Patent application number | Description | Published |
20110288502 | REINFORCED SEPTUM FOR AN IMPLANTABLE MEDICAL DEVICE - A septum for use in sealably covering a fluid cavity of an implantable medical device, such as an access port, is disclosed. The septum is resilient and includes a reinforcement structure that bolsters septum placement over the fluid cavity so as to inhibit unintended separation of the septum from the medical device when the fluid cavity is under pressure, such as during power injection of fluid into the fluid cavity. In one embodiment the septum comprises a resilient septum body that includes a flange disposed about a perimeter thereof. A reinforcement component is disposed in the flange for reinforcing engagement of the flange with a corresponding groove defined about an opening to the fluid cavity of the medical device so as to inhibit unintended detachment of the septum from the medical device. The reinforcement component in one embodiment includes an annular cord disposed in the flange. | 11-24-2011 |
20120220942 | Medical Component Insertion Device Including a Retractable Needle - An insertion device for use in assisting with the placement of a medical device within the body of a patient is disclosed. For example, the insertion device can be employed to assist with the placement of an introducer, which provides a conduit for insertion of a catheter into the body. In one embodiment, the insertion device comprises a needle that is removably disposed within a bore defined by the medical device, and a needle retraction assembly. The needle retraction assembly can position the needle in any one of a first position wherein a distal tip of the needle is disposed a predetermined distance distal to a distal end of the medical device, a second position wherein the needle distal tip is disposed distal but proximate to the distal end of the medical device, and a third position wherein the needle distal tip is retracted within the medical device bore. | 08-30-2012 |
20120238959 | Biased Internal Bolster for a Medical Device - A catheter and internal bolster for securing the catheter or other medical device within a body of a patient. In one embodiment, the catheter comprises an elongate catheter tube that defines at least one lumen and an internal bolster disposed proximate a distal end of the catheter tube. The internal bolster includes a plurality of hinged arms and is capable of an undeployed position wherein each arm is longitudinally extended substantially parallel to the catheter tube, and a deployed position wherein each arm is folded about its hinge so as to radially extend from the catheter tube and provide a bolster configuration. The internal bolster further includes a resilient portion included with the catheter tube and disposed centrally with respect to the internal bolster. The resilient portion provides a force urging the internal bolster to the deployed position. In one possible implementation, the catheter is configured as a feeding tube. | 09-20-2012 |
20120330159 | Needle Guide with Selectable Aspects - A needle guide assembly for inserting a needle into the body of a patient in order to access a subcutaneous target, such as a vessel, is disclosed. In one embodiment, the needle guide assembly comprises a needle guide body that is configured to at least indirectly and removably attach to an image producing device, such as an ultrasound probe. The needle guide body defines at least first and second elongate guide channels. Each guide channel defines a unique insertion angle with respect to a longitudinal axis of the ultrasound probe. Further, each guide channel is configured to accept needles of differing gauges. In other embodiments other needle guide assemblies are disclosed that include multiple guide channels for inserting a needle at a variety of insertion angles into the patient's body. Related methods are also disclosed. In yet other embodiments, needle guide assemblies including needle stop features are disclosed. | 12-27-2012 |
20130116571 | Ruggedized Ultrasound Hydrogel Insert - A ruggedized hydrogel product that is formulated to withstand the effects of high-energy sterilization procedures, such as gamma beam and electron beam sterilization, without significant structural degradation is disclosed. This enables the hydrogel product to be suitable for use in medical applications where sterile components are required. In one embodiment a ruggedized hydrogel product is disclosed and comprises a gel component, water for hydrating the gel component, and at least one free radical absorber component that is capable of absorbing free radicals produced when the hydrogel product is sterilized via a high-energy sterilization procedure. The free radical absorber component in one embodiment includes potassium metabisulfite and ascorbic acid. The ruggedized hydrogel product can be included with an ultrasound probe to provide an acoustically transparent interface between the probe and the skin of a patient. | 05-09-2013 |
Patent application number | Description | Published |
20100069743 | SYSTEMS AND METHODS FOR IDENTIFYING AN ACCESS PORT - An access port for subcutaneous implantation is disclosed. Such an access port may comprise a body for capturing a septum for repeatedly inserting a needle therethrough into a cavity defined within the body. Further, the access port may include at least one feature structured and configured for identification of the access port subsequent to subcutaneous implantation. Methods of identifying a subcutaneously implanted access port are also disclosed. For example, a subcutaneously implanted access port may be provided and at least one feature of the subcutaneously implanted access port may be perceived. Further, the subcutaneously implanted access port may be identified in response to perceiving the at least one feature. In one embodiment, an identification feature is engraved or otherwise defined by the access port, so as to be visible after implantation via x-ray imaging technology. | 03-18-2010 |
