| 20080205012 | CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE - A chip card module including a substrate and also conductor patterns, which are applied on at least one side of the substrate without any adhesive. A chip is arranged on one side of the substrate and connected in an electrically conducting manner to the conductor patterns. A mold cap encapsulates at least part of the chip and of the conductor patterns. The method of producing such a chip card module includes providing a substrate, applying conductor patterns to at least one side of the substrate without any adhesive, mounting a chip on one side of the substrate, connecting the chip to the conductor patterns, and applying a molding compound on the substrate, so that at least part of the chip and of the conductor patterns is covered. | 08-28-2008 |
