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Ferrill
Charles C. Ferrill, Littleton, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20090316927 | Sound reinforcement method and apparatus for musical instruments - A method and apparatus for sound reinforcement for musical instruments. The method and apparatus re-direct sound waves via an open-sided chamber against a curved wall panel in such a way that the sound from a musical amplifier is reflected or altered in its course from a direction in which the microphone design has reduced sensitivity to a direction of maximum sensitivity and, typically, altering the direction of the sound from off-axis to on-axis into the microphone capsule. | 12-24-2009 |
Jay F. Ferrill, Houston, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20100325730 | System and Method for Remotely Securing a Network from Unauthorized Access - This invention is an improved system and method of efficiently deploying a large scale roll out of secure networks, including a VPN, to clients with limited or non-existent technical staff. The invention allows for a person with minimal technical skills to install, and, if necessary, uninstall the solution. Through a series of automated and/or remotely-controlled steps provided through connections established from inside the site to a centralized system over an unprotected network, the site's network can be secured, updated, and/or reconfigured, and returned to its previous state if errors should occur. Furthermore, a virtual private network (VPN) can be established that allows multiple hosts on the VPN but on different local networks to have the same IP address. Additionally, without any additional hardware and as part of the installation process, the invention protects the site from unauthorized local network devices either by preventing them from passing traffic off the local network or by generating notification of their existence. | 12-23-2010 |
Mitchell G. Ferrill, Little Meadows, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20080271314 | ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS - A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts. | 11-06-2008 |
| 20090057865 | SANDWICHED ORGANIC LGA STRUCTURE - An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material. | 03-05-2009 |