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Fatt

Chew Tong Fatt, Penang MY

Patent application numberDescriptionPublished
20110181495LED MODULE DESIGN - A light emitting diode (LED) display screen including a plurality of LED display modules is disclosed. Each of the plurality of LED display modules includes a flexible substrate having a first surface and a second surface, opposite to the first surface, on which a plurality of LEDs are disposed; a power cable having a socket or a plug, the power cable being disposed on the first surface; a data cable having a socket or a plug, the data cable being disposed on the first surface; a magnet disposed on the first surface; and a plurality of connectors fixed to the flexible substrate, the plurality of connectors being disposed on the first surface and including a male connector and a female connector. A height of the magnet from the first surface of the flexible substrate is higher than heights of any components disposed on the first surface.07-28-2011

Chiang Chau Fatt, Melaka MY

Patent application numberDescriptionPublished
20090236615LIGHT EMITTING DIODE - A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface configured to emit light. The first electrode is electrically coupled to the P-doped portion of the first layer on a first side of the semiconductor structure. The first side is adjacent to the surface that is configured to emit the light. The second electrode is electrically coupled to the N-doped portion of the second layer on a second side of the semiconductor structure. The second side is also adjacent to the surface that configured to emit light.09-24-2009
20110092001LIGHT EMITTING DIODE - A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface configured to emit light. The first electrode is electrically coupled to the P-doped portion of the first layer on a first side of the semiconductor structure. The first side is adjacent to the surface that is configured to emit the light. The second electrode is electrically coupled to the N-doped portion of the second layer on a second side of the semiconductor structure. The second side is also adjacent to the surface that configured to emit light.04-21-2011

Gregory Cheong Seng Fatt, Singapore SG

Patent application numberDescriptionPublished
20120132715ADAPTER SYSTEM FOR A PORTABLE ELECTRONIC DEVICE - An adapter system including an adapter unit is described herein. The adapter unit includes receptacles shaped for removably receiving at least a portion of a portable electronic device therewithin. The adapter unit further includes at least one of an image capture device and a data capture device controllable by operating at least one user interface of the portable electronic device.05-31-2012

Rory Fatt, Delta CA

Patent application numberDescriptionPublished
20100036721Method of Increasing Customer Loyalty With A Merchant - A method of increasing customer loyalty and sales with a merchant includes providing a carrier to obtain demographic and contact information about a customer and enter the customer as a participant in a rewards program. This carrier also grants the loyalty program permission to market to them through any contact means they are given. The customer information is matched with a participant number. Promotional materials are sent to the participant wherein the promotional materials include a participant identifier and a promotional code wherein the promotional material is presented to a merchant to obtain points in the rewards program based upon the participant's activity with the merchant such that a card is not required to participate in the rewards program. The results of all marketing is analyzed to determine future customized marketing to target existing and potential customers with similar demographic profiles as merchants existing best customers.02-11-2010

Yue Seng Fatt, Cheras, Selangor MA

Patent application numberDescriptionPublished
20090188359Block-Molded Semiconductor Device Singulation Methods and Systems - The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.07-30-2009