Patent application number | Description | Published |
20120146205 | Multi-Chip Module (MCM) Power Quad Flat No-Lead (PQFN) Semiconductor Package Utilizing a Leadframe for Electrical Interconnections - Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost leadframes. | 06-14-2012 |
20130105958 | Compact Wirebonded Power Quad Flat No-Lead (PQFN) Package | 05-02-2013 |
20130256905 | Monolithic Power Converter Package with Through Substrate Vias - According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die. | 10-03-2013 |
20130257524 | Monolithic Power Converter Package - According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip. | 10-03-2013 |
20140061885 | Power Quad Flat No-Lead (PQFN) Package - Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost leadframes. | 03-06-2014 |
20140091449 | Power Quad Flat No-Lead (PQFN) Semiconductor Package with Leadframe Islands for Multi-Phase Power Inverter - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package. | 04-03-2014 |
20140097498 | Open Source Power Quad Flat No-Lead (PQFN) Leadframe - According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase, V-phase, and W-phase power switches situated on the PQFN leadframe. A drain of the U-phase power switch is connected to a U-phase output strip of the PQFN leadframe. A source of the U-phase power switch is connected to a U-phase current sense terminal. The U-phase output strip can substantially traverse across the PQFN leadframe. Another U-phase power switch is situated on the PQFN leadframe with a source of the another U-phase power switch connected to the U-phase output strip of the PQFN leadframe. The PQFN leadframe can include a leadframe island within the U-phase output strip. At least one wirebond may be connected to the U-phase output strip. | 04-10-2014 |
20140097531 | Power Quad Flat No-Lead (PQFN) Package in a Single Shunt Inverter Circuit - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a driver integrated circuit (IC) situated on a leadframe. The PQFN package further includes low-side U-phase, low-side V-phase, and low-side W-phase power switches situated on the leadframe. A logic ground of the leadframe is coupled to a support logic circuit of the driver IC. A power stage ground of the leadframe is coupled to sources of the low-side U-phase, low-side V-phase, and low-side W-phase power switches. The power stage ground can further be coupled to gate drivers of the driver IC. | 04-10-2014 |
20140103514 | Power Quad Flat No-Lead (PQFN) Package Having Bootstrap Diodes on a Common Integrated Circuit (IC) - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase inverter situated on a leadframe. The PQFN package further includes drivers situated on the leadframe and configured to drive the multi-phase inverter. The PQFN package also includes bootstrap diodes respectively coupled to the drivers. The bootstrap diodes are in a common integrated circuit (IC) that is situated on the leadframe. The common IC can include the drivers. The drivers can be high side drivers that are coupled to high side power switches of the multi-phase inverter. Also, the bootstrap diodes can be coupled to a supply voltage terminal of the PQFN package. Furthermore, the PQFN package can include wirebonds coupling the common IC to bootstrap supply voltage terminals of the PQFN package. | 04-17-2014 |
20140117517 | Power Quad Flat No-Lead (PQFN) Package Having Control and Driver Circuits - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase power inverter, a control circuit, and a driver circuit. The driver circuit is configured to drive the multi-phase power inverter responsive to a control signal from the control circuit. The multi-phase power inverter, the control circuit, and the driver circuit are each situated on a PQFN leadframe of the PQFN package. The control circuit and the driver circuit can be in a common integrated circuit (IC). Furthermore, the control circuit can be configured to reconstruct at least two phase currents of the multi-phase power inverter from a combined phase current. | 05-01-2014 |
20140117518 | Control and Driver Circuits on a Power Quad Flat No-Lead (PQFN) Leadframe - According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe and respectively connected to a U-phase output strip and a W-phase output pad of the PQFN leadframe. The PQFN leadframe further includes a common integrated circuit (IC) including a driver circuit and a control circuit where the common IC is connected to the U-phase output strip and to the W-phase output pad of the PQFN leadframe. The PQFN leadframe can also include a V-phase power switch situated on the PQFN leadframe where the V-phase power switch is connected to a V-phase output strip of the PQFN leadframe. | 05-01-2014 |
