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Fang, Singapore
Chao Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110260551 | CIRCUIT AND METHOD FOR GENERATING A PULSE SIGNAL - Embodiments provide a circuit and a method for generating a pulse signal. The circuit includes a generating circuit configured to generate a first pulse signal, a branching circuit coupled to the generating circuit and configured to branch the first pulse signal into a second pulse signal and a third pulse signal, and a reflection element coupled to the branching circuit to reflect the second pulse signal. The circuit further includes a combining circuit, which is coupled to the reflection element and the branching circuit and is configured to combine the reflected second pulse signal and the third pulse signal to generate a fourth pulse signal. | 10-27-2011 |
Cheng Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110062972 | METHOD OF DETERMINING A SENSITIVITY OF A BIOSENSOR ARRANGEMENT, AND BIOSENSOR SENSITIVITY DETERMINING SYSTEM - According to an embodiment of the present invention, a method of determining or adjusting the sensitivity of a biosensor arrangement comprising at least one field effect biosensor is provided, each of the at least one field effect biosensor comprising: a semiconductor substrate comprising a source region, a drain region and a channel region disposed between the source region and the drain region; a gate isolation layer covering the channel region; and a reference electrode disposed over the gate isolation layer such that a electrolytic solution to be sensed can be provided between the reference electrode and the gate isolation layer. The method comprises the following processes carried out for each field effect biosensor: providing an electrolytic solution between the reference electrode and the gate isolation layer; applying a source/drain voltage between the source region and the drain region; varying a reference voltage supplied to the reference electrode over a voltage range; measuring a resulting drain current while varying the reference voltage in order to obtain a corresponding drain current function; and determining the sensitivity of the field effect biosensor based on the reference voltage supplied to the reference electrode and the corresponding drain current function. | 03-17-2011 |
Ching Meng Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090073663 | Wrap-around overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly. | 03-19-2009 |
| 20090197478 | Interlocking overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector having a thermoplastic body and electrical conducting elements embedded in and extending through the thermoplastic body to define internal and external connectors, and an overmold body that is mechanically interlocked with protuberances integrally formed on the thermoplastic body of the electrical connector. The mechanical interlocking relationship between the overmold body and the thermoplastic body of the electrical connector eliminates or minimizes delamination problems that could otherwise occur during thermal cycling, reduces or eliminates stringent control on cleanliness and texture of surfaces of the thermoplastic body of the electrical connector that interface with the overmold body, and eliminate or reduce costs associated with overcoming problems associated with delamination during thermal cycling. | 08-06-2009 |
Han-Chuan Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20080260946 | CLEAN METHOD FOR VAPOR DEPOSITION PROCESS - A method for cleaning a reaction chamber having a pedestal and a carrier ring is provided. First, the pedestal and the carrier ring are cleaned with a high pressure gas. Next, the carrier ring is moved to leave the pedestal, and a low pressure gas is provided to clean the pedestal, the carrier ring, and an area lay between the pedestal and the carrier ring. Thereafter, a full flush is performed to clean the pedestal and the carrier ring. | 10-23-2008 |
Jing Li Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100116168 | Alkalescent Chemical Silver Plating Solution - An alkalescent chemical silver electroless plating solution, which comprises: 0.01˜20 g/L silver ion or silver complex ion, 0.1˜150 g/L amine complexing agent, 0.1˜150 g/L amino acids complexing agent, and 0.1˜150 g/L polyhydroxy acids complexing agent. The alkalescent chemical silver plating solution provided by the present invention is able to overcome problems existing in acidic chemical silver plating processes commonly used at present. These problems include gnawing and corrosion of copper wires, lateral corrosion and difficulty of plating silver in blind holes, presence of solder ball voids and low strength of soldering. The silver layer plated by said silver plating solution possesses characteristics of high corrosion resistance, low contact resistance, no electromigration, high welding strength, and avoidance of bubbles produced in the solder when the plating pieces are being welded. | 05-13-2010 |
Qin Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100327273 | DITHIENOTHIOPHENE DERIVATIVES - An organic compound represented by the following general formula (I) wherein n is an integer from 1 to 500, inclusive, and R1 and R2 are each independently a moiety having an atom length of from about 8 atoms to about 20 atoms. | 12-30-2010 |
Xiaoqin Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090218515 | ELIMINATING FLUORESCENCE BACKGROUND NOISE - A method for measuring a fluorescent sample on a substrate. The method includes exciting the fluorescent sample with an exciting light source for the generation of a sample fluorescent optical signal and a substrate fluorescent optical signal substantially eliminated. The microfluidic substrate fluorescent optical signal is leaving the sample fluorescent optical signal. The sample fluorescence optical signal can then be processed. | 09-03-2009 |
Zhong Ping Fang, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090123060 | INSPECTION SYSTEM - An inspection system ( | 05-14-2009 |
| 20090152453 | OPTICAL WAVEFRONT SENSOR - An optical wavefront sensor comprising a light manipulation device; a detector for detecting light signals having been subjected to the light manipulation device; and a controller coupled to the manipulation device, the controller controlling the manipulation device to function as a lenslet array, each lenslet of the array focussing an incident portion of a wavefront onto the detector. The controller may also control the distance between the detector and the manipulation device. The spatial resolution of Shack-Hartmann sensors can be increased by digital scanning the wavefront with the manipulation device. The wavefront sensing can be dynamic adaptive by setting of parameters of the manipulation device. | 06-18-2009 |