Patent application number | Description | Published |
20080200069 | UNIVERSAL SERIAL BUS PLUG AND SOCKET COUPLING ARRANGEMENTS - A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavil configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin. | 08-21-2008 |
20080227393 | Method and system for pairing of wireless devices using physical presence - Techniques that facilitate pairing of wireless devices with other wireless devices are disclosed. Once paired, the wireless devices can exchange data in a wireless manner. According to one embodiment, a pairing process can be secured through use of physical proximity, or even physical connection, of wireless devices to be paired. According to another embodiment, user actions to provoke or perform pairing can be reduced or eliminated. According to still another embodiment, a wireless device being paired can be configured using configuration information provided from another wireless device being paired. | 09-18-2008 |
20100103612 | THERMAL SPRAY COATING FOR SEAMLESS AND RADIO-TRANSPARENT ELECTRONIC DEVICE HOUSING - Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device. | 04-29-2010 |
20100149735 | HOUSING OF AN ELECTRONIC DEVICE FORMED BY DOUBLESHOT INJECTION MOLDING - A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure. | 06-17-2010 |
20100167574 | UNIVERSAL SERIAL BUS PLUG AND RECEPTACLE COUPLING ARRANGEMENTS - A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin. | 07-01-2010 |
20110177300 | DICHROIC GLASS FOR COSMETIC APPEAL IN AN ELECTRONIC DEVICE - A dichroic coating can be applied to a glass window of an electronic device to enhance the cosmetic and aesthetic appeal of the device. Different processes can be applied to the glass window in combination with a dichroic coating. For example, a layer of ink can be applied to the glass window in addition to one or more layers of dichroic material. The material layers can cover any suitable portion of the glass. For example, the material layers can include holes or openings. As another example, the material layers can be constructed from several distinct shapes placed on the glass. In some cases, software applications can be used to define a desired color profile for a coating, and to retrieve a suitable combination of dichroic and other layers to provide the desired color profile. | 07-21-2011 |
20110269348 | HIGHLY PORTABLE MEDIA DEVICES - An improved portable media device and methods for operating a media device are disclosed. | 11-03-2011 |
20110278312 | HOUSING OF AN ELECTRONIC DEVICE FORMED BY DOUBLESHOT INJECTION MOLDING - A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure. | 11-17-2011 |
20120206870 | THERMAL SPRAY COATING FOR SEAMLESS AND RADIO-TRANSPARENT ELECTRONIC DEVICE HOUSING - Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device. | 08-16-2012 |
20120228320 | PACKAGING ASSEMBLY - A packaging system is configured to package a product to form a packaged product assembly. The packaging system includes a lid including a major panel, side panels, and a tab extending from one of the side panels. The packaging system also includes a box hingedly coupled to the lid that includes side walls and a bottom wall with a slot defined therein. The product may be retained by the lid against the major panel by first and second end flaps. As the lid and box are folded toward one another, the product may be loaded into the box and the tab and an adhesive member coupled thereto may extend through the slot in the bottom wall of the box. The adhesive member may then be adhered to a back surface of the box to retain the product in the packaging system. Related methods are also provided. | 09-13-2012 |
20130081951 | Laser Texturizing and Anodization Surface Treatment - A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface. | 04-04-2013 |
20140030522 | TRANSPARENT FIBER COMPOSITE - A method for forming a relatively transparent fiber composite is disclosed. In one embodiment, the relatively transparent fiber composite can include glass fibers with a relatively low amount of iron oxide. In another embodiment, the transparent fiber composite can include a selected resin, a sizing and glass fibers where the index of refraction of the glass fibers, the sizing and the resin can be similar, within a tolerance amount. In yet another embodiment, the resin can be relatively clear and free from pigments and tints. In one embodiment, the glass fibers can be formed into a mat. In another embodiment, glass fibers can be chopped or milled and a relatively transparent part can be formed through injection molding. | 01-30-2014 |