| Patent application number | Description | Published |
|---|
| 20080308947 | Die offset die to die bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 12-18-2008 |
| 20080318364 | PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE - Methods and systems of applying a plurality of pieces of die attach film to a plurality of singulated dice are provided. The method can involve making intervals between rows and columns of a plurality of pieces of die attach film. The interval can be made by expanding an underlaid expandable film on which the plurality of pieces of die attach film are placed or by removing portions of the die attach film between rows and columns of the plurality of pieces of die attach film. The method can further involve placing a plurality of singulated dice back side down on the plurality of pieces of die attach film. | 12-25-2008 |
| 20090001599 | DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM - Systems, methods, and/or devices that facilitate stacking dies in a multi-die stack using film over wire and attaching a die to a substrate are presented. Film over wire (FOW) techniques can be employed to facilitate stacking dies that are the same or similar in size such that the wires bonded onto the lower die can be embedded in film used to attach the two dies. FOW techniques can also be employed to embed a smaller die and wires attached thereto in film underneath a larger die stacked on top of the lower die such that the larger die can be supported by the film in areas where the larger die would otherwise overhang. Die attach film can be utilized to facilitate attaching a die to a substrate such that all areas between the die and substrate are filled thereby reducing or eliminating delamination. | 01-01-2009 |
| 20090091043 | Die offset die to die bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 04-09-2009 |
| 20090093084 | Die offset die to bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 04-09-2009 |
| 20090115033 | Reduction of package height in a stacked die configuration - A method and structure for reducing the size of semiconductor package is disclosed. In one example embodiment, a method for stacking dies of a semiconductor package includes forming a set of insulated bonding wires between respective bonding pads of a first semiconductor integrated circuit die and a conductive layer electrically detached from the respective bonding pads, applying an adhesive material on a top surface of the first semiconductor integrated circuit die, and securing a second semiconductor integrated circuit die one the top surface of the first semiconductor integrated circuit die with the adhesive material. | 05-07-2009 |
