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| 20090003388 | METHOD AND APPARATUS FOR SYNCHRONIZING PORTED NUMBER DATA - A method of synchronizing ported number data within a telecommunications network in which a number portability administration center has received a request from a subscriber having a directory number (DN) to port is provided. The method comprises the steps of: a Number Portability data manager sending a subscription request to the NPDB to receive future notifications about subscriber ports to/from specific Location Routing Number(s); the NPDB honoring these subscriptions when a user ports their DN. If this is the initial LRN assigned to the DN, then the NPDB derives the LRN of the code holder. If the LRN from which the subscriber ported has a subscription, then the NPDB sends a notification message to the NP data manager with which the LRN is associated indicating that the DN ported out. If the LRN to which the subscriber ported has a subscription, then the NPDB sends a notification message to the NP data manager with which the LRN is associated indicating that the DN ported in. The method further comprises receiving a notification message for the LRN at a number portability data manager, wherein: if the notification message indicates that a DN has ported in, then the number portability data manager sends a request to an ENUM (telephone number mapping) server to turn the entry for that DN on; and if the notification message indicates that a DN has ported out, then the number portability data manager sends requests to the ENUM server and to a subscriber database to turn the entry for that DN off. | 01-01-2009 |
| 20090005066 | METHOD AND APPARATUS FOR OBTAINING A ZIP CODE - An apparatus for obtaining a zip code of where a user is at the moment is provided. The apparatus comprises: a core network; an access server operatively connected to the core network providing network access for the communication device; and a zip code location database server operatively connected to the core network, wherein the zip code location database server is adapted to store zip code location information for one or more IDs in the core network. | 01-01-2009 |
| 20090070127 | Method and apparatus for network-based mobile device coordination - A system and method for network-based coordination of a plurality of devices using precise timing methods is provided. The method includes registering a device for an event that utilizes precise timing. The method continues with identifying a list of devices that will participate in the event, downloading a set of tools that enable the devices to perform the event, and initiating the event for the list of devices coordinated by precise timing. The system for network-based precision includes a timing source that provides precise timing for the devices, a subscription handler that organizes the devices and event application server that provides a list of registered subscribers and initiates the group event. The method and system disclosed may be used to coordinate mobile devices for collecting data and/or provide coordination for mobile devices to display video and play audio in a group coordinated manner. | 03-12-2009 |
| 20100130209 | Methods for facilitating user control of handoffs - To address the need to have new techniques that are able to improve handoff decision-making, the network may employ a method such as that depicted in diagram | 05-27-2010 |
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| 20100116345 | COOKING MEDIUM SYSTEMS HAVING A SINGLE FILL MANIFOLD, AND METHODS OF SUPPLYING A COOKING MEDIUM USING SUCH SYSTEMS - A system for delivering a cooking medium of a cooking apparatus includes one or more cooking vessels. The system also includes a drain manifold in fluid communication with the cooking vessel, and a fill manifold having input valves, and output valves in fluid communication with a corresponding cooking vessel. A first flow path is connected to the fill manifold. A filter container selectively is in fluid communication with the fill manifold. A filter pump is positioned between the filter container and the fill manifold and conveys a recycled cooking medium. An overflow pump selectively is in fluid communication with the fill manifold via a second flow path and a portion of the first flow path. The overflow pump conveys a new cooking medium to the fill manifold. The first flow path conveys one of the recycled cooking medium and the new cooking medium to the fill manifold. | 05-13-2010 |
| 20100192938 | Heat Transfer Tubes, Combustion Gas Eductors, And Cooking Medium Heating Systems Including Such Tubes And Eductors - A cooking medium heating system includes a cooking vessel for holding a cooking medium, at least one heat transfer tube for transferring heat generated by combustion to the cooking medium, and a combustion gas eductor for venting combustion gas exhausted from a combustion gas exhaust opening. Each heat transfer tube includes a bottom wall, a pair of side walls, a top wall, and a combustion gas entry opening and a combustion gas exhaust opening formed therein at opposite ends thereof. The tubes may include at least one heat transfer fin and a combustion gas flow separator dividing the tube into two spaces between the separator and the pair of side walls. The combustion gas eductor includes a flue including a narrower, exhaust gas receiving end disposed adjacent to the combustion gas exhaust opening, a nozzle including a nozzle inlet and a nozzle outlet, and a blower. | 08-05-2010 |
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| 20080272458 | POST LAST WIRING LEVEL INDUCTOR USING PATTERNED PLATE PROCESS - A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above the substrate; an insulative layer on and above the capping layer; a first layer of photo-imagable material on and above the insulative layer; a layer of oxide on and above the first layer of photo-imagable material; a second layer of photo-imagable material on and above the layer of oxide; an inductor; and a wire bond pad. A first portion of the inductor is in the second layer of photo-imagable material, the layer of oxide, the first layer of photo-imagable material, the insulative layer, and the capping layer. A second portion of the inductor is in only the second layer of photo-imagable material. The wire bond pad in only the first layer of photo-imagable material, the insulative layer, and the capping layer. | 11-06-2008 |
| 20080277759 | POST LAST WIRING LEVEL INDUCTOR USING PATTERNED PLATE PROCESS - A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above a top surface of the substrate; an insulative layer on and above a top surface of the capping layer; an inductor comprising a first portion in and above the insulative layer and a second portion only above the insulative layer; and a wire bond pad within the insulative layer, wherein the first portion the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer. | 11-13-2008 |
| 20080290458 | POST LAST WIRING LEVEL INDUCTOR USING PATTERNED PLATE PROCESS - A semiconductor structure. The semiconductor structure includes: a substrate having at least one metal wiring level within the substrate; an insulative layer on a surface of the substrate; an inductor within the insulative layer; and a wire bond pad within the insulative layer. The inductor and the wire bond pad are substantially co-planar. The inductor has a height greater than a height of the wire bond pad. | 11-27-2008 |
| 20080293210 | POST LAST WIRING LEVEL INDUCTOR USING PATTERNED PLATE PROCESS - A method of forming a semiconductor substrate. A substrate is provided. At least one metal wiring level is within the substrate. A first insulative layer is deposited on a surface of the substrate. A portion of a wire bond pad is formed within the first insulative layer. A second insulative layer is deposited on the first insulative layer. An iductor is within the second insulative layer using a patterned plate process. A remaining portion of the wire bond pad is formed within the second insulative layer, wherein at least a portion of the wire bond pad is substantially co-planar with the inductor. | 11-27-2008 |
| 20080293233 | POST LAST WIRING LEVEL INDUCTOR USING PATTERNED PLATE PROCESS - A method of a semiconductor device. A substrate is provided. At least one metal wiring level is within the substrate. An insulative layer is deposited on a surface of the substrate. An inductor is formed within the insulative layer using a patterned plate process. A wire bond pad is formed within the insulative layer, wherein at least a portion of the wire bond pad is substantially co-planar with the inductor. | 11-27-2008 |
