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Feng, Singapore
Bo Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110165570 | METHOD OF EFFECTING DE-DIFFERENTIATION OF A CELL - The invention provides a method of effecting de-differentiation of an at least partially differentiated cell or of maintaining pluripotency and/or self-renewing characteristics of an undifferentiated cell. The method comprises increasing the amount or the activity of an Err protein, or a functional fragment thereof, in the cell. | 07-07-2011 |
Hanhua Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100288689 | MICROFLUIDIC FILTRATION UNIT, DEVICE AND METHODS THEREOF - A microfluidic filtration unit for trapping particles of a predetermined nominal size present in a fluid is provided. The unit comprises a fluid chamber connected to an inlet for introducing the fluid to be filtered and an outlet for discharging filtered fluid, a filtration barrier arranged within the fluid chamber, said filtration barrier comprising a plurality of pillars arranged substantially perpendicular to the path of fluid flow when fluid is introduced into the fluid chamber, said pillars being aligned to form at least one row extending across said path of fluid flow, wherein each of said at least one row of pillars in the filtration barrier comprises at least one fine filtration section comprising a group of pillars that are spaced apart to prevent particles to be filtered from the fluid from moving between adjacent pillars, and at least one coarse filtration section comprising a group of pillars that are spaced apart to permit the movement of particles between adjacent pillars. | 11-18-2010 |
Han Hua Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100270174 | BIOSENSOR CELL AND BIOSENSOR ARRAY - A biosensor cell ( | 10-28-2010 |
Jiangtao Feng, Singapore CN
| Patent application number | Description | Published |
|---|---|---|
| 20100223558 | REMOTE DESKTOP CONNECTION TO ANY PRIVATE DESKTOP TO TAM E-SSO ACCESS AGENT - A method for enabling a client computer to remotely connect to any existing user desktop hosted under a window session in a host computer is provided. The method includes receiving user credentials in a first user interface of an access managing application; and inserting master credentials into a second user interface of an authentication system in response to the first user interface receiving the user credentials enabling the session to switch from the host computer to the client computer without deleting any existing user desktops in the host computer. | 09-02-2010 |
Jing Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110318237 | ULTRAVIOLET REACTOR BAFFLE DESIGN FOR ADVANCED OXIDATION PROCESS AND ULTRAVIOLET DISINFECTION - Ultraviolet reactors having an ultraviolet light source for treating a fluid are disclosed. In one embodiment, a reactor is disclosed which includes a vessel having an inlet for receiving fluid and an outlet for discharging fluid. The vessel further includes a plurality of segmented baffles. The baffles further include a partial circumferential edge section that terminates in a vertical edge section to form right and left segmented baffles. The left and right segmented baffles are arranged in an alternating pattern in the vessel to provide plug flow and enhanced radial mixing. | 12-29-2011 |
Xia Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110221041 | Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die - A plurality of semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. A portion of the encapsulant is designated as a saw street between the die, and a portion of the encapsulant is designated as a substrate edge around a perimeter of the encapsulant. The carrier is removed. A first insulating layer is formed over the die, saw street, and substrate edge. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first conductive layer and first insulating layer. The encapsulant is singulated through the first insulating layer and saw street to separate the semiconductor die. A channel or net pattern can be formed in the first insulating layer on opposing sides of the saw street, or the first insulating layer covers the entire saw street and molding area around the semiconductor die. | 09-15-2011 |
| 20110221055 | Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die - A semiconductor wafer has a plurality of first semiconductor die. A first conductive layer is formed over an active surface of the die. A first insulating layer is formed over the active surface and first conductive layer. A repassivation layer is formed over the first insulating layer and first conductive layer. A via is formed through the repassivation layer to the first conductive layer. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A second insulating layer is formed over the repassivation layer and encapsulant. A second conductive layer is formed over the repassivation layer and first conductive layer. A third insulating layer is formed over the second conductive layer and second insulating layer. An interconnect structure is formed over the second conductive layer. | 09-15-2011 |
| 20110221057 | Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation - A semiconductor wafer contains a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the semiconductor wafer. A protective layer is formed over the insulating layer including an edge of the semiconductor die along the saw street. The protective layer covers an entire surface of the semiconductor wafer. Alternatively, an opening is formed in the protective layer over the saw street. The insulating layer has a non-planar surface and the protective layer has a planar surface. The semiconductor wafer is singulated through the protective layer and saw street to separate the semiconductor die while protecting the edge of the semiconductor die. Leading with the protective layer, the semiconductor die is mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier and protective layer are removed. A build-up interconnect structure is formed over the semiconductor die and encapsulant. | 09-15-2011 |
Xiangyang Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090108052 | Selective soldering using fiber optic device - A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam. | 04-30-2009 |
| 20090127341 | Bar-code reading tool - A bar-code-reading tool. A first mirror is disposed to receive light emitted by a bar-code reader. A second mirror is disposed to receive light reflected from a bar-code label affixed to an object. The first mirror and the second mirror are arranged in a folded optical path that is disposed for the bar-code reader to read the bar-code label. A fixture holds the object comprising the bar-code label on a planar base of the fixture and disposes the bar-code label in the folded optical path. The fixture is arranged so that the object is disposed above the planar base, and the bar-code reader is disposed below the planar base. | 05-21-2009 |
| 20090300899 | SEAL ATTACH PRESS TOOL - A press tool and method for attaching a seal to a surface are described. The seal attach press tool comprises a contact member having a curved contact surface, e.g., an arced surface. In a process of attaching a seal over an opening on a surface, the curved contact surface of the contact member is rolled over and in contact with the surface of the seal, thereby facilitating bonding the seal to the surface. According to an embodiment, the curved contact surface of the contact member comprises an elastomer and/or is covered with an elastomer pad. | 12-10-2009 |
Xiang Yang Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090139655 | Adhesive seal peeling device for a hard disk drive - The present invention provides a system and method for peeling off a adhesive seal for sealing a evacuation hole in the cover of a hard disk drive without damaging the seal in the fabrication and manufacture of hard disk drives. | 06-04-2009 |
Yong Hui Dandy Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110002450 | Personalized Caller Identification - This disclosure relates to different systems and methods of indicating a caller identity, e.g. using the caller's voice. | 01-06-2011 |
Yuhua Feng, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110151586 | POLYMER ENCAPSULATED PARTICLES AS SURFACE ENHANCED RAMAN SCATTERING PROBES - The present invention refers to a Raman active composite material comprising a metal particle; a coating layer of a Raman active molecule bound to the metal particle; and an encapsulating layer of an amphiphilic polymer bound to the metal particle. The present invention also refers to methods of manufacturing a Raman active composite material described herein and their uses. | 06-23-2011 |