| Patent application number | Description | Published |
|---|
| 20080211087 | CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE - A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered. | 09-04-2008 |
| 20080283618 | Contactless Transmission System and Method for Producing the Same - A contactless transmission system comprises a carrier substrate, an antenna on the carrier substrate, a semiconductor chip and a connecting means on the carrier substrate. In this case, the antenna and the semiconductor chip are fitted to the connecting means such that an electric current flow can take place between the antenna and the semiconductor chip. | 11-20-2008 |
| 20090218667 | SMART CARDS AND METHODS FOR PRODUCING A SMART CARD - The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly composed of polycarbonate. The third layer is arranged between the first and the second layer and is composed of a material having a melting point of T | 09-03-2009 |
| 20100038432 | Transponder Inlay for a Document for Personal Identification and a Method for Producing a Transponder Inlay - A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an antenna, a covering layer, an adhesive layer, wherein the adhesive layer is arranged between the transponder substrate and the covering layer, wherein the transponder substrate has a cutout and the adhesive layer extends at least partly into the cutout. | 02-18-2010 |
| 20100084474 | DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A DOCUMENT FOR PERSONAL IDENTIFICATION - A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module. | 04-08-2010 |
| 20100248475 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device is disclosed. In one embodiment, the method includes providing at least one semiconductor chip including an electrically conductive layer. A voltage is applied to an electrode. The electrode is moved over the electrically conductive layer for growing a metal layer onto the electrically conductive layer. | 09-30-2010 |
| 20110003440 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a substrate. A foil is held over the chip and the carrier or the substrate. A laser beam is directed onto the foil, and substance at the foil is ablated and deposited on the chip and the carrier or on the substrate. | 01-06-2011 |
| 20110108629 | SMART CARD MODULE WITH FLIP-CHIP-MOUNTED SEMICONDUCTOR CHIP - A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer. | 05-12-2011 |
