Patent application number | Description | Published |
20130069136 | SINGLE-GATE NON-VOLATILE FLASH MEMORY CELL, MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A single-gate non-volatile flash memory cell, a memory device including the memory cell, and a manufacturing method thereof are provided. The memory cell includes a semiconductor structure and a movable switch ( | 03-21-2013 |
20130107349 | LIGHT MODULATOR PIXEL UNIT AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
20130118280 | GYROSCOPE AND METHOD FOR MANUFACTURING THE SAME - A gyroscope and a manufacturing method are provided. The gyroscope comprises: a substrate with a bottom driving electrode and a bottom measuring electrode, and a dielectric layer with a sealed cavity comprising: a central axis on the substrate; a support ring on the substrate rotatable around the central axis; a mass ring surrounding and having common central axis with the support ring; cantilevers connected with the support ring and the mass ring and suspend the mass ring in the cavity; elastic components among the support ring, the mass ring and two adjacent cantilevers; a top driving electrode overlaying the support ring, the mass ring, the cantilevers and the elastic components; a conductive plug connected with top driving electrode and bottom driving electrode on the elastic components. The mass ring comprises an insulation layer and a weight layer. Stability and performance of the gyroscope may be improved. | 05-16-2013 |
20130119822 | MEMS DEVICE AND MANUFACTURING METHOD THEREOF - A Micro-Electro-Mechanical System (MEMS) device and its manufacturing method are provided. Said device comprises a MEMS component and said component comprises a main body ( | 05-16-2013 |
20130139594 | LEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI (LTD) - An inertia MEMS sensor and a manufacturing method are provided. The inertia MEMS sensor includes a main body and a weight block relatively removable. The main body includes a first main body with a first surface and a second main body vertically connecting with the first surface. A first electrode parallel to the first surface is in the first main body. A second electrode perpendicular to the first surface is in the second main body. The weight block is suspended in a space defined by the first and second main bodies. The weight block includes a third electrode parallel to the first surface, a forth electrode is perpendicular to the first surface, and a weight layer. The third electrode connects with the forth electrode to form a U-shaped groove for accommodating the weight layer, thereby increasing the weight block weight, improving precision and reducing the cost. | 06-06-2013 |
20130155487 | LIGHT MODULATOR PIXEL UNIT AND MANUFACTURING METHOD THEREOF - A light modulator pixel unit and the manufacturing method thereof are provided. The pixel unit includes a top electrode formed on a substrate, a movable electrode and a bottom electrode. Under the control of a control circuit, the position of the movable electrode would deflect. When the movable electrode is positioned in a first position, a first light is diffracted on the top electrode; when the movable electrode is positioned in a second position, a second light is diffracted on the top electrode; when the movable electrode is positioned in a third position, a third light is diffracted on the top electrode. The said first light, second light and third light are lights of three primary colors. The light modulator pixel unit of the present invention can modulate lights of three colors and is applicable in the field of micro-display system. | 06-20-2013 |
20130221421 | STACKED-GATE NON-VOLATILE FLASH MEMORY CELL, MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A stacked-gate non-volatile flash memory cell, a memory device including the memory cell, and a manufacturing method thereof are provided. The memory cell includes a semiconductor structure and a movable switch ( | 08-29-2013 |
20130221450 | MEMS DEVICE AND METHOD OF FORMING THE SAME - A micro electro mechanical system (MEMS) device and a method of forming the same are provided. The MEMS device comprises a semiconductor substrate ( | 08-29-2013 |
20130240962 | Photosensitive Imaging Device and Method for Forming Semiconductor Device - A photosensitive imaging device and a method for forming a semiconductor device are provided. The method includes: providing a first device layer formed on a first substrate, wherein a conductive top bonding pad layer is formed on the first device layer; providing a continuous second device layer formed on a second substrate, wherein a continuous conductive adhesion layer is formed on the continuous second device layer; bonding the first device layer with the second device layer, where the top bonding pad layer on the first device layer is directly connected with the conductive continuous adhesion layer on the continuous second device layer; removing the second substrate; selectively etching the continuous second device and the continuous conductive adhesion layer to form a groove array; and filling up the groove array with an insulation material to form a plurality of second devices. Alignment accuracy may be improved. | 09-19-2013 |
20130285168 | MEMS INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME - A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor. | 10-31-2013 |
20140139727 | MICRO-ELECTRO-MECHANICAL SYSTEM BASED DEVICE FOR ADJUSTING APERTURE AND MANUFACTURING METHOD THEREOF - A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed. | 05-22-2014 |
20140139937 | MICRO-ELECTRO-MECHANICAL SYSTEM BASED FOCUSING DEVICE AND MANUFACTURING METHOD THEREOF - A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed. The device has a small size, low power consumption and low manufacturing cost. | 05-22-2014 |