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Frank-Michael

Frank Michael Bohnen, Brunsbuttel DE

Patent application numberDescriptionPublished
20080305333Boehmitic Aluminas and High-Temperature Stable, High-Porosity, Pure-Phase Aluminium Oxides Obtained Therefrom - This invention relates to crystalline boehmitic aluminas the crystallites of which exhibit unusual dimensional differences in the space directions 020 and 120. This invention further relates to a method for preparing such aluminas and the follow-up products obtained therefrom by calcination.12-11-2008

Frank Michael Braun, Grundau DE

Patent application numberDescriptionPublished
20120091301MOUNTING SYSTEMS - Drywall mounting systems for accessories are shown and described. In one example, In one example, a system includes an accessory adapter plate, a fixation plate, a drywall fastener, and a second fastener. The drywall fastener is used to secure the accessory adapter plate to the drywall. The fixation plate is then secured to the accessory adapter plate with the second fastener, which, inter alia, prevents the rotation of the AAP. Accessories can then be quickly and securely attached to the AAP.04-19-2012

Frank Michael Muenker, Utrecht NL

Patent application numberDescriptionPublished
20080249516Device for creating openings in pressurized vessels with deformable walls - The catheter (10-09-2008

Frank Michael Washko, Pacifica, CA US

Patent application numberDescriptionPublished
20090250035Hydraulic Powertrain System - A hydraulic powertrain system is disclosed, in which one possible embodiment provides at least one combustion cylinder, at least one cylinder head, at least one piston. During combustion, pressure moves the piston downwards, where it creates motion in an attached hydraulic cylinder. Fluid in the hydraulic cylinder is then pressurized, where it exits the hydraulic cylinder and is directed to a fluid turbine, where work is extracted from the pressurized fluid.10-08-2009

Frank-Michael Doberschutz, Steinheid DE

Patent application numberDescriptionPublished
20100193922Semiconductor chip package - A semiconductor chip package is disclosed comprising a semiconductor chip, a lead frame comprising at least one lead, and an encapsulating layer at least partially encapsulating the semiconductor chip and the lead frame. The lead comprises a first portion defining a lead frame pad at least partially exposed at an exterior surface of the package and a second portion extending from the first portion towards the semiconductor chip electrically connecting a surface portion of the semiconductor chip to the lead frame pad. The first portion has a first thickness and the second portion comprises a thinned portion, the thinned portion having a thickness smaller than the first thickness. The lead further comprises a bent portion, and wherein the thinned portion comprises at least part of the bent portion.08-05-2010

Frank-Michael Klaukien, Ellerbek DE

Patent application numberDescriptionPublished
20100133381ATTACHMENT ARRANGEMENT FOR ATTACHING A COMPONENT TO THE FUSELAGE OF AN AIRCRAFT, AIRCRAFT AND METHOD FOR CONSTRUCTING AN ATTACHMENT ARRANGEMENT - Proposed is an attachment arrangement (06-03-2010

Frank-Michael Morgenweck, Kiel DE

Patent application numberDescriptionPublished
20080267678POWER SPLITTER FOR A MICROWAVE FUSER OF A REPRODUCTION APPARATUS - A microwave fuser device for heating printing matter in a reproduction apparatus with microwave energy from a suitable microwave source. The microwave fuser device supplies microwave energy through the bottom of a multi-channel resonator including a gap to enable transport of printing matter therethrough. The device includes a power splitter having plural channels for dividing microwave energy from the microwave source between the channels of the multi-channel resonator. The power splitter has a mechanism to provide variable geometry of its plural channels, whereby the effective width of microwave energy from the resonator of the microwave fuser device can be matched to the width of such printed matter having an image fused thereto substantially preventing undesirable high loss of energy and low yield.10-30-2008
20080267679MICROWAVE FUSER APPARATUS WITH OVERLAPING HEATER APPLICATORS - A microwave fuser apparatus, for a reproduction apparatus, the microwave fuser apparatus having at least two microwave applicators, staggered relative to a receiver member transport path with an area of overlap, for applying microwave energy to a receiver member traveling on such transport path relative to the microwave applicators to have toner images fused thereto. The microwave fuser apparatus has at least one additional microwave applicator, located adjacent to the overlapping area between the at least two staggered microwave applicators that applies microwave energy to the receiver member. The at least one additional microwave applicator effectively maintains an elevated temperature of a receiver member.10-30-2008

Frank-Michael Werner, Dresden DE

Patent application numberDescriptionPublished
20090179658PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE - A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.07-16-2009
20110316574PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE - A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.12-29-2011

Patent applications by Frank-Michael Werner, Dresden DE