20140124890 | Semiconductor Package Having Multi-Phase Power Inverter with Internal Temperature Sensor - According to an exemplary implementation, a semiconductor package includes a multi-phase power inverter having power switches and situated on a leadframe of the semiconductor package. The semiconductor package further includes a temperature sensor situated on the leadframe, where the temperature sensor is configured to generate a sensed temperature of the power switches. The semiconductor package also includes a driver circuit configured to drive the power switches of the multi-phase power inverter responsive to the sensed temperature. The temperature sensor can be on a common IC with the driver circuit. Furthermore, the semiconductor package can include an over-temperature protection circuit configured to provide over-temperature protection to the multi-phase power inverter using the sensed temperature. | 05-08-2014 |
20140126256 | Semiconductor Package Having an Over-Temperature Protection Circuit Utilizing Multiple Temperature Threshold Values - According to an exemplary implementation, a semiconductor package includes a multi-phase power inverter having power switches and situated on a leadframe of the semiconductor package. The semiconductor package further includes an over-temperature protection circuit configured to reduce current through the power switches based on multiple temperature threshold values of the power switches and a sensed temperature of the power switches. The over-temperature protection circuit can be configured to enter first and second modes based on the multiple temperature threshold values and the sensed temperature, where the second mode reduces current through the power switches to a greater extent than the first mode. | 05-08-2014 |
20140127861 | Semiconductor Packages Utilizing Leadframe Panels with Grooves in Connecting Bars - According to an exemplary implementation, a method includes utilizing a leadframe panel comprising a plurality of leadframe modules, each of the plurality of leadframe modules having a leadframe pad. The leadframe panel has a plurality of bars each having a plurality of grooves, where the plurality of bars connect the plurality of leadframe modules. The method further includes attaching a device to the leadframe pad. The method also includes molding the leadframe panel while leaving a bottom of the leadframe pad exposed. Furthermore, the method includes sawing through the plurality of grooves of the plurality of bars to singulate the plurality of leadframe modules into separate packaged modules. | 05-08-2014 |
20150235932 | Compact Power Quad Flat No-Lead (PQFN) Package - Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost lead frames. | 08-20-2015 |
Patent application number | Description | Published |
20080232600 | Transaction Device with Noise Signal Encryption - A transaction device adds or injects a random noise component into signals representing (x,y) coordinate signals associated with user interface with an input screen associated with the device. The noise component can be generated by converting to analog the output of a random number generator, and then adding the noise component to the x-axis and/or y-axis component of the (x,y) coordinate signal. Alternatively the noise component can be injected into the x-axis and/or y-axis operating potential for the input screen. The result is a masking of the original (x,y) positional information. The randomly generated number is only available internal to the device. The device can use this number to de-crypt the true (x,y) signals, which signals can then be re-encrypted before transmitting from the device. | 09-25-2008 |
20080249880 | iPOS Transaction Terminal - Apparatus and methods for transaction processing. The apparatus may be a transaction terminal including a keypad, a circuit for interacting with the transaction customer and a link communicatively connecting the keypad and the customer-interaction circuit. The cashier may interact with the keypad, while the customer (and not the cashier) may interact with the customer-interaction circuit. The link may communicate a dollar amount for the transaction between the keypad and the customer-interaction circuit. Accessories for the keypad may include a check reader, a display or a receipt printer. Accessories for the customer-interaction circuit may include a smart-card reader, a magnetic-strip reader and biometric readers. The customer-interaction circuit may include a port for connection to a remote service provider. That port may be the only remote-access port in the transaction terminal. The customer-interaction circuit may include a virtual keypad, and the circuit itself maybe programmed to capture a personal identifier number by means of that virtual keypad. The customer-interaction circuit may include virtual paper, and the circuit itself may be programmed to capture a signature by means of the virtual paper. A cash register at the POS location with the transaction terminal may not be communicatively coupled to the transaction terminal. | 10-09-2008 |
