| Patent application number | Description | Published |
|---|
| 20100008055 | METHOD OF FABRICATING ELECTRONIC CARDS INCLUDING AT LEAST ONE PRINTED PATTERN - The invention relates to a method for fabricating electronic cards, that comprises the following steps:
| 01-14-2010 |
| 20100012731 | METHOD OF MANUFACTURING CARDS THAT EACH INCLUDE AN ELECTRONIC MODULE AND INTERMEDIATE PRODUCTS - Method of manufacturing at least one card each including an electronic module ( | 01-21-2010 |
| 20100090009 | METHOD OF MANUFACTURING CARDS COMPRISING AT LEAST ONE ELECTRONIC MODULE, ASSEMBLY PRODUCED DURING THIS METHOD AND INTERMEDIATE PRODUCTS - The assembly ( | 04-15-2010 |
| 20100102132 | CARD WITH DIGITAL DISPLAY - The invention relates to a card ( | 04-29-2010 |
| 20100177486 | Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device - A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element. The adhesive protection film prevents the appearance of undesirable residues of filling material on the external face of the device in the vicinity of the electronic element. | 07-15-2010 |
| 20100196593 | METHOD OF MANUFACTURING CARDS THAT INCLUDE AT LEAST ONE ELECTRONIC UNIT - The invention relates to a method for manufacturing boards that comprises depositing a liquid resin ( | 08-05-2010 |
| 20100258637 | BANK CARD WITH A USER ACTUATABLE SWITCH - The electronic card ( | 10-14-2010 |
| 20100258638 | BANK CARD WITH A USER ACTUATABLE SWITCH - The invention concerns an electronic card including means for transmitting a signal to a user of said electronic card, an electronic unit, an electric energy source, a switch that can be actuated by a user of the electronic card and an application introduced into said electronic unit. The card further includes means for detecting actuation of said switch, arranged so as to determine whether said actuation ends within a first time interval from the start of actuation (t | 10-14-2010 |
| 20100328914 | Placement Method of an Electronic Module on a Substrate and Device Produced by Said Method - The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps:
| 12-30-2010 |
| 20110003436 | Placement Method of an Electronic Module on a Substrate - The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a substrate, of at least one electronic assembly comprising a chip having at least one electric contact on one of its faces, said contact being intended to be electrically connected to a conductive track segment. The electronic assembly is built on a holding device which seizes and holds at least one conductive track segment previously formed and a chip. A placement device places this electronic assembly thus built at a predetermined position relative to the substrate and embeds or inserts said electronic assembly into the substrate. | 01-06-2011 |
