Patent application number | Description | Published |
20120038048 | STABILIZED NICKEL SILICIDE INTERCONNECTS - A method of forming nickel monosilicide is provided that includes providing a silicon-containing surface, and ion implanting carbon into the silicon-containing surface. | 02-16-2012 |
20120038056 | INTERCONNECT STRUCTURE FOR IMPROVED TIME DEPENDENT DIELECTRIC BREAKDOWN - The present disclosure provides a method of forming an interconnect to an electrical device. In one embodiment, the method of forming an interconnect includes providing a device layer on a substrate, wherein the device layer comprises at least one electrical device, an intralevel dielectric over the at least one electrical device, and a contact that is in electrical communication with the at least one electrical device. An interconnect metal layer is formed on the device layer, and a tantalum-containing etch mask is formed on a portion of the interconnect metal layer. The interconnect metal layer is etched to provide a trapezoid shaped interconnect in communication with the at least one electrical device. The trapezoid shaped interconnect has a first surface that is in contact with the device layer with a greater width than a second surface of the trapezoid shaped interconnect that is in contact with the tantalum-containing etch mask. | 02-16-2012 |
20130234260 | INTERCONNECT STRUCTURE FOR IMPROVED TIME DEPENDENT DIELECTRIC BREAKDOWN - The present disclosure provides a method of forming an interconnect to an electrical device. In one embodiment, the method of forming an interconnect includes providing a device layer on a substrate, wherein the device layer comprises at least one electrical device, an intralevel dielectric over the at least one electrical device, and a contact that is in electrical communication with the at least one electrical device. An interconnect metal layer is formed on the device layer, and a tantalum-containing etch mask is formed on a portion of the interconnect metal layer. The interconnect metal layer is etched to provide a trapezoid shaped interconnect in communication with the at least one electrical device. The trapezoid shaped interconnect has a first surface that is in contact with the device layer with a greater width than a second surface of the trapezoid shaped interconnect that is in contact with the tantalum-containing etch mask. | 09-12-2013 |
Patent application number | Description | Published |
20120261788 | SELF-ALIGNED AIRGAP INTERCONNECT STRUCTURES AND METHODS OF FABRICATION - Devices and methods for forming a self-aligned airgap interconnect structure includes etching a conductive layer to a substrate to form conductive structures with patterned gaps and filling the gaps with a sacrificial material. The sacrificial material is planarized to expose a top surface of the conductive layer. A permeable cap layer is deposited over the conductive structure and the sacrificial material. Self-aligned airgaps are formed by removing the sacrificial material through the permeable layer. | 10-18-2012 |
20120278878 | SYSTEMS AND METHODS FOR ESTABLISHING SECURE VIRTUAL PRIVATE NETWORK COMMUNICATIONS USING NON-PRIVILEGED VPN CLIENT - Systems and methods are provided for establishing secure VPN communications using processes executing in unprivileged user space. For example, systems and methods for establishing secure VPN communications implement user mode VPN clients and user mode network protocol stacks (e.g., TCP/IP stacks) that operate in user space without root access to an operating system of a computing device. | 11-01-2012 |
20130133043 | AUTHENTICATION IN VIRTUAL PRIVATE NETWORKS - Systems and methods are provided for controlling access to a network. An access request is received from a client application running on a computing device for accessing a remote network. The access request is received over a secure virtual private network connection (VPN) connection established by a user-mode VPN client running in non-privileged user space of the computing device. The access request includes contextual information for use in authenticating a user to access a remote network, wherein the contextual information includes contextual information about the client application requesting access to the remote network. An authentication process is performed using the contextual information to authenticate the user, and a secure VPN connection is established between the client application and the remote network, if the user is authenticated. | 05-23-2013 |
20140124870 | SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNING IN INTEGRATED CIRCUITS - One embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines have pitches of less than one hundred nanometers and sidewall tapers of between approximately eighty and ninety degrees. Another embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines are fabricated by providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer and sputter etching the layer of conductive metal using a methanol plasma, wherein a portion of the layer of conductive metal that remains after the sputter etching forms the one or more conductive lines. | 05-08-2014 |
20140124935 | SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNING IN INTEGRATED CIRCUITS - One embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines have line widths of less than forty nanometers. Another embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines are fabricated by providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer, performing a first sputter etch of the layer of conductive metal using a methanol plasma, and performing a second sputter etch of the layer of conductive metal using a second plasma, wherein a portion of the layer of conductive metal that remains after the second sputter etch forms the one or more conductive lines. | 05-08-2014 |