20120314090 | LOCATION SPECIFIC PERSONALIZED ENTERPRISE SERVICES USING VIDEO SIGNATURE OF AN ELECTRONIC DISPLAY - Readily available mobile computing devices and electronic display signs that are associated with particular locations are used to provide enhanced location specific services to customers in a secure manner. A customer at enterprise premises can access the available services published by the enterprise by capturing information from an electronic display sign using an authentic mobile computing device application. Non-reproducible content is displayed on the electronic display signs to enable authentication of a mobile computing device application, where the mobile computing device application once authenticated acts as a trusted end point to publish the enterprise services. Hardware investment for the enterprise is reduced, and shortcomings of existing network based location specific services are overcome. | 12-13-2012 |
20130311252 | Electronic display sign and merchanise pairing - An electronic sign includes a bi-stable display portion to display primary content such as price, type of offer, etc. and another secondary display portion to display secondary content such as enterprise name, logo, eye-catching message, etc. Enterprises are enabled to adhere to their organization's color theme while conveying secondary information. Secondary content may be fixed content or may be selected from a predefined set of content. The presently described electronic sign uses a passive medium to display secondary content along with a bi-stable display for displaying primary content, resulting in an effective, low cost solution. | 11-21-2013 |
20130311275 | Electronic display signs having primary display and second display - An electronic sign includes a bi-stable display portion to display primary content such as price, type of offer, etc. and another secondary display portion to display secondary content such as enterprise name, logo, eye-catching message, etc. Enterprises are enabled to adhere to their organization's color theme while conveying secondary information. Secondary content may be fixed content or may be selected from a predefined set of content. The presently described electronic sign uses a passive medium to display secondary content along with a bi-stable display for displaying primary content, resulting in an effective, low cost solution. | 11-21-2013 |
20130311314 | Generic apparatus to provide RFID reading functionality to computing device with no built in RFID reader - A generic RFID reader is provided that can function across a large range of computing devices including mobile computing devices, without customization or with minimal customization. | 11-21-2013 |
20140009372 | FAILSAFE CONTENT PRESENTATION FOR ELECTRONIC SIGNAGE APPLICATIONS - The use of bi-stable display technology in electronic signage systems introduces non-volatile content. As a result, incorrect pricing may be displayed during times of system failure such as battery removal, electronic signage relocation, loss of network connectivity, battery exhaustion, etc. Such failures are detected, and the content is invalidated upon occurrence of a failure. | 01-09-2014 |
Patent application number | Description | Published |
20150199667 | CLOUD-BASED POINT-OF-SALE PLATFORM - Disclosed herein are apparatus, method, and system embodiments for securing a cloud-based point-of-sale device. An embodiment includes a processing module and a communication module. The processing module is configured to operate with an operating system (OS) secured against alteration and to perform one or more purchase transactions. The communication module is configured to selectively enable acceptance of data via a secure communications path. | 07-16-2015 |
20150199668 | MULTI-MODE POINT-OF-SALE DEVICE - In an embodiment, a point of sale (POS) device is provided. The POS device includes a memory and at least one processor. The processor is configured to perform an authorized set of functions established by an external management module. The authorized set of functions include purchase transaction processing of inventory identified as available to the POS device by the external management module. | 07-16-2015 |
20150199882 | MULTI-MODE POINT-OF-SALE DEVICE - Disclosed herein are system, method, and computer program product embodiments for a cloud-based point-of-sale system and a multi-function point-of-sale (POS) device. In an embodiment, the POS device includes an interactive display that switches between a first position oriented towards and for use by an operating clerk, and a second position oriented towards and for use by a customer. The POS device is able to detect the switch between the first position and the second position. A processor in the POS device outputs a first graphical user interface (GUI) on the interactive display in response to detection of the first position and a second GUI in response to detection of the second position. In an embodiment, the components of the POS device are combined together in a unified assembly. | 07-16-2015 |
