| Patent application number | Description | Published |
|---|
| 20080278542 | Micro-Fluid Ejection Devices Having Reduced Input/Output Addressable Heaters - Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates. | 11-13-2008 |
| 20080299361 | Composite Ceramic Substrate For Micro-Fluid Ejection Head - A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors. | 12-04-2008 |
| 20080319845 | PRINTING INCENTIVE AND OTHER INCENTIVE METHODS AND SYSTEMS - Embodiments of the invention provide printing incentive methods and systems. In one embodiment, a method of providing advertising content to a customer can be provided. The method can include receiving information associated with a customer. In addition, the method can include receiving information associated with at least one advertiser. Furthermore, the method can include associating at least one keyword with the at least one advertiser. Moreover, the method can include comparing the at least one keyword to a portion of information associated with the customer. Further, the method can include outputting advertising content to the customer based at least in part on the comparison. | 12-25-2008 |
| 20090189954 | INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS - An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer. | 07-30-2009 |
| 20090256891 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction. | 10-15-2009 |
| 20100132874 | Composite Ceramic Substrate for Micro-Fluid Ejection Head - A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors. | 06-03-2010 |
| 20100199497 | Micro-Fluid Ejection Heads with Chips in Pockets - Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip. | 08-12-2010 |
| 20110122194 | High Volume Ink Delivery Manifold for a Page Wide Printhead - An ink manifold for supplying liquid ink to a heater chip of an inkjet printhead. Ink ports on one side of the manifold feed liquid ink to the ink channels on the other side of the manifold, and thus to the backside ink trenches of the heater chip. The placement and number of ink ports formed in the ink manifold are optimized so that when the heater chip and the ink manifold are scaled down in size, the ink carrying capacity of the printhead components is not compromised. Similarly, when the ink manifold is scaled down, the optimization process allows the seal width between the ink port features of the manifold to be maintained above a specified minimum. | 05-26-2011 |
