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Etherton

Bradley P. Etherton, Cincinnati, OH US

Patent application numberDescriptionPublished
20090062490Olefin polymerization process - A slurry process for polymerizing ethylene is disclosed. The process comprises polymerizing ethylene in the presence of an α-olefin, hydrogen, and a catalyst comprising an activator and a supported, dimethylsilyl-bridged bis(indenoindolyl)zirconium complex. The process has high catalyst activity and produces polyethylene having a broad molecular weight distribution.03-05-2009
20090152169Removal of metal contaminants from polyethylene - A process to remove metal contaminants from a hydrocarbon solution of polyethylene is disclosed. The process comprises adding a primary alcohol and a β-diketone to a solution of polyethylene at a temperature within the range of 120° C. to 300° C. and contacting the solution with basic alumina. The process removes metal contaminants and minimizes degradation and condensation products, which can have a detrimental effect on polyethylene properties. The process provides polyethylene with low metal residues and good properties.06-18-2009
20100016526Process for the preparation of multimodal polyethylene resins - A two-stage cascade polymerization process for the production of multimodal polyethylene film resins with improved bubble stability is provided. The process comprises polymerizing ethylene or a mixture of ethylene and a C01-21-2010
20100055432Polyethylene thick film and process for preparing polyethylene - A thick film and process to prepare polyethylene useful for the film are disclosed. Ethylene is polymerized in two reaction zones with a C03-04-2010

Patent applications by Bradley P. Etherton, Cincinnati, OH US

David Kevin Etherton, Hants GB

Patent application numberDescriptionPublished
20090002242Housing for a portable electronic device - A housing for a portable electronic device including a housing portion; and an antenna element embedded within the housing portion, and operable at a resonant frequency, wherein the antenna element includes at least one folded portion and has a thickness substantially equal to at least four skin depths at the resonant frequency.01-01-2009

Melanie Etherton, Austin, TX US

Patent application numberDescriptionPublished
20090284881PACKAGE LEVEL ESD PROTECTION AND METHOD THEREFOR - A semiconductor package includes an electrostatic discharge rail capable of being coupled to a first conductive contact and a second conductive contact, a first portion of a voltage triggerable material between the electrostatic discharge rail and the first conductive contact; and a second portion of the voltage triggerable material between the electrostatic discharge rail and the second conductive contact. The first and second conductive contacts may be coupled to the same semiconductor device or different semiconductor devices.11-19-2009
20090310266METHOD AND CIRCUIT FOR eFUSE PROTECTION - An eFuse (electronic fuse) circuit has a first detector for determining whether an ESD (electrostatic discharge) event occurs at a circuit pad of an integrated circuit and provides an ESD trigger signal in response thereto. A second detector detects a presence of a first power supply voltage and provides a power on signal indicating the presence of the first power supply voltage. A fuse is permitted to be programmable when no detection of the ESD event occurs and at the same time a presence of the power on signal is detected. The fuse is not permitted to be programmed when an ESD event is detected or when there is an absence of the power on signal. An array of fuses is thereby protected from inadvertent programming from an ESD event or powering up an integrated circuit.12-17-2009