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Foerg

Christian Foerg, Dillishausen DE

Patent application numberDescriptionPublished
20100010132Additive for and a method of improving early resistance to driving rain of coating compositions - An additive for improving the early resistance to driving rain of physically curing coating compositions based on aqueous acrylate dispersions, which have been adjusted to an alkaline pH, is characterized by a basically adjusted aqueous bees wax emulsion containing an aqueous dispersion and at least one representative of the group comprising 1,3-dihydroxy-2,2,4-trimethylpentane and esters thereof, butyl diglycol acetate and methoxypropanol as film-forming agents, as well as optionally a pigment and optionally an ammonium acrylate as pigment disperser.01-14-2010
20100010134Additive for improving the early resistance to driving rain of coating compositions and the use thereof - An additive for improving the early resistance to driving rain of physically curing coating compositions based on an aqueous acrylate dispersions, which have been adjusted to an alkaline pH with an inorganic or organic base, which is volatile at ambient temperature, is formed of an aqueous dispersion, containing a polyethyleneimine with a number average molecular weight in the range from 50,000 to 3,000,000, at least one representative of the group comprising 1,3-dihydroxy-2,2,4-trimethylpentane and esters thereof, butyl diglycol acetate and methoxypropanol as film-forming agents and at least one representative of the group comprising the liquid acrylates and pyrogenic silica as thickening agent, as well as optionally a pigment and optionally an ammonium acrylate as pigment disperser, and the use thereof.01-14-2010
20100242252METHOD FOR FASTENING A BAND-SHAPED SEAL ON A COMPONENT - A method for fastening a band-shaped seal on a component for sealing a cable lead-through, having several holding elements, each having a fastening bracket and a holding bracket with a free end. First of all, the seal is laid around the cable, then the free end of each holding element is bent around and arranged on the edge of the seal that faces away from the surface of the structural element. Then each holding element is fixed on the structural element.09-30-2010

Patent applications by Christian Foerg, Dillishausen DE

Franz Foerg, Bad Ditzenbach DE

Patent application numberDescriptionPublished
20090097222Electrical Subassembly Comprising a Protective Sheathing - The present invention relates to an electrical assembly (04-16-2009

Michael Foerg, Freising-Sunz-Hausen DE

Patent application numberDescriptionPublished
20120043485PIEZOELECTRIC DRIVE AND MICROVALVE COMPRISING SAID DRIVE - The invention relates to a piezoelectric drive, in particular for microvalves. The drive comprises a deformation layer coupled on one side to a piezoelectric layer, which is provided with at least one pair of electrodes, made of two electrodes of opposite polarities, to provide electricity. According to the invention, both electrodes of opposite polarities of the pair of electrodes are arranged together on the side of the piezoelectric layer facing away from the deformation layer. The invention also relates to a microvalve comprising at least one valve channel and a membrane that opens or closes the valve channel, where the membrane simultaneously forms the deformation layer of such a piezoelectric drive.02-23-2012

Raimund Foerg, Straubing DE

Patent application numberDescriptionPublished
20090122460Semiconductor Device and Method for Producing the Same - A semiconductor device includes a semiconductor layer with a first electrode formed by a sintered, conductive, porous granulate and formed in or on the semiconductor layer or in or on at least one insulating layer arranged on the semiconductor layer; furthermore dielectric material covering the surface of the sintered, conductive, porous granulate, and a second electrode at least partially covering the dielectric material, wherein the dielectric material electrically insulates the second electrode from the first electrode.05-14-2009
20090325361METHOD FOR PRODUCING A SEMICONDUCTOR INCLUDING A MATERIAL LAYER - A method for producing a semiconductor including a material layer. In one embodiment a trench is produced having two opposite sidewalls and a bottom, in a semiconductor body. A foreign material layer is produced on a first one of the two sidewalls of the trench. The trench is filled by epitaxially depositing a semiconductor material onto the second one of the two sidewalls and the bottom of the trench.12-31-2009

Raimund Foerg, Straubling DE

Patent application numberDescriptionPublished
20090305510Method of Etching a Material Surface - Disclosed is a method of structuring a material surface by dry etching, so that a passivation layer soluble in a solvent forms by the dry etching on parts of the structured material surface, sealing the passivation layer with a substance soluble in the solvent, and removing the sealed passivation layer and the substance by means of the solvent.12-10-2009