| Patent application number | Description | Published |
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| 20080294296 | Chip overheat protection - Embodiments of the present invention are directed to systems and methods for controlling the temperature of an internal device while reducing or minimizing the involvement of the host. Thus, some of the heat monitoring and remediation work may be offloaded to the actual device itself. The device may monitor its own temperature and, in the event of high temperature, perform device specific heat reduction actions without involving the host. Furthermore, the device may, upon detecting temperature within a predefined range, alert the host of a high temperature condition in order to allow the host to perform temperature reduction measures. Also, the device may, upon detecting temperature within a predefined range, alert the host of an impending device shutdown and shut the device down. In addition, the device may periodically save its temperature into non-volatile memory in order to create a temperature log. | 11-27-2008 |
| 20090307386 | Restore PCIe Transaction ID on the Fly - Restoring retired transaction identifiers (TID) associated with Direct Memory Access (DMA) commands without waiting for all DMA traffic to terminate is disclosed. A scoreboard is used to track retired TIDs and selectively restore retired TIDs on the fly. DMA engines fetch a TID, and use it to tag every DMA request. If the request is completed, the TID can be recycled to be used to tag a subsequent request. However, if a request is not completed, the TID is retired. Retired TIDs can be restored without having to wait for DMA traffic to end. Any retired TID value may be mapped to a bit location inside a scoreboard. All processors in the system may have access to read and clear the scoreboard. Clearing the TID scoreboard may trigger a DMA engine to restore the TID mapped to that location, and the TID may be used again. | 12-10-2009 |
| Patent application number | Description | Published |
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| 20080268201 | Low OH glass for infrared applications - A fused silica glass having a composition for use in bulk IR optical applications. The fused silica glass has a OH concentration of less than 5 ppm (parts per million) by weight and an absorbance of less than about 50 ppm/cm at a wavelength of about 1.3 μm. A method of making the fused silica glass is also described. | 10-30-2008 |
| 20080287279 | Glasses having low OH, OD levels - A fused silica glass and a fused silica article having a combined concentration of at least one of OH and OD of up to about 50 ppm. The fused silica glass is formed by drying a fused silica soot blank or preform in an inert atmosphere containing a drying agent, followed by removal of residual drying agent from the dried soot blank by heating the dried soot blank in an atmosphere comprising an inert gas and of oxygen. | 11-20-2008 |
| 20090032983 | Method of Making An Optical Fiber - Microstructured optical fiber and method of making. Glass soot is deposited and then consolidated under conditions which are effective to trap a portion of the consolidation gases in the glass to thereby produce a non-periodic array of voids which may then be used to form a void containing cladding region in an optical fiber. Preferred void producing consolidation gases include nitrogen, argon, CO | 02-05-2009 |
| 20090148627 | DEUTEROXYL-DOPED SILICA GLASS, OPTICAL MEMBER AND LITHOGRAPHIC SYSTEM COMPRISING SAME AND METHOD OF MAKING SAME - What is disclosed includes OD-doped synthetic silica glass capable of being used in optical elements for use in lithography below about 300 nm. OD-doped synthetic silica glass was found to have significantly lower polarization-induced birefringence value than non-OD-doped silica glass with comparable concentration of OH. Also disclosed are processes for making OD-doped synthetic silica glasses, optical member comprising such glasses, and lithographic systems comprising such optical member. The glass is particularly suitable for immersion lithographic systems due to the exceptionally low polarization-induced birefringence values at about 193 nm. | 06-11-2009 |
| 20090203511 | SYNTHETIC SILICA GLASS OPTICAL MATERIAL HAVING HIGH RESISTANCE TO LASER INDUCED DAMAGE - Disclosed is a synthetic silica glass optical material having high resistance to optical damage by ultraviolet radiation in the ultraviolet wavelength range, particularly in the wavelength less than about 250 nm and particularly, exhibiting a low laser induced wavefront distortion; specifically a laser induced wavefront distortion, measured at 633 nm, of between about −1.0 and 1.0 nm/cm when subjected to 10 billion pulses of a laser operating at approximately 193 nm and at a fluence of approximately 70 μJ/cm | 08-13-2009 |
| 20090203512 | HALIDE FREE GLASSES HAVING LOW OH, OD CONCENTRATIONS - A fused silica glass having a refractive index homogeneity of less or equal to about 5 ppm over an aperture area of at least about 50 cm | 08-13-2009 |
| 20100162759 | HIGH PURITY FUSED SILICA WITH LOW ABSOLUTE REFRACTIVE INDEX - A fused silica glass article having a low absolute refractive index and low concentrations of hydroxyl groups, halogens, and metal having a low absolute refractive index. The glass article contains less than about 10 ppm protium-containing and deuterium-containing hydroxyl groups by weight and less than about 20 ppm halogens by weight. The silica glass article also has an absolute refractive index (ARI) less than or equal to 1.560820. In one embodiment, the ARI of the fused silica article is achieved by lowering the fictive temperature of the fused silica. A method of lowering the fictive temperature is also described. | 07-01-2010 |
