| Patent application number | Description | Published |
|---|
| 20090051891 | Lithographic Apparatus and Device Manufacturing Method - A system and method use a substrate with a pattern of individual, indiscrete alignment marks, i.e., the marks are separate and distinct from each other, and each mark is not divided into component parts. The pattern of marks is distributed over an area of the substrate, and the method also comprises the steps of providing a beam of radiation using an illumination system and an array of individually controllable elements to impart the beam with a pattern in its cross-section, providing a projection system to project the patterned beam onto the substrate, and providing a movement system to effect relative movement between the substrate and the projection system. A detection system, able to detect the alignment marks individually, is also provided, and the method includes using the detection system to detect the marks to determine a relative position of the substrate to the projection system, using the movement system to position the substrate relative to the projection system, and using the projection system to project the patterned beam of radiation onto a target portion of the substrate. The pattern comprises one or more rows of simple alignment marks, such as spots and short linear marks. | 02-26-2009 |
| 20090153825 | LITHOGRAPHIC APPARATUS AND METHOD - A lithographic alignment apparatus includes a radiation source arranged to generate radiation at a wavelength of 1000 nanometers or longer, and a plurality of non-imaging detectors arranged to detect the radiation after the radiation has been reflected by an alignment mark. | 06-18-2009 |
| 20090176167 | Alignment System and Alignment Marks for Use Therewith - A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal. | 07-09-2009 |
| 20090195768 | Alignment Mark and a Method of Aligning a Substrate Comprising Such an Alignment Mark - An alignment mark comprising a periodic structure formed by mark lines is described. In an embodiment, the alignment mark is formed in a scribe lane of a substrate, the scribe lane extending in a scribe lane direction. The alignment mark includes: a first area including a first periodic structure formed by first mark lines extending in a first direction, the first direction being at a first angle α with respect to the scribe lane direction: 0°<α<90° and a second area comprising second periodic structure formed by second mark lines extending in a second direction, the second direction being at a second angle β with respect to the scribe lane direction: −90°≦β<0°. | 08-06-2009 |
| 20090237637 | METHOD FOR COARSE WAFER ALIGNMENT IN A LITHOGRAPHIC APPARATUS - A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure. | 09-24-2009 |
| 20100123886 | Lithographic Apparatus and Device Manufacturing Method - A method for manufacturing a device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective exposure field; determining an absolute position of each exposure field from the alignment information for the respective exposure field; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields. | 05-20-2010 |
| 20100214550 | Alignment System and Alignment Marks for Use Therewith - A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal. | 08-26-2010 |
| 20100245792 | Alignment Measurement Arrangement, Alignment Measurement Method, Device Manufacturing Method and Lithographic Apparatus - An alignment measurement arrangement includes a source, an optical system and a detector. The source generates a radiation beam with a plurality of wavelength ranges. The optical system receives the radiation beam, produces an alignment beam, directs the alignment beam to a mark located on an object, receives alignment radiation back from the mark, and transmits the received radiation. The detector receives the alignment radiation and detects an image of the alignment mark and outputs a plurality of alignment signals, r, each associated with one of the wavelength ranges. A processor, in communication with the detector, receives the alignment signals, determines signal qualities of the alignment signals; determines aligned positions of the alignment signals, and calculates a position of the alignment mark based on the signal qualities, aligned positions, and a model relating the aligned position to the range of wavelengths and mark characteristics, including mark depth and mark asymmetry. | 09-30-2010 |
