| Patent application number | Description | Published |
|---|
| 20080198550 | HEAT SINK MODULE FOR DUAL HEAT SOURCES - A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements. | 08-21-2008 |
| 20090006048 | METHOD FOR SIMULATING THERMAL RESISTANCE VALUE OF THERMAL TEST DIE - A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation. | 01-01-2009 |
| 20090016020 | HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS - A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment. | 01-15-2009 |
| 20090034193 | HEAT-DISSIPATING MODULE - A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a plurality of fins, a fan and a heat pipe. The fan is adapted for generating an air current. Each fin has an edge facing the fan. The edges are located on a folded surface. The air current first passes through the folded surface and then passes by the fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the fins. | 02-05-2009 |
| 20090034195 | HEAT-DISSIPATING MODULE - A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the fan and a second edge facing the fan. The first edges are located on a first surface. The second edges are located on a second surface not coinciding with the first surface. The air current passing through the first and second surfaces passes by the fins. A first end of the heat pipe is thermally coupled to the heat-generating element. A second end of the heat pipe is thermally coupled to the fins. | 02-05-2009 |
| 20090034196 | HEAT-DISSIPATING MODULE - A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a fin module, a fan and a heat pipe. The fan is adapted for generating an air current. The fin module includes a plurality of first fins and a plurality of second fins. Each first fin includes a first edge facing the fan. The first edges are located on a first surface. Each second fin includes a second edge facing the fan. The second edges are located on a second surface not coinciding with the first surface. The air current passes through the first surface and the second surface and then passes by the first fins and the second fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the first fins and the second fins. | 02-05-2009 |
| 20090056925 | HEAT DISSIPATION MODULE - A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate. | 03-05-2009 |
| 20090321055 | LOOP HEAT PIPE - A loop heat pipe for heat dissipating to a heat source including a first pipe, a first capillary structure, a second capillary structure, a second pipe, and a working fluid is provided. The first pipe has an evaporating portion adjacent to the heat source and a condensing portion. The first capillary structure is disposed on an inner surface of the first pipe and extends from the evaporating portion to the condensing portion. The second capillary structure is disposed on the inner surface and located within the evaporating portion. The second pipe is connected between the evaporating portion and the condensing portion. The working fluid disposed in the first pipe and the second pipe is capable of being transferred from the evaporating portion to the condensing portion via the second pipe, and is capable of being transferred from the condensing portion to the evaporating portion in the first. | 12-31-2009 |