20140127906 | SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNING IN INTEGRATED CIRCUITS - Fabricating conductive lines in an integrated circuit includes providing a conductive metal in a multi-layer structure, performing a first sputter etch of the conductive metal using methanol plasma, and performing a second sputter etch of the conductive metal using a second plasma, wherein a portion of the conductive metal that remains after the second sputter etch forms the conductive lines. Alternatively, fabricating conductive lines includes providing a conductive metal as an intermediate layer in a multi-layer structure, etching the multi-layer structure to expose the conductive metal, performing a first etch of the conductive metal using methanol plasma, performing a second sputter etch of the conductive metal using a second plasma, wherein a portion of the conductive metal that remains after the second sputter etch forms the conductive lines, forming a liner that surrounds the conductive lines, and depositing a dielectric layer on the multi-layer structure. | 05-08-2014 |
20140159227 | PATTERNING TRANSITION METALS IN INTEGRATED CIRCUITS - Fabricating conductive lines in an integrated circuit includes patterning a layer of a transition metal to form the conductive lines and depositing a protective cap on at least some of the one or more conductive lines. Alternatively, fabricating conductive lines in an integrated circuit includes patterning a layer of a transition metal to form the conductive lines, wherein the conductive lines have sub-eighty nanometer pitches, and depositing a protective cap on at least some of the conductive lines, wherein the protective cap has a thickness between approximately five and fifteen nanometers. Alternatively, fabricating conductive lines in an integrated circuit includes patterning a layer of a transition metal to form the conductive lines, wherein the conductive lines have sub-eighty nanometer line widths, and depositing a protective cap on at least some of the conductive lines, wherein the protective cap has a thickness between approximately five and fifteen nanometers. | 06-12-2014 |
20140159242 | PATTERNING TRANSITION METALS IN INTEGRATED CIRCUITS - An integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the semiconductor devices, wherein the conductive lines include a transition metal and a protective cap deposited on the transition metal. Alternatively, an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the semiconductor devices and having sub-eighty nanometer pitches, wherein the conductive lines include a transition metal and a protective cap deposited on the transition metal, wherein the protective cap has a thickness between approximately five and fifteen nanometers. Alternatively, an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the semiconductor devices and having sub-eighty nanometer line widths, wherein the conductive lines include a transition metal and a protective cap deposited on the transition metal, wherein the protective cap has a thickness between approximately five and fifteen nanometers. | 06-12-2014 |
20140201813 | ENHANCING DIRECTORY SERVICE AUTHENTICATION AND AUTHORIZATION USING CONTEXTUAL INFORMATION - Systems and methods are provided for authenticating and authorizing network access requests using directory services in which the directory service authentication and authorization procedures are enhanced using contextual information. | 07-17-2014 |
20140201814 | ENHANCING DIRECTORY SERVICE AUTHENTICATION AND AUTHORIZATION USING CONTEXTUAL INFORMATION - Systems and methods are provided for authenticating and authorizing network access requests using directory services in which the directory service authentication and authorization procedures are enhanced using contextual information. | 07-17-2014 |
20140337526 | LOCATION-BASED DOMAIN NAME SYSTEM SERVICE DISCOVERY - Systems and methods are provided for location-based Domain Name System (DNS) service discovery using a central DNS server in which network resources are aggregated by geographic location (e.g., subnets) and defined using DNS service discovery records that are mapped to corresponding geographic locations. | 11-13-2014 |
20140337530 | LOCATION-BASED DOMAIN NAME SYSTEM SERVICE DISCOVERY - Systems and methods are provided for location-based Domain Name System (DNS) service discovery using a central DNS server in which network resources are aggregated by geographic location (e.g., subnets) and defined using DNS service discovery records that are mapped to corresponding geographic locations. | 11-13-2014 |
20150054122 | METHOD FOR FORMING SELF-ALIGNED AIRGAP INTERCONNECT STRUCTURES - Devices and methods for forming a self-aligned airgap interconnect structure includes etching a conductive layer to a substrate to form conductive structures with patterned gaps and filling the gaps with a sacrificial material. The sacrificial material is planarized to expose a top surface of the conductive layer. A permeable cap layer is deposited over the conductive structure and the sacrificial material, Self-aligned airgaps are formed by removing the sacrificial material through the permeable layer. | 02-26-2015 |
Patent application number | Description | Published |