20120116323 | Catheter Assembly, Catheter Systems Including Same, and Method of Manufacture - A catheter assembly includes a catheter, a tubular structure affixed to an exterior surface of the catheter, and a stabilizing cuff affixed to, and at least partially embedded within, the tubular structure. The tubular structure may include a tapered surface extending from an end of the tubular structure to an exterior surface of the catheter. A method of manufacturing a catheter assembly may include positioning a tubular structure about a catheter, positioning a stabilizing cuff near the tubular structure, and partially embedding at least a portion of the stabilizing cuff within the tubular structure while shaping the tubular structure to form a tapered surface. A temporary sleeve may be positioned about the tubular structure prior to shaping the tubular structure. The tubular structure may also be preformed to include a tapered end prior to positioning the tubular structure about the catheter. | 05-10-2012 |
20120259296 | Systems and Methods for Identifying an Access Port - An access port for subcutaneous implantation is disclosed. Such an access port may comprise a body for capturing a septum for repeatedly inserting a needle therethrough into a cavity defined within the body. Further, the access port may include at least one feature structured and configured for identification of the access port subsequent to subcutaneous implantation. Methods of identifying a subcutaneously implanted access port are also disclosed. For example, a subcutaneously implanted access port may be provided and at least one feature of the subcutaneously implanted access port may be perceived. Further, the subcutaneously implanted access port may be identified in response to perceiving the at least one feature. In one embodiment, an identification feature is engraved or otherwise defined by the access port, so as to be visible after implantation via x-ray imaging technology. | 10-11-2012 |
20140142510 | Catheter Assembly, Catheter Systems Including Same, and Method of Manufacture - A catheter assembly, includes a catheter body, a tubular structure and a stabilizing cuff around a longitudinal length of the tubular structure. The tubular structure may be affixed to an exterior surface of the catheter body, and may include a tapered outer surface at a first terminal end of the tubular structure. The tapered outer surface may have a first outer diameter at the first terminal end of the tubular structure and a second outer diameter greater than the first outer diameter at a terminal end of the tapered outer surface opposite the first terminal end. The tubular structure may have a third outer diameter greater than the first outer diameter at a second terminal end of the tubular structure opposite the first terminal end. | 05-22-2014 |
20140180116 | Coupling Structures for an Ultrasound Probe - A probe cap for use with an ultrasound probe including a head portion and an acoustic surface is disclosed. In one embodiment, the probe cap includes a body that defines a cavity sized for releasably receiving the head portion of the probe therein. The probe cap body further defines a hole that is proximate the acoustic surface of the head portion. A compliant spacer component is disposed in the hole. The spacer component can include a hydrogel and provides an acoustic path between the acoustic surface and a tissue surface of a patient. The spacer component includes a skin contact surface that defines a concavity and is deformable against the tissue surface. Additional embodiments disclose various probe cap and accompanying needle guide designs for use in assisting a clinician with ultrasound probe use and needle insertion into a patient. | 06-26-2014 |
20150025478 | Reinforced Septum for an Implantable Medical Device - A septum for sealably covering a fluid cavity defined in an implantable device, which may be an access port, and methods for assembling the implantable device. The septum may include a resilient septum body, an annular flange extending radially outward from the septum body, and a reinforcement component disposed in the annular flange for reinforcing engagement with a corresponding annular groove defined in a body of the implantable device. The reinforcement component may inhibit unintended detachment of the septum from the implantable device. | 01-22-2015 |
Patent application number | Description | Published |
20090064453 | Retractable eraser with bristles - A retractable eraser has an elongated contoured housing which has a longitudinal slot and spaced detents and an opening at one end. A carrier has a button which is depressible so that a catch clears the detents to permit selective longitudinal displacement of the carrier. An oval shaped eraser element is mounted to the carrier and displaced into and out of the housing so as, in one position, to project beyond the housing. Bristles project longitudinally from the housing around the opening. | 03-12-2009 |
20090064509 | Manually operated hole punch - A manually operated single hole punch employs a pair of pivoted members having squeezable handles. A pair of opposed jaws have canopies formed from transparent or semi-transparent material to facilitate alignment of the punch with the material to be punched and to observe a reservoir which receives punched remnants. | 03-12-2009 |
20090064526 | Tape measure - A tape measure employs a generally rounded housing which receives a retractable measuring tape that is coilable within the housing and biased towards the fully coiled position. An actuator button is depressable to fix the measuring tape at a selected extended position. A clip assembly is removably attachable to the tape measure for facilitating mounting the tape measure to a belt. The end of the tape measure includes a stop member that may be configured as a hook portion defining a nail catch. The hook portion also has a rubber overmold to prevent slippage. | 03-12-2009 |
