Patent application number | Description | Published |
20080238596 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 10-02-2008 |
20080238602 | COMPONENTS WITH ON-DIE MAGNETIC CORES - An apparatus may include a first magnetic layer, a second magnetic layer, and a conductive pattern. The conductive pattern is at a third layer between the first and second magnetic layers. Moreover, one or more magnetic vias connect the first and second magnetic layers. The magnetic layers and vias may operate as ferromagnetic cores or shields. Further they may be integrated on a chip (on-die magnetics). The apparatus may be included in inductors, transformers, transmission lines, and so forth. | 10-02-2008 |
20080290980 | CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS - An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency. | 11-27-2008 |
20090166804 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 07-02-2009 |
20090174377 | MULTIPHASE TRANSFORMER FOR A MULTIPHASE DC-DC CONVERTER - A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer. | 07-09-2009 |
20090207576 | SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS - An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers. | 08-20-2009 |
20090267722 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 10-29-2009 |
20100001826 | Inductors for integrated circuit packages - An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film. | 01-07-2010 |
20100118501 | Integrated inductor - An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein. | 05-13-2010 |
20110001202 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 01-06-2011 |
20110043318 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 02-24-2011 |
20110131797 | Inductors for Integrated Circuit Packages - An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film. | 06-09-2011 |
20110268457 | METHOD AND APPARATUS FOR OPTICAL SIGNALING - A method and apparatus for optical signaling. In one embodiment, a laser driver converts a digital voltage sequence to a current signal having a bias mode adjustable by a bias control and a modulation mode adjustable by a modulation control. A laser generates an optical signal responsive to the current signal of the laser driver. In one embodiment, a photo-detector receives an optical signal and generates a single ended current signal. A transimpedance amplifier circuit converts the single ended current signal to a differential voltage signal. A clock recovery circuit generates an aligned clock signal and a sampler circuit uses the aligned clock signal to retrieve a digital voltage sequence. | 11-03-2011 |
20120194245 | PULSE WIDTH MODULATOR - Disclosed herein are pulse width modulator (PWM) solutions with comparators not relying on a variable reference to adjust duty cycle. In accordance with some embodiments, a pulse width modulator having a comparator with an applied adjustable waveform to generate a bit stream with a controllably adjustable duty cycle is provided. | 08-02-2012 |
20130113444 | MULTIPHASE TRANSFORMER FOR A MULTIPHASE DC-DC CONVERTER - A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer. | 05-09-2013 |
20130182365 | INTEGRATED INDUCTORS - Multiple-inductor embodiments for use in substrates are provided herein. | 07-18-2013 |
20140070876 | LINEAR VOLTAGE REGULATOR BASED ON-DIE GRID - Described is a linear voltage regulator circuit comprising a first voltage regulator comprising a first source follower having a first node to provide a first power supply, and a second node different from the first node; and a second voltage regulator comprising a second source follower having a first node to provide a second power supply, and a second node different from the first node, wherein the second nodes of the first and second voltage regulators are electrically shorted. | 03-13-2014 |
20140136860 | APPARATUS AND SYSTEM FOR GENERATING A SIGNAL WITH PHASE ANGLE CONFIGURATION - Described herein is an apparatus and system for generating a signal with phase angle configuration. The apparatus comprises an array of switch-resistors, each switch resistor to receive a control signal, wherein the array of switch-resistors to generate an output signal; and a circuit to configure phase angle of the output signal. The apparatus can be used for different package and inductor configurations. The apparatus provides flexibility to mitigate switching noise by adjusting phase angles, and provides the ability to enable and disable switch-resistors on the fly without ripples. The apparatus also saves power consumption by selectively turning off switch-resistors when phases are disabled. The output signal of the apparatus has smooth triangular waveforms for improving the quality of power supply generated using the output signal. Overall, the apparatus exhibits reduced sensitivity to process variations compared to traditional signal generators. | 05-15-2014 |
20140266119 | NON-LINEAR CONTROL FOR VOLTAGE REGULATOR - Described is an apparatus having a non-linear control to manage power supply droop at an output of a voltage regulator. The apparatus comprises: a first inductor for coupling to a load; a capacitor, coupled to the first inductor, and for coupling to the load; a first high-side switch couple to the first inductor; a first low-side switch coupled to the first inductor; a bridge controller to control when to turn on and off the first high-side and first low-side switches; and a non-linear control (NLC) unit to monitor output voltage on the load, and to cause the bridge controller to turn on the first high-side switch and turn off the first low-side switch when a voltage droop is detected on the load. | 09-18-2014 |
20140266486 | ON-DIE TRIM-ABLE PASSIVE COMPONENTS FOR HIGH VOLUME MANUFACTURING - Described is an apparatus to trim on-die passive components. The apparatus comprises: a resistor-capacitor (RC) dominated oscillator independent of first order transistor speed dependency, wherein the RC dominated oscillator including one or more resistors and capacitors with programmable resistance and capacitance, and wherein the RC dominated oscillator to generate an output signal having a frequency depending substantially on values of the programmable resistance and capacitance; and a trim-able resistor or capacitor operable to be trimmed, for compensating process variations, according to a program code associated with the programmable resistance and capacitance of the RC dominated oscillator. | 09-18-2014 |