Patent application number | Description | Published |
20100295600 | Method and Apparatus for Providing Through Silicon VIA (TSV) Redundancy - An apparatus includes a first die having a first bus, a second die having a second bus stacked on the first die, a plurality of through silicon vias connecting the first bus to the second bus, and first control logic for sending data to identified ones of the plurality of through silicon vias. Also, optionally, second control logic for determining a first set of the plurality of through silicon vias that are nonfunctional, wherein the second control logic is configured to send information to the first control logic identifying the first set of the plurality of through silicon vias or identifying a second set of through silicon vias that are functional. Also a method of sending signals through a plurality of through silicon vias. | 11-25-2010 |
20110035529 | Partitioning a Crossbar Interconnect in a Multi-Channel Memory System - A method includes identifying a first set of masters and a second set of masters from a plurality of masters. The plurality of masters have access to a multi-channel memory via a crossbar interconnect. The method includes partitioning the crossbar interconnect into a plurality of partitions comprising at least a first partition corresponding to the first set of masters and a second partition corresponding to the second set of masters. The method also includes allocating a first set of buffer areas within the multi-channel memory. The first set of buffer areas correspond to the first set of masters. The method further includes allocating a second set of buffer areas within the multi-channel memory. The second set of buffers correspond to the second set of masters. | 02-10-2011 |
20110050357 | Transformer Signal Coupling for Flip-Chip Integration - Methods and apparatuses for transformer signal coupling for flip-chip circuit assemblies are presented. A device for coupling dies in flip-chip circuit assembly may include a first die associated with a first fabrication process and a first inductor physically coupled to the first die, where the first inductor receives an RF input signal. The device may further include a second die associated with a second fabrication process, and a second inductor physically coupled to the second die, where the second inductor is positioned so the first inductor can inductively couple the RF signal in the second inductor. A method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. | 03-03-2011 |
20110087846 | Accessing a Multi-Channel Memory System Having Non-Uniform Page Sizes - A method includes predicting a memory access pattern of each master of a plurality of masters. The plurality of masters can access a multi-channel memory via a crossbar interconnect, where the multi-channel memory has a plurality of banks The method includes identifying a page size associated with each bank of the plurality of banks The method also includes assigning at least one bank of the plurality of banks to each master of the plurality of masters based on the memory access pattern of each master. | 04-14-2011 |
20110225333 | Interconnect Coupled to Master Device Via at Least Two Different Connections - An interconnect coupled to a master device via at least two different connections is disclosed. In a particular embodiment, a system is disclosed that includes a first interconnect and a second interconnect coupled to the first interconnect. The first interconnect is coupled to a first master device via a single connection and the first interconnect is coupled to a second master device via at least two different connections. The second interconnect is coupled to a memory via a memory controller. | 09-15-2011 |
20110258353 | Bus Arbitration Techniques to Reduce Access Latency - A method of arbitrating requests from bus masters for access to shared memory in order to reduce access latency, comprises looking ahead into currently scheduled requests to the shared memory and predicting latency of the requests based on characteristics of the currently scheduled requests, such as increasing page hit rate, or balancing read and write traffic. The requests are scheduled based at least in part on the predicted latency. | 10-20-2011 |
20110258354 | Methods of Bus Arbitration for Low Power Memory Access - Systems and method for arbitrating requests to a shared memory system for reducing power consumption of memory accesses, comprises determining power modes associated with memory channels of the shared memory system, assigning priorities to the requests based at least in part on the power modes, and scheduling the requests based on the assigned priorities. Latency characteristics and page hit rate are also considered for assigning the priorities. | 10-20-2011 |
20110320698 | Multi-Channel Multi-Port Memory - A multi-channel multi-port memory is disclosed. In a particular embodiment, the multi-channel memory includes a plurality of channels responsive to a plurality of memory controllers. The multi-channel memory may also include a first multi-port multi-bank structure accessible to a first set of the plurality of channels and a second multi-port multi-bank structure accessible to a second set of the plurality of channels. | 12-29-2011 |
20110320751 | Dynamic Interleaving Of Multi-Channel Memory - In a particular embodiment, a dynamic interleaving system changes the number of interleaving channels of a multi-channel memory based on a detected level of bandwidth requests from a plurality of master ports to a plurality of slave ports. At a low level of bandwidth requests, the number of interleaving channels is reduced. | 12-29-2011 |
20130054853 | Method and Apparatus for Load-Based Prefetch Access - A load state of a slave memory is detected and provided to a master device. The master device communicates prefetch access requests to the slave memory based, at least in part, on the detected load state. Optionally, the master device communicates prefetch requests to the slave memory according to a schedule based, at least in part, on the detected load state. | 02-28-2013 |
20130095576 | TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION - Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor. | 04-18-2013 |
20130111084 | METHODS AND DEVICES FOR SINGLE LINK AGGREGATED BUSES | 05-02-2013 |
20130205051 | Methods and Devices for Buffer Allocation - Methods and devices for buffer allocation based on priority levels are disclosed to avoid or mitigate conflicts that can degrade performance or otherwise interfere with Quality of Service (QoS) requirements in a multiple channel memory system. In one embodiment, the methods and devices disclosed herein may be used to detect various transactions that have identical priorities and the same or similar QoS requirements and then allocate buffers for different ones of the various detected transactions that are scheduled to occur in a given time interval to different independent memory channels, thereby avoiding or mitigating memory access conflicts in the given time interval. | 08-08-2013 |
20140206105 | TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION - Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor. | 07-24-2014 |