20160005020 | MULTI-MODE POINT-OF-SALE DEVICE - Disclosed herein are system, method, and computer program product embodiments for a cloud-based point-of-sale system and a multi-function point-of-sale (POS) device. In an embodiment, the POS device includes an interactive display that switches between a first position oriented towards and for use by an operating clerk, and a second position oriented towards and for use by a customer. The POS device is able to detect the switch between the first position and the second position. A processor in the POS device outputs a first graphical user interface (GUI) on the interactive display in response to detection of the first position and a second GUI in response to detection of the second position. In an embodiment, the components of the POS device are combined together in a unified assembly. | 01-07-2016 |
Patent application number | Description | Published |
20080225749 | Auto-configuration of a network device - Exemplary systems and methods for auto-configuring a network device are provided. In exemplary embodiments, the network device receives network data, which is used to determine identification data for a client. A version of the client identification data is then sent to an ISP by the network device. In response, a public IP address is returned from the ISP. The network device then translates the public IP address into an internal IP address for use with the client. In some embodiments, the network device is verified by a central data center. In some embodiments, the network device may be provisioned for PSTN and/or VoIP calls. | 09-18-2008 |
20120269198 | Accelerated Routing Convergence - In an embodiment, a method comprises: determining that a session restart on a restarting node has been initiated; in response to determining that the restarting node has preserved a last acknowledged version of routing information received from a peer node, and determining that the restarting node has preserved a routing state corresponding to the last acknowledged version of routing information, transmitting to the peer node a message indicating that the last acknowledged version of routing information and the routing state have been preserved at the restarting node; wherein the method is performed by one or more computing devices. | 10-25-2012 |
20140280338 | DISTRIBUTED NETWORK ANALYTICS - In an embodiment, a method comprises receiving, at an analytics engine, from a separate analytics application, an analytics query for data that is potentially available in data streams of networked computing devices; sending, to a distributed network analytics controller, sub-queries based on the analytics query; determining distributed network analytics agents capable of executing each of the sub-queries; sending instructions to the agents to initiate the sub-queries for the data at specified locations; initiating execution of the sub-queries on data streams that are locally available at one of the networked computing devices at which the agents are running; forming summarized data streams and zero or more raw data streams at the networked computing devices having the analytics agents; sending the summarized data streams and the zero or more raw data streams to the analytics engine; wherein the method is performed by computing device(s). | 09-18-2014 |
Patent application number | Description | Published |
20120294299 | NON-ADJACENT CARRIER AGGREGATION ARCHITECTURE - A wireless communication device configured for providing carrier aggregation is described. The wireless communication device includes at least one antenna configured to receive a plurality of wireless signals. The wireless communication device also includes a first transceiver. The first transceiver includes a first downconverting circuitry. The wireless communication device further includes a second transceiver. The second transceiver includes a second downconverting circuitry. The wireless communication device also includes an inter-transceiver connection that routes a first signal from a low noise amplifier on the first transceiver to the second downconverting circuitry of the second transceiver. | 11-22-2012 |
20120327825 | SIGNAL SPLITTING CARRIER AGGREGATION RECEIVER ARCHITECTURE - A wireless communication device configured for receiving a multiple carrier signal is described. The wireless communication device includes a primary signal splitting carrier aggregation architecture. The primary signal splitting carrier aggregation architecture includes a primary antenna and a transceiver chip. The primary signal splitting carrier aggregation architecture reuses a first diversity/simultaneous hybrid dual receiver path. The wireless communication device also includes a secondary signal splitting carrier aggregation architecture. The secondary signal splitting carrier aggregation architecture includes a secondary antenna and a receiver chip. The secondary signal splitting carrier aggregation architecture reuses a second diversity/simultaneous hybrid dual receiver path. | 12-27-2012 |