20100142982 | APPARATUS, METHOD AND SYSTEM FOR FEEDFORWARD OF SHEET ELECTROSTATIC TACKING PARAMETERS TO IMAGE TRANSFER SUBSYSTEM IN IMAGE TRANSFER APPARATUS - A toner image transfer assembly has a tacking assembly, an image transfer assembly, and a media transport assembly. The tacking assembly senses critical properties of media while electrostatically tacking media to a transport device. The tacking assembly forwards data corresponding to the sensed electrical properties to the image transfer assembly so that the image transfer assembly anticipates the electrical properties of an approaching media type. | 06-10-2010 |
20140028750 | Active Biased Electrodes for Reducing Electrostatic Fields Underneath Print Heads in an Electrostatic Media Transport - Embodiments described herein are directed to a system for reducing electrostatic fields underneath print heads in a direct marking printing system. The system includes: one or more print heads for depositing ink onto a media substrate; a media transport for moving the media substrate along a media path past the one or more print heads; a conductive platen contacting the media transport belt; an electrostatic field reducer that includes an alternating current charge device positioned upstream of the one or more print heads; and one or apertures with electrically isolated biased electrodes separated by an opening that is in registration with the ink deposition areas of the one or more print heads. The media transport includes a media transport belt and, when the media is on the transport belt it has an electrostatic field, which can cause printing defects. The electrostatic field reducer and electrodes reduce the electrostatic field on the surface of the media and thereby reduce printing defects. | 01-30-2014 |
20140028769 | SYSTEM AND METHOD FOR REDUCING ELECTROSTATIC FIELDS UNDERNEATH PRINT HEADS IN AN ELECTROSTATIC MEDIA TRANSPORT - Embodiments described herein are directed to a system for reducing electrostatic fields underneath print heads in a direct marking printing system. The system includes: one or more print heads for depositing ink onto a media substrate; a media transport for moving the media substrate along a media path past the one or more print heads; a conductive platen contacting the media transport belt; and an electrostatic field reducer that includes an alternating current corona device positioned upstream of the one or more print heads. The media transport includes a media transport belt and, when the media substrate is on the transport belt it has an electrostatic field, which can cause printing defects. The electrostatic field reducer reduces the electrostatic field on the surface of the media substrate and thereby reduces printing defects. | 01-30-2014 |
20140125748 | MEDIA TACKING TO MEDIA TRANSPORT USING A MEDIA TACKING BELT - When tacking print media to a print media transport belt in a printer, a tack module having a pair of nips is employed to control charge migration in across the print media in order to tolerate lead edge curl while ensuring uniform printing. An upstream nip is formed by a first bias transfer roll and a first backup roll, and a downstream nip is formed by a second bias transfer roll and a second backup roll. The respective backup rolls are offset slightly upstream of the respective bias transfer rolls. Charge of opposite polarities is applied to the first backup roll and the second bias transfer roll to facilitate taking of the print media to the print media transport belt. | 05-08-2014 |
20140184712 | SEMI-CONDUCTIVE MEDIA TRANSPORT FOR ELECTROSTATIC TACKING OF MEDIA - A semi-conductive media transport is used with an ink jet printing system. A belt is held flat and slides across a conductive platen, causing electrostatic charges on the belt. The belt is made semi-conductive to prevent charge buildup. The belt has an effective surface resistivity between a lower limit to preclude a buildup of electrostatic charges, and an upper limit to enable electrostatic tacking of the media to the belt. The resistivity limits vary depending upon belt velocity, thickness, material, belt and media dielectric constant, and slot width. A pair of charged nip rollers tacks the media substrate to the belt. An AC corotron is disposed above the belt to establish a net neutral charge state on the media substrate and the belt. Platen slots directly below the ink jet print heads will maintain the net neutral charge state on the media substrate and the belt. | 07-03-2014 |
20140267501 | Active Biased Electrodes for Reducing Electrostatic Fields Underneath Print Heads in an Electrostatic Media Transport - Embodiments described herein are directed to a system for reducing electrostatic fields underneath print heads in a direct marking printing system. The system includes: one or more print heads for depositing ink onto a media substrate; a media transport for moving the media substrate along a media path past the one or more print heads; a conductive platen contacting the media transport belt; an electrostatic field reducer that includes an alternating current charge device positioned upstream of the one or more print heads; and one or electrically isolated biased electrodes in registration with the ink deposition areas of the one or more print heads. The media transport includes a media transport belt and, when the media is on the transport belt it has an electrostatic field, which can cause printing defects. The electrostatic field reducer and electrodes reduce the electrostatic field on the surface of the media and thereby reduce printing defects. | 09-18-2014 |
