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Foerstner

Dirk Foerstner, Stuttgart DE

Patent application numberDescriptionPublished
20090129430Method for Monitoring the Functionality of a Temperature Sensor - In a method for monitoring the functionality of a temperature sensor that can deliver an electrical signal as a function of the measured temperature and is disposed, in particular, in the cooling water circuit of an internal combustion engine, the persistence of the temperature sensor in the high signal range is made possible by a method encompassing the following steps: Characterizing the sensor as possibly faulty if the sensor indicates, upon engine shutdown, at least a maximum value of the cooling fluid temperature; determining a first gradient of the cooling fluid temperature, measured by the possibly faulty sensor, up to a first point in time after engine shutdown, and characterizing the sensor as fault-free if the gradient exceeds a minimum value; determining a second gradient of the cooling fluid temperature, measured by the possibly faulty sensor, between the point in time and a point in time after engine shutdown, and characterizing the sensor as fault-free if the second gradient exceeds a minimum value; determining the cooling fluid temperature measured by the possibly faulty sensor at a point in time after engine shutdown, and characterizing the sensor as fault-free if the cooling fluid temperature falls below a maximum value.05-21-2009

Patent applications by Dirk Foerstner, Stuttgart DE

Juergen A. Foerstner, Mesa, AZ US

Patent application numberDescriptionPublished
20090152698INTEGRATED MATCHING NETWORKS AND RF DEVICES THAT INCLUDE AN INTEGRATED MATCHING NETWORK - An integrated matching network includes a first die on a substrate, a second die on the substrate, and a metallization layer on the first and second dies. The second die has a capacitance, the metallization layer has an inductance, and the capacitance and inductance together provide a shunt impedance from the first die to the substrate. The integrated matching network includes a first die having a power amplifier, a second die having a capacitor, and a metal interconnect coupled to the power amplifier and the first capacitor. The metal interconnect has an inductance. The capacitor and metal interconnect form a shunt impedance.06-18-2009

Patent applications by Juergen A. Foerstner, Mesa, AZ US

Siegfried Foerstner, Herbrechtingen DE

Patent application numberDescriptionPublished
20110103076Lighting Unit for Vehicle Headlights and Vehicle Headlight - A lighting unit for vehicle headlights comprising a light-emitting diode device (05-05-2011