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Erich Thallner, St. Florian AT
Erich Thallner, St. Florian AT
| Patent application number | Description | Published |
|---|---|---|
| 20080233331 | METHOD AND DEVICE FOR PRODUCING A NANOPATTERNED DISC - The invention relates to a method and a device according to the preambles of claims | 09-25-2008 |
| 20080267743 | APPARATUS FOR IMPRINTING AND/OR EMBOSSING SUBSTRATES - The invention relates to an apparatus for imprinting and/or embossing substrates ( | 10-30-2008 |
| 20080284999 | DEVICE FOR TRANSFERRING STRUCTURES WHICH ARE PROVIDED IN A MASK ONTO A SUBSTRATE - The invention concerns a device for transferring structures which are provided in a mask onto a substrate, | 11-20-2008 |
| 20090158947 | Stamp Comprising a Nanostamping Structure, Device and Method for the Production Thereof - The invention relates to a stamp comprising a nanostructure for introducing and/or applying nanostructures into/onto components as well as a device and a method for producing said stamp. The inventive stamp is provided with a rigid support for the nanostamping structure while the nanostamping structure is joined to the support. | 06-25-2009 |
| 20090258583 | DEVICE AND PROCESS FOR APPLYING AND/OR DETACHING A WAFER TO/FROM A CARRIER - The invention relates to a device for applying and/or detaching a wafer to/from a carrier with | 10-15-2009 |
| 20090274872 | Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate - The present invention relates to a device ( | 11-05-2009 |
| 20090298207 | METHOD FOR BONDING WAFERS - The invention relates to a method for bonding wafers along their corresponding surfaces. | 12-03-2009 |
| 20110042010 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate ( | 02-24-2011 |
| 20110045240 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate ( | 02-24-2011 |
| 20110127785 | HANDLING DEVICE AND HANDLING METHOD FOR WAFERS - The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume. | 06-02-2011 |
| 20110133500 | HANDLING DEVICE AND HANDLING METHOD FOR WAFERS - The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume. | 06-09-2011 |