20090067912 | Pencil sharpener with eraser - A pencil sharpener case has a rotatable cover which covers a mechanical pencil sharpener. In one position, the cover may be rotatably retracted to provide access to the pencil sharpener. The case also mounts an eraser which may be used when the pencil sharpener is covered. | 03-12-2009 |
20100212781 | Pencil sharpener - A pencil sharpener has an electrical motor which drives a sharpening assembly. The end of the pencil to be sharpened is inserted downwardly into an opening in the top surface. Shavings from the sharpening process are deposited in a drawer-like receptacle below the sharpening assembly. A switch is provided so that the sharpening assembly will not be activated when the receptacle drawer is removed for disposal of the shavings. | 08-26-2010 |
Patent application number | Description | Published |
20080212303 | DEVICE FOR REDUCING OR PREVENTING EXCHANGE OF INFORMATION - A device that is adapted to receive a card including information, such as confidential information, in machine-readable form is disclosed. The device includes a body, wherein at least a portion of the body is made of a material that is adapted to attenuate or disrupt an interrogating signal sent toward the card or a return signal sent from the card to thereby at least reduce the likelihood that the confidential information is read from the card. | 09-04-2008 |
20090026566 | Semiconductor device having backside redistribution layers and method for fabricating the same - Present embodiments relate to a semiconductor device having a backside redistribution layer and a method for forming such a layer. Specifically, one embodiment includes providing a substrate comprising a via formed therein. The substrate has a front side and a backside. The embodiment may further include forming a trench on the backside of the substrate, disposing an insulating material in the trench, and forming a trace over the insulating material in the trench. | 01-29-2009 |
20090032964 | System and method for providing semiconductor device features using a protective layer - Present embodiments relate to systems and methods for providing semiconductor device features using a protective layer during coating operations. One embodiment includes a method comprising providing a substrate with a hole formed partially therethrough, the hole comprising an opening in a first side of the substrate. Additionally, the method comprises disposing a protective layer over the first side of the substrate, removing a portion of the protective layer over at least a portion of the opening to provide access to the hole, and filling at least a portion of the hole with a fill material. | 02-05-2009 |
20090174018 | CONSTRUCTION METHODS FOR BACKSIDE ILLUMINATED IMAGE SENSORS - A method of constructing a backside illuminated image sensor is described. The method includes the steps of forming a semiconductor wafer, forming at least electrical contacts in the semiconductor wafer, forming, in a handle wafer separate from the semiconductor wafer, a plurality of via holes, attaching the semiconductor wafer to the handle wafer such that the via holes in the handle wafer are aligned with the respective electrical contacts on the semiconductor wafer, removing the substrate layer from the semiconductor wafer, removing at least a portion of the handle wafer to expose the plurality of via holes, filling each of the exposed via holes with a conductive material and applying a solder material to each of the exposed via holes such that the conductive material in each of the via holes is electrically connected to the solder material. | 07-09-2009 |
20100171217 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 07-08-2010 |
20100273288 | IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE - An imager device is disclosed including a first substrate having an array of photosensitive elements formed thereon, a first conductive layer formed above the first substrate, a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer, a standoff structure formed above the first substrate, a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer, and an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer. A method of making an imager device is disclosed including providing a first substrate having a first conductive layer and an array of photosensitive elements formed above the first substrate, forming a conductive member that extends through the first substrate and is conductively coupled to the first conductive layer, forming a standoff structure above the first substrate, forming a patterned conductive layer above the standoff structure, the patterned conductive layer being conductively coupled to the first conductive layer, and conductively coupling an electrically powered device to the patterned conductive layer positioned above the standoff structure. | 10-28-2010 |
20110169122 | SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METHOD FOR FABRICATING THE SAME - Present embodiments relate to a semiconductor device having a backside redistribution layer and a method for forming such a layer. Specifically, one embodiment includes providing a substrate comprising a via formed therein. The substrate has a front side and a backside. The embodiment may further include forming a trench on the backside of the substrate, disposing an insulating material in the trench, and forming a trace over the insulating material in the trench. | 07-14-2011 |
20110233777 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 09-29-2011 |
20130181348 | SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METHOD FOR FABRICATING THE SAME - Present embodiments relate to a semiconductor device having a backside redistribution layer and a method for forming such a layer. Specifically, one embodiment includes providing a substrate comprising a via formed therein. The substrate has a front side and a backside. The embodiment may further include forming a trench on the backside of the substrate, disposing an insulating material in the trench, and forming a trace over the insulating material in the trench. | 07-18-2013 |