Patent application number | Description | Published |
20080230873 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND/OR INDUCTOR AND METHOD OF MAKING - An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor. | 09-25-2008 |
20110001214 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND/OR INDUCTOR AND METHOD OF MAKING - An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor. | 01-06-2011 |
20130055184 | METHOD AND SYSTEM FOR PHYSICAL VERIFICATION USING NETWORK SEGMENT CURRENT - A data processing system determines current information corresponding to a node included at a device design. Physical layout information corresponding to the node is received, the physical layout information including one or more layout geometries, the one or more layout geometries providing a circuit network. The circuit network may be partitioned into two or more network segments. A current conducted at a network segment is identified based on the current information. Information representative of dimensions and metal layer of a layout geometry included at the network segment is received. The computer determines that the current exceeds a predetermined maximum threshold, the predetermined maximum threshold determined based on the dimensions and metal layer. | 02-28-2013 |
20130320490 | INDUCTIVE ELEMENT WITH INTERRUPTER REGION AND METHOD FOR FORMING - A semiconductor device structure a semiconductor substrate having a first conductivity type and a top surface. A plurality of first doped regions is at a first depth below the top surface arranged in a checkerboard fashion. The first doped regions are of a second conductivity type. A dielectric layer is over the top surface. An inductive element is over the dielectric layer, wherein the inductive element is over the first doped regions. | 12-05-2013 |
20130326448 | Techniques for Electromigration Stress Determination in Interconnects of an Integrated Circuit - In one or more embodiments, one or more methods, processes, and/or systems described can determine stress failures in interconnect segments of integrated circuit designs and correct those failure via modifying the interconnect segments of the integrated circuit designs with one or more additions to the interconnect segments of the integrated circuit designs. Potentials can be received from a simulation, and one or more failures of an interconnect segment can be determined via the potentials from the simulation. For example, a failure can be determined via a comparison with a potential from the simulation and a critical potential. An interconnect segment can be modified with a stub such that a comparison with a potential from the simulation and a critical potential to provide a non-failing, modified interconnect segment. | 12-05-2013 |
20140258951 | Prioritized Design for Manufacturing Virtualization with Design Rule Checking Filtering - An approach is provided to generate a number of virtualized circuit designs by applying design-for-manufacturing (DFM) processes to a circuit design. The virtualized circuit designs are checked using design rule checks (DRCs), with the checking resulting in a design rule error quantity that corresponds to each of the virtualized circuit designs. One of the virtualized circuit designs is selected for use in manufacturing the circuit design with the selection based each of the design's design rule error quantities. | 09-11-2014 |
20140273391 | INDUCTIVE ELEMENT WITH INTERRUPTER REGION AND METHOD FOR FORMING - A semiconductor device structure a semiconductor substrate having a first conductivity type and a top surface. A plurality of first doped regions is at a first depth below the top surface arranged in a checkerboard fashion. The first doped regions are of a second conductivity type. A dielectric layer is over the top surface. An inductive element is over the dielectric layer, wherein the inductive element is over the first doped regions. | 09-18-2014 |
20150046893 | TECHNIQUES FOR ELECTROMIGRATION STRESS MITIGATION IN INTERCONNECTS OF AN INTEGRATED CIRCUIT DESIGN - A technique for electromigration stress mitigation in interconnects of an integrated circuit design includes generating a maximal spanning tree of a directed graph, which represents an interconnect network of an integrated circuit design. A first point on the spanning tree having a lowest stress and a second point on the spanning tree having a highest stress are located. A maximum first stress between the first and second points is determined. In response to determining the maximum first stress between the first and second points is greater than a critical stress, a stub is added to the spanning tree at a node between the first and second points. The maximum first stress between the first and second points is re-determined subsequent to adding the stub. | 02-12-2015 |