Fang-I
Fang-I Chang, Taichung City TW
Patent application number | Description | Published |
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20130250605 | ILLUMINATION DEVICE - An illumination device includes a light guiding core, an optical film and a light emitting module. The optical film separately surrounds the light guiding core. A ratio of a diameter of the optical film to a diameter of the light guiding core is between 2 and 3. The light emitting module is disposed at one side of the light guiding core. | 09-26-2013 |
Fang-I Li, Tao-Yuan Hsien TW
Patent application number | Description | Published |
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20120061711 | LIGHT EMITTING DIODE WITH INDEPENDENT ELECTRODE PATTERNS - A light emitting diode includes a substrate, an N-doped layer disposed on the substrate, a plurality of cathodes disposed between the N-doped layer and the substrate, an active layer disposed on the N-doped layer, a P-doped layer disposed on the active layer, and a plurality of anodes disposed on the P-doped layer. The cathodes are electrically connected to the N-doped layer, and the patterns of the cathodes are disconnected from each other. The anodes are electrically connected to the P-doped layer, and the patterns of the anodes are disconnected from each other. Each cathode and a corresponding anode form a loop, and each loop is an independent loop. | 03-15-2012 |
Fang-I Li, Taoyuan County TW
Patent application number | Description | Published |
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20130175572 | LIGHT-EMITTING DIODE CHIP - A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation. | 07-11-2013 |