Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees

Fangfang

Fangfang Li, Shanghai CN

Patent application number	Description	Published
20100287430	MULTIPLE-CAPTURE DFT SYSTEM TO REDUCE PEAK CAPTURE POWER DURING SELF-TEST OR SCAN TEST - A method for providing ordered capture clocks to detect or locate faults within N clock domains and faults crossing any two clock domains in an integrated circuit or circuit assembly in scan-test or self-test mode, where N>1, each clock domain having one capture clock and a plurality of scan cells, each capture clock comprising a plurality of capture clock pulses; said method comprising: (a) generating and shifting-in N test stimuli to all said scan cells within said N clock domains in said integrated circuit or circuit assembly during a shift-in operation; (b) applying an ordered sequence of capture clocks to all said scan cells within said N clock domains, the ordered sequence of capture clocks comprising at least a plurality of capture clock pulses from two or more selected capture clocks placed in a sequential order such that all clock domains are never triggered simultaneously during a capture operation; and (c) analyzing output responses of all said scan cells to locate any faults therein.	11-11-2010

Fangfang Yang, Suzhou City CN

Patent application number	Description	Published
20090115039	High Bond Line Thickness For Semiconductor Devices - Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.	05-07-2009
20110037153	HIGH BOND LINE THICKNESS FOR SEMICONDUCTOR DEVICES - Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.	02-17-2011

Fangfang Zhu, Beijing CN

Patent application number	Description	Published
20100093090	METHOD AND KIT FOR EFFICIENT REPROGRAMMING OF SOMATIC CELLS - The present invention relates to method or kit for efficient reprogramming of somatic cells.	04-15-2010