILICON CARRIER OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. | 12-27-2012 |
Patent application number | Description | Published |
20080285920 | COUPLING ELEMENT ALIGNMENT USING WAVEGUIDE FIDUCIALS - An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide cote fiducials to accurately position the optical element with respect to the core in an X-Y plane A method of alignment is also provided | 11-20-2008 |
20090202203 | Coupling Element Alignment Using Waveguide Fiducials - An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided. | 08-13-2009 |
20090283575 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls ale dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold ale configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 11-19-2009 |
20090302095 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 12-10-2009 |
20090302096 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 12-10-2009 |
20100173505 | Topography compensating land grid array interposer - LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography. | 07-08-2010 |
20110206379 | OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRICAL SIGNAL INTEGRITY - An apparatus and method for receiving electrical signals and transmitting optical signals includes a substrate having an electrical circuit. An electrical-to-optical module is mounted on the substrate, and the module includes an array of photodetectors communicating with the electrical circuit. The photodetectors may include VCSEL arrays or PD arrays. The module receives electrical signals from the electrical circuit and provides a plurality of corresponding light signals. An electrical transport is embedded in the substrate, and the electrical transport electrically communicates with the array of photodetectors. An optical interface provides electrical communication between an optical fiber and the electrical circuit. A heat transfer device may be positioned adjacent the photodetectors to transfer heat generated by the photodetectors. | 08-25-2011 |
20120120976 | 3D OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board. | 05-17-2012 |
20120120978 | 3D OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board. | 05-17-2012 |
20120251045 | MULTI-CORE FIBER OPTICAL COUPLING ELEMENTS - An optical coupling system includes a first unit including a source of light or a first multi-core optical fiber, each of the source and the first multi-core optical fiber including at least a first aperture, a second unit including a second multi-core optical fiber including at least a second aperture corresponding to the first aperture of the first unit, and a lens array unit redirecting light between the first unit and the second unit, the lens array unit substantially matching light rays transmitted or received between the first aperture of the first unit and the corresponding second aperture of the second unit. | 10-04-2012 |
20130044979 | METHOD TO REORDER (SHUFFLE) OPTICAL CABLE WAVEGUIDE LAYERS - An optical cable including connectors includes a plurality of waveguide layers each including a plurality of optical channels each having a first end and a second end. First and second connectors each include a plurality of electrically conductive pins, and each of the plurality of optical channels of each of the waveguides, at their first and second ends, are connected to a specified pin on each of the first and second connectors, respectively. A first optical channel connection pattern on the first connector, and a second optical channel connection pattern on the second connector. The first optical channel connection pattern on the first connector is a different pattern than the second optical channel connection pattern on the second connector in relation to a connection hole pattern which is the same for both the first and second connectors. | 02-21-2013 |
20130182998 | SILICON PHOTONIC CHIP OPTICAL COUPLING STRUCTURES - A silicon photonic chip is provided. An active silicon layer that includes a photonic device is on a front side of the silicon photonic chip. A silicon substrate that includes an etched backside cavity is on a backside of the silicon photonic chip. A microlens is integrated into the etched backside cavity. A buried oxide layer is located between the active silicon layer and the silicon substrate. The buried oxide layer is an etch stop for the etched backside cavity. | 07-18-2013 |
20140016899 | METHOD TO REORDER (SHUFFLE) OPTICAL CABLE WAVEGUIDE LAYERS - A method of manufacturing an optical cable including plural waveguides each including plural optical channels and each of the waveguides and the optical channels having a first end and a second end. A central portion of each of the waveguides is displaced along a central longitudinal axis of the waveguides which traverses a central bifurcation line of the first and second connectors. A first optical channel connection pattern is formed on the first connector by the first ends of the optical channels of the waveguides connected thereto; and a second optical channel connection pattern formed on the second connector by the second ends of the optical channels of the waveguides connect to the second connector. The first optical channel connection pattern is a different pattern than the second optical channel connection pattern in relation to a connection hole pattern which is the same for both the first and second connectors. | 01-16-2014 |
20140253539 | SYSTEMS AND METHODS FOR DISPLAYING IMAGES - Systems and methods for displaying at least one image on an active display include a graphics generator for generating one or more graphics in form of at least one ghost image and a projector for projecting the generated at least one ghost image as an excitation light signal on the active display. The projector is a low power projector. Also included are number of detection diodes associated with pixels for detecting one or more excitation light signals for exciting each pixel associated with the detection diodes. Further included, is a photon detection circuit for generating at least one high power image photon based on the emitted light signal of each pixel on the active display and a number of light emitting diodes (LEDs) associated with each of the detection diodes for generating an emitted light signal for each of the pixels of the incident ghost image for generating an image on the active display. | 09-11-2014 |
20140304971 | GRATING EDGE COUPLER AND METHOD OF FORMING SAME - An apparatus for optical coupling comprises a substrate, a first waveguide formed on the substrate and includes a grating structure directing light in a first direction, and a second waveguide formed on the first waveguide and including an angled portion directing the light in a second direction different from the first direction. | 10-16-2014 |
20140308004 | GRATING EDGE COUPLER AND METHOD OF FORMING SAME - An apparatus for optical coupling comprises a substrate, a first waveguide formed on the substrate and includes a grating structure directing light in a first direction, and a second waveguide formed on the first waveguide and including an angled portion directing the light in a second direction different from the first direction. | 10-16-2014 |
20150030047 | III-V LASERS WITH INTEGRATED SILICON PHOTONIC CIRCUITS - III-V lasers integrated with silicon photonic circuits and methods for making the same include a three-layer semiconductor stack formed from III-V semiconductors on a substrate, where a middle layer has a lower bandgap than a top layer and a bottom layer; a mirror region monolithically formed at a first end of the stack, configured to reflect emitted light in the direction of the stack; and a waveguide region monolithically formed at a second end of the stack, configured to transmit emitted light. | 01-29-2015 |