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Fazzio
Agata Fazzio, Catania IT
| Patent application number | Description | Published |
|---|---|---|
| 20110129493 | COMBINED MEASLES-HUMAN PAPILLOMA VACINE - The present invention relates to combined vaccines against measles and human papilloma virus (HPV). In particular, the invention relates to recombinant measles virus vectors containing heterologous nucleic acid encoding single or several antigens derived from HPV, preferably, the major capside antigen L1, the minor capside antigen L2, the early gene E6 and the early gene E7 oncoproteins of HPV type 16, and optionally of types 18, 6 and 11. In a first embodiment, prophylactic vaccines are generated expressing HPV antigens, preferably L1 and/or L2 such that they induce a potent long-lasting immune response in mammals, preferably humans, to protect against HPV and MV infection. In another embodiment, therapeutic vaccines are generated expressing E6 and E7 proteins, and optionally L1 and L2, such that they induced strong immune responses will resolve persistent HPV infections at early or late stages, including HPV-induced cervical carcinoma. In a preferred embodiment, the combined vaccines are easy to produce on a large scale and can be distributed at low cost. | 06-02-2011 |
Ronald S. Fazzio, Loveland, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20080258842 | ACOUSTIC RESONATOR PERFORMANCE ENHANCEMENT USING ALTERNATING FRAME STRUCTURE - Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The alternating frame region is on one of the first and second electrodes. | 10-23-2008 |
| 20100267182 | WAFER BONDING OF MICRO-ELECTRO MECHANICAL SYSTEMS TO ACTIVE CIRCUITRY - A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer. | 10-21-2010 |
| 20100277257 | ACOUSTIC RESONATOR PERFORMANCE ENHANCEMENT USING SELECTIVE METAL ETCH - An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, and a second electrode. The substrate has a first surface and the first electrode is adjacent the first surface of the substrate. The layer of piezoelectric material is adjacent the first electrode. The second electrode is adjacent the layer of piezoelectric material, and the second electrode lies in a first plane and has an edge. The layer of piezoelectric material has a recessed feature adjacent the edge of the second electrode. | 11-04-2010 |
R. Shane Fazzio, Eden Prairie, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20100151115 | METHOD AND SYSTEM FOR PRODUCING A GAS-SENSITIVE SUBSTRATE - A method includes forming a gas-sensitive substrate during a production process by dispensing one or more gas-sensitive materials onto the substrate and drying the one or more gas-sensitive materials on the substrate. The method also includes adjusting the production process based on one or more sensor measurements associated with the substrate and/or the production process. Adjusting the production process could include conditioning air around the substrate so that the conditioned air has one or more specified characteristics and adjusting the one or more specified characteristics based on the one or more sensor measurements. The one or more sensor measurements could include one or more measurements of a moisture content of the substrate. Adjusting the production process could also include adjusting a tension of the substrate. The one or more gas-sensitive materials could be deposited in multiple regions of the substrate, such as along multiple tracks extending lengthwise down the substrate. | 06-17-2010 |
R. Shane Fazzio, Loveland, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20080202239 | Piezoelectric acceleration sensor - Piezoelectric accelerometers and gyroscopes having cantilevered transducers are described. | 08-28-2008 |
| 20090101999 | ELECTRONIC DEVICE ON SUBSTRATE WITH CAVITY AND MITIGATED PARASITIC LEAKAGE PATH - An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate. | 04-23-2009 |
| 20100068844 | Microcap Wafer Bonding Method and Apparatus - A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions. | 03-18-2010 |