Patent application number | Description | Published |
20100064162 | TECHNIQUES TO MANAGE OPERATIONAL PARAMETERS FOR A PROCESSOR - Techniques to manage operational parameters for a processor are described. For instance, a method includes monitoring performance values representing physical characteristics for multiple components of a computing platform, and managing a performance level for a processor based on the performance values and one or more operational parameters for the processor. The operational parameters may include one or more transitory operational parameters that cause the processor to temporarily exceed operational parameters set by a thermal design power limit. Other embodiments are described and claimed. | 03-11-2010 |
20100205464 | METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL - For one disclosed embodiment, a plurality of processor cores may be on a semiconductor die. The processor cores may have at least one corresponding temperature sensor. Circuitry on the semiconductor die may generate thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. A thermal event indication may indicate that a sensed temperature exceeds a temperature point. Central management logic on the semiconductor die may receive thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. The central management logic may modify operation of one or more of the processor cores in response to a thermal event indication. Other embodiments are also disclosed. | 08-12-2010 |
20120159201 | METHOD AND APPARATUS TO CONFIGURE THERMAL DESIGN POWER IN A MICROPROCESSOR - A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency. | 06-21-2012 |
20120166842 | THERMALLY DOWNWARD SCALABLE SYSTEM - An apparatus may comprise a power management system. Other embodiments are described and claimed. | 06-28-2012 |
20120216029 | METHOD, APPARATUS, AND SYSTEM FOR ENERGY EFFICIENCY AND ENERGY CONSERVATION INCLUDING CONFIGURABLE MAXIMUM PROCESSOR CURRENT - An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform. | 08-23-2012 |
20130007440 | METHOD AND APPARATUS FOR CONFIGURABLE THERMAL MANAGEMENT - Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed. | 01-03-2013 |
20150100799 | METHOD AND APPARATUS FOR CONFIGURABLE THERMAL MANAGEMENT - Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed. | 04-09-2015 |
20150100800 | METHOD AND APPARATUS FOR CONFIGURABLE THERMAL MANAGEMENT - Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed. | 04-09-2015 |