Patent application number | Description | Published |
20090202593 | Novel immunogenic compositions for the prevention and treatment of meningococcal disease - The present invention relates to | 08-13-2009 |
20090274701 | CHLAMYDIA PNEUMONIAE POLYNUCLEOTIDES AND USES THEREOF - The subject of the invention is the genomic sequence and the nucleotide sequences encoding polypeptides of | 11-05-2009 |
20090274719 | CHLAMYDIA TRACHOMATIS GENOMIC SEQUENCE AND POLYPEPTIDES, FRAGMENTS THEREOF AND USES THEREOF, IN PARTICULAR FOR THE DIAGNOSIS, PREVENTION AND TREATMENT OF INFECTION - The subject of the invention is the genomic sequence and the nucleotide sequences encoding polypeptides of | 11-05-2009 |
20110076299 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 03-31-2011 |
20120034261 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 02-09-2012 |
20120201844 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 08-09-2012 |
20120294880 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 11-22-2012 |
20120301496 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 11-29-2012 |
20120308595 | Novel Immunogenic Compositions For The Prevention And Treatment of Meningococcal Disease - The present invention relates to | 12-06-2012 |
20130259889 | NOVEL IMMUNOGENIC COMPOSITIONS FOR THE PREVENTION AND TREATMENT OF MENINGOCOCCAL DISEASE - The present invention relates to | 10-03-2013 |
20150071959 | NEISSERIA MENINGITIDIS COMPOSITIONS AND METHODS THEREOF - In one aspect, the invention relates to a composition including a first polypeptide having the sequence set forth in SEQ ID NO: 1 and a second polypeptide having the sequence set forth in SEQ ID NO: 2. In one embodiment, the composition includes about 120 μg/ml of a first polypeptide including the amino acid sequence set forth in SEQ ID NO: 1, 120 μg/ml of a second polypeptide including the amino acid sequence set forth in SEQ ID NO: 2, about 2.8 molar ratio polysorbate-80 to the first polypeptide, about 2.8 molar ratio polysorbate-80 to the second polypeptide, about 0.5 mg/ml aluminum, about 10 mM histidine, and about 150 mM sodium chloride. In one embodiment, a dose of the composition is about 0.5 ml in total volume. In one embodiment, two-doses of the composition induce a bactericidal titer against diverse heterologous subfamily A and subfamily B strains in a human. | 03-12-2015 |
Patent application number | Description | Published |
20090110875 | Low Thermal Expansion High Strength Honeycomb Cement And Method Therefor - A cement mixture suitable for use with ceramic honeycomb bodies, such as for forming an outer layer on the outer periphery of the honeycomb body, or for forming plugs in the honeycomb body. The cement mixture, when fired, preferably exhibits low coefficient of thermal expansion and high strength. The cement mixture can be applied to a green honeycomb body and simultaneously fired with the green body or can be applied to an already fired ceramic honeycomb body and then fired. Includes cement mixture comprising a plurality of inorganic components comprising talc, kaolin, alumina, silica, and aluminum hydroxide, wherein the mixture contains less than or equal to 18.0% silica and greater than or equal to 17.0% aluminum hydroxide, in percent by weight of the inorganic components. | 04-30-2009 |
20090140471 | Method Of Manufacturing A Ceramic Honeycomb Structure - A method of manufacturing a honeycomb structure is disclosed wherein a green honeycomb body having a first contour is differentially altered such that the green honeycomb body has a second contour which is wider at a first end than at a second end. In one aspect, the altering is accomplished by removing a part of the green honeycomb body, such as with a removal tool. In another aspect, the altering is accomplished by exposing different regions of the honeycomb body to different drying environments. | 06-04-2009 |
20090142544 | Honeycomb Cement With Ceramic-Forming Crystallizable Glass And Method Therefor - Disclosed are cements for ceramic honeycomb bodies. Such cements can be applied to a fired ceramic honeycomb body then fired, or can be applied to an unfired (green) honeycomb body and co-fired with the green honeycomb body. The cement can also be used to plug one or more cells in a honeycomb body, wherein the cement can be inserted into a green or a fired ceramic honeycomb body, then fired. Also disclosed are methods of manufacturing a ceramic honeycomb article with the cement. | 06-04-2009 |
20100304041 | Method For Coating Honeycomb Bodies - A ceramic coating is provided on the outer surface of a honeycomb body by applying a first layer of coating material comprising a ceramic or ceramic-forming component to the outer surface, subjecting at least part of the first layer to at least partial curing, and then adding one or more additional layers of coating material comprising a ceramic or ceramic-forming component over the previously applied and cured layer(s). | 12-02-2010 |
20140056798 | MICROWAVE ENERGY-ASSISTED, CHEMICAL ACTIVATION OF CARBON - A method for forming activated carbon comprises forming a feedstock mixture from a carbon feedstock and a chemical activating agent, and heating the feedstock mixture with microwaves in a plurality of successive heating steps to react the carbon feedstock with the chemical activating agent and form activated carbon. Step-wise heating can be used to efficiently control the microwave activation process. | 02-27-2014 |