| Patent application number | Description | Published |
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| 20100309368 | WAFER-LEVEL LENS MODULE AND IMAGE PICKUP MODULE INCLUDING THE SAME - Provided are a wafer-level lens module and an image pickup module including the same. The wafer lens module includes a plurality wafer-scale lenses. At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate. The glass lens element may be a one-sided lens or a double-sided lens. When the glass lens is a double-sided lens, the substrate may have a through hole. The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate. Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses. | 12-09-2010 |
| 20110037887 | WAFER-LEVEL LENS MODULE AND IMAGE PICKUP DEVICE INCLUDING THE SAME - Disclosed are a wafer-level lens module including a plurality of wafer-scale lenses that are stacked and an image pickup device including the wafer-level lens module and an image sensor. Each wafer-scale lens includes a substrate with a light-transmission part, and a lens element fixed on one side or both sides of the substrate. The lens element includes an optical zone, corresponding to the light-transmission part of the substrate, and an extended zone disposed outside the optical zone. A trench or protrusion is formed as an alignment guide on one or both sides of the substrate, adjacent to the light-transmission part, and a protrusion or trench, aligned with the trench or protrusion, is formed in the extended zone of the lens element. The lens element is aligned on the substrate such that an inclined portion of the protrusion contacts corners of the trench. | 02-17-2011 |
| Patent application number | Description | Published |
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| 20080213966 | INDUCTOR EMBEDDED IN SUBSTRATE, MANUFACTURING METHOD THEREOF, MICRO DEVICE PACKAGE, AND MANUFACTURING METHOD OF CAP FOR MICRO DEVICE PACKAGE - An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface. | 09-04-2008 |
| 20090115875 | IMAGE SENSOR MODULE AND FABRICATION METHOD THEREOF - An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip. | 05-07-2009 |
| 20100050412 | PART BEING CENTERED DURING ASSEMBLY PROCESS, WAFER LEVEL PARTS ASSEMBLY, AND APPARATUS AND METHOD TO MANUFACTURE WAFER LEVEL PARTS ASSEMBLY - A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole. | 03-04-2010 |
