| Patent application number | Description | Published |
|---|
| 20080216997 | Heat plate construction and attachment for dismounting heat plate - A heat plate construction is provided, which is applicable for being fixed on a circuit board and contacting with a chip to perform a heat exchange. The heat plate construction includes a heat plate body and at least one buffer element. The heat plate body has a plurality of fixing points fixed on the circuit board and located outside the contacting region between the heat plate body and the chip. The buffer element is disposed outside the contacting region between the heat plate body and the chip, and the height of the buffer element is equal to a distance between the heat plate body and the circuit board, such that when the heat plate is dismounted, the buffer element relieves a force for the heat plate to press against the chip, so as to protect the chip from being damaged. | 09-11-2008 |
| 20090201639 | CHASSIS OF PORTABLE ELECTRONIC APPARATUS - A chassis of a portable electronic apparatus includes a heat sink assembly disposed therein and carries a keyboard on the top. The chassis has an air inlet and an air outlet on a first surface on the side opposite to the keyboard, which are respectively corresponding to an intake end and an exhaust end of the heat sink assembly. The air outlet extends from the first surface to a second surface connected to the first surface, and the second surface has an opening for disposing communication connectors, so as to adequately the heat sink assembly and the communication connectors. | 08-13-2009 |
| 20090201646 | RETAINING DEVICE - A retaining device is used to press a heat conducting plate to in contact with a heat-generating element disposed on a circuit board. The retaining device includes a bracket, a plurality of elastic members, and a plurality of fasteners. The bracket is disposed on a side surface of the circuit board while the bracket and the heat conducting plate are spaced by the circuit board. One end of the elastic members is disposed on the bracket. The fasteners pass through the heat conducting plate, the circuit board, and the bracket in sequence, so as to be fixed to the elastic members, such that the heat conducting plate is pressed by the elastic members to be continuously contact with the heat-generating element. | 08-13-2009 |
| 20090201647 | Heat dissipation device - A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance. | 08-13-2009 |
| 20090211729 | Heat sink structure - A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device. | 08-27-2009 |
| 20090211737 | HEATSINK MODULE HAVING FIN ASSEMBLY STRUCTURE CORRESPONDING TO HEAT PIPE - A heatsink module includes a fan, a fin assembly and a heat pipe. The fan generates an airflow. The heat pipe has a heat absorbing section, a curved section, and a heat dissipating section. The curved section and the heat dissipating section are disposed at a side of the fan to accept the airflow. The fin assembly includes a plurality of heat sink fins, and the heat sink fins are stacked to form a plurality of air ducts to accept the airflow. The heat sink fins each have a penetrating opening corresponding to the curved section and the heat dissipating section. The penetrating openings are combined into a penetrating channel to contact with the curved section and the heat dissipating section. | 08-27-2009 |
| 20100053892 | ELECTRONIC DEVICE AND HEAT SINK THEREOF - An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state. | 03-04-2010 |
| 20110122914 | METHOD FOR DETECTING PERFORMANCES OF HEAT DISSIPATION MODULES - A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source. | 05-26-2011 |
| 20110122915 | METHOD FOR TESTING HEAT PIPES - A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked. | 05-26-2011 |
| 20110125418 | METHOD FOR ESTIMATING FAN LIFE - A method for estimating a fan life includes the following steps. Fans to be checked at a number of M are provided. A working temperature and a test temperature of a fan are set, and the test temperature is greater than the working temperature. An acceleration factor is set, which has a fixed value. The fans are kept in an operating state at the test temperature, and a number of the damaged fans is detected and recorded at intervals of a check time, until N damaged fans are detected. A distribution of time points when the fans are damaged is simulated with a Weibull distribution model, and a shape parameter and a characteristic life of the Weibull distribution model are calculated. A life value of the fans at the test temperature is calculated. A life value of the fans at the working temperature is calculated by using the acceleration factor. | 05-26-2011 |
