| Patent application number | Description | Published |
|---|
| 20090109671 | LED LAMP HAVING A HEAT DISSIPATION DEVICE INCORPORATING A HEAT PIPE STRUCTURE THEREIN - An LED lamp ( | 04-30-2009 |
| 20090135594 | HEAT DISSIPATION DEVICE USED IN LED LAMP - A heat dissipation device ( | 05-28-2009 |
| 20090268407 | HEAT SINK CLIP - A heat sink clip ( | 10-29-2009 |
| 20090279263 | SECURING DEVICE FOR ASSEMBLING HEAT DISSIPATION MODULE ONTO ELECTRONIC COMPONENT - A securing device ( | 11-12-2009 |
| 20090279311 | ILLUMINATION DEVICE | 11-12-2009 |
| 20090284968 | LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp includes a lampshade, a light guide pole and a plurality of LEDs. The light guide pole is of light permeable material and received in the lampshade. A plurality of irregular elements is formed on an outer surface of the light guide pole. A distribution density of the irregular elements decreases gradually from two ends of the light guide pole towards a middle of the light guide pole. The LEDs are mounted at the two ends of the light guide pole. Light emitted by the light emitting diodes falls incident into the light guide pole and exits the light guide pole from the outer surface thereof. | 11-19-2009 |
| 20090294786 | LIGHT EMITTING DIODE DEVICE - A light emitting diode device includes a substrate, a plurality of light emitting diode chips mounted on the substrate and arranged in a plurality of lines and a frame located on the substrate. The frame includes a plurality of first plates each extending along a first direction of the substrate, a plurality of second plates each extending along a second direction of the substrate and a plurality of reflecting plates. The first plates and the second plates cooperatively form a plurality of receiving rooms for receiving the light emitting diode chips therein. Each reflecting plate is located above a corresponding line of light emitting diode chips and inclined with respect to the substrate. | 12-03-2009 |
| 20090296347 | HEAT DISSIPATION DEVICE - A securing device includes a securing member defining a securing hole therein, and a fastener extending through the securing hole. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes a large portion, a small portion, and a concave around the small portion. A diameter of the small portion is greater than the main portion and smaller than the fixing portion. A diameter of the large portion is greater than the fixing portion and smaller than the spring. The main portion extends through the small portion with the fixing portion tightly abutting the securing member. The spring is mounted around the main portion and received in the concave. The spring is compressed between the head portion and a step of the securing member in the concave. | 12-03-2009 |
| 20090323336 | LED LAMP - An LED lamp ( | 12-31-2009 |
| 20100039825 | LED | 02-18-2010 |
| 20100139888 | HEAT SPREADER AND HEAT DISSIPATION DEVICE USING SAME - A heat dissipation fan includes a fan frame, a bearing assembly, a stator and a rotor. The fan frame includes a base and a central tube. The central tube includes an open top end and an open bottom end. The base defines a receiving concave at a bottom surface thereof. The receiving concave communicates with the central hole. A top wall is formed by the base over the concave. A sidewall is formed between the top wall and the bottom surface of the base and surrounds the concave. A plurality of first locking units extend from the top wall into the receiving concave. The bearing assembly includes an oil sealing cover for sealing the open bottom end of the central tube. The oil sealing cover includes a plurality of second locking units which are detachably interlocked with the first locking units to mount the oil sealing cover to the base. | 06-10-2010 |
| 20100157537 | FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation units are connected together with their axes along length directions thereof being parallel to each other. Each of the heat dissipation units can resiliently deform to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink. | 06-24-2010 |
| 20100157540 | FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation fins are spaced from each other. When a force is applied to two heat spreaders of the heat sink, the heat dissipation fin is resiliently deformed to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating the heat sink and the heat dissipation fin. | 06-24-2010 |
| 20100232931 | HEAT DISSIPATION FAN - A heat dissipation fan includes a base with a plurality of holes defined therein, a stator mounted on the base and being placed around the holes of the base, and an impeller rotatably attached to the base. The impeller includes a hub and a plurality of blades, the hub includes a top wall with a plurality of holes defined therein and an annular wall depending from the top wall. The blades are arranged around the annular wall of the hub. An axial air passage is defined in the stator. The holes of the base communicate with the holes of the top wall via the air passage. | 09-16-2010 |
| 20100246136 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is formed between every two adjacent heat dissipation fins. The heat dissipation fin can resiliently deform to change a distance between the heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink. The electronic device comprises a shell and an electronic component mounted in the shell. One of the heat spreaders is attached to the electronic component and the other one is attached to the shell. | 09-30-2010 |
| 20100319880 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe, a base and a heat sink. The heat pipe includes an evaporating section and a condensing section. The evaporating section includes a flat outside surface at one side thereof. The base includes a top surface and an opposite bottom surface. The base defines a groove at the bottom surface thereof. The evaporating section is received in the groove with the flat outside surface spaced a distance from the bottom surface of the base. A solidified soldering layer is formed between the flat outside surface of the evaporating section and the bottom surface of the base. A bottom of the solidified soldering layer is coplanar to the bottom surface of the base. The heat sink is arranged on the top surface of the base with the condensing section of the heat pipe extending therethrough. | 12-23-2010 |
| 20110030930 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, an axial fan and a fan cover. The heat sink includes a plurality of fins defining a plurality of longitudinal airflow channels therebetween. The axial fan is mounted on a top side of the heat sink. The axial fan defines an air inlet located adjacent to and communicating with the airflow channels of the heat sink. The fan cover is between the heat sink and the axial fan. The fan cover includes a side plate surrounding a top end of the heat sink to make the axial fan just draw cooling air into the heat sink from a position around a bottom end of the heat sink. The cooling air flows upwardly through the heat sink to the air inlet of the axial fan to thereby take heat away from the heat sink. | 02-10-2011 |
| 20110048682 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat pipe and a heat sink. The heat sink defines a through hole with a diameter slightly smaller then an outer diameter of the heat pipe. The heat pipe is fixedly engaging in the through hole of the heat sink via interference fit. The heat pipe includes a tube defining an interspace therein, a first wick formed on an inner surface of the tube, working fluid received in the interspace of the tube, and a retaining structure. The retaining structure is received in the interspace of the tube and abuts the first wick of the tube to enhance a rigidity of the tube. A second wick is formed on an outer surface of the retaining structure and connects with the first wick of the tube. | 03-03-2011 |