20130114769 | DYNAMIC RECEIVER SWITCHING - Techniques for dynamically selecting a number of downconversion paths used in a variety of receiver, wideband receiver architectures, for example, zero-IF or low-IF. In an exemplary embodiment, a first downconversion path is configured to downconvert a signal derived from an RF signal using a first mixing frequency. A second downconversion path is further configured to downconvert a signal derived from the RF signal using a second mixing frequency distinct from the first mixing frequency. The second downconversion path may be selectively enabled or disabled based on a detected level of an interferer in the frequency spectrum. For example, if the interferer level is less than a predetermined threshold, a fewer number of downconversion paths, for example, one path, may be enabled. If the interferer level is greater than a predetermined threshold, then a greater number of downconversion paths, for example, two or more paths, may be enabled. | 05-09-2013 |
20130260699 | GENERATING TEST MEASUREMENT VALUES FOR AUTOMATIC CALIBRATION USING AN INTERNAL TESTING LOAD - A wireless communication device configured for automatic calibration is described. The wireless communication device includes a testing load. The wireless communication device also includes a transceiver chip. The wireless communication device further includes a radio frequency connector switch that couples circuitry on the transceiver chip to one of the testing load, an external load and a radiating element. | 10-03-2013 |
20130265892 | RECEIVER FOR IMBALANCED CARRIERS - Techniques for using one or multiple downconverters to receive multiple transmissions sent on multiple carriers are disclosed. In an exemplary design, an apparatus includes first and second downconverters. The first downconverter downconverts a first radio frequency (RF) signal when it is selected. The second downconverter downconverts a second RF signal when it is selected. Each of the first and second RF signals includes multiple transmissions sent on multiple carriers to a wireless device. The first downconverter is selected to perform downconversion for the multiple transmissions when at least one criterion is not met. The first and second downconverters are selected to perform downconversion for the multiple transmissions, based on different mixing frequencies, when the at least one criterion is met. The at least one criterion may relate to imbalance between the multiple carriers, received power of a received RF signal, etc. | 10-10-2013 |
20130287077 | COMBINING MULTIPLE DESIRED SIGNALS INTO A SINGLE BASEBAND SIGNAL - A transceiver for receiving multiple desired signals is described. The transceiver includes a first downconverter that receives a first received signal. The transceiver also includes a second downconverter that receives the first received signal. The transceiver further includes a first adder that receives an output of the first downconverter and a second received signal. The transceiver also includes a second adder that receives an output of the second downconverter. | 10-31-2013 |
20140171001 | RECEIVER CALIBRATION WITH LO SIGNAL FROM INACTIVE RECEIVER - Techniques for calibrating a receiver based on a local oscillator (LO) signal from another receiver are disclosed. In an exemplary design, an apparatus (e.g., a wireless device or an integrated circuit) includes first and second local oscillator (LO) generators. The first LO generator generates a first LO signal used by a first receiver for frequency downconversion. The second LO generator generates a second LO signal used by a second receiver for frequency downconversion in a first operating mode. The second LO signal is used to generate a test signal for the first receiver in a second operating mode. The second LO signal may be provided as the test signal or may be amplitude modulated with a modulating signal to generate the test signal. The test signal may be used to calibrate residual sideband (RSB), second order input intercept point (IIP2), receive path gain, etc. | 06-19-2014 |
20140220920 | RECEIVER THAT RECONFIGURES BETWEEN ZERO INTERMEDIATE FREQUENCY AND DIRECT SAMPLING BASED ON CHANNEL CONDITIONS - A wireless device for receiving wireless signals based on channel conditions is described. The wireless device includes a direct sampling path used when operating in a direct sampling mode. The wireless device also includes a zero intermediate frequency path used when operating in a normal sampling mode. The wireless device further includes a first switch coupling a filter module input to an input of the direct sampling path and an input of the zero intermediate frequency path. The wireless device also includes a second coupling a filter module output to an output of the direct sampling path and an output of the zero intermediate frequency path. The first switch and the second switch are configured to switch between the direct sampling path and the zero intermediate frequency path based on a received signal power. | 08-07-2014 |