| Patent application number | Description | Published |
|---|
| 20080259572 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-23-2008 |
| 20080264603 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-30-2008 |
| 20090109611 | METHOD AND COMPUTER SYSTEM WITH ANTI-TAMPER CAPABILITY AND THERMAL PACKAGING STRUCTURE FOR IMPLEMENTING ENHANCED HEAT REMOVAL FROM PROCESSOR CIRCUITRY - A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits. | 04-30-2009 |
| 20090147464 | Ventilation Assembly for Computer Hardware Systems - An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second row of vent holes is staggered with respect to the first row of vent holes such that the larger vent holes are aligned with smaller vent holes, preferably in a ratio of two smaller vent holes per one larger vent hole. Such a perforation arrangement of vent holes may be provided on a blindswap cassette for securing and aligning computer cards for mounting in a housing, such as a sled for use in computer systems. | 06-11-2009 |
| 20090260384 | Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger - One embodiment of the invention provides a rack assembly for cooling a computer system. A rack provides support for one or more columns of heat-generating electronic devices. Device fans move air from an air inlet side of the rack through the devices and through an air outlet side of the rack. A unitary door has a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The unitary door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet side of the rack must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the one or more columns of heat-generating devices. A coolant circulation system includes a coolant distribution unit for chilling liquid coolant, a supply hose placing the coolant distribution unit in fluid communication with an inlet manifold of the air-to-liquid heat exchanger, and a return hose placing an outlet manifold of the air-to-liquid heat exchanger in fluid communication with the coolant distribution unit. The supply hose and return hose are routed outside the cross-sectional area of the air outlet passage. | 10-22-2009 |
| 20090260874 | Biased Air Baffle For Computer Rack - One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction. | 10-22-2009 |
| 20090261051 | Toolless Rail Mounting For A Computer System Rack - A rack for supporting electronic devices and modules with adjustable rails. The rack has a vertical wall with a set of holes at various elevations, each set of holes including at least a proximal hole evenly spaced apart from a distal hole. A longitudinally-extending rail has a set of clips for selectively securing the rail to the vertical wall, wherein the set of clips includes at least a proximal clip selectively receivable in the proximal hole at a selected elevation for supporting a proximal end of the rail and a distal clip selectively receivable in the distal hole at the selected elevation for supporting a distal end of the rail. The system may include a second rail for securing to an opposing vertical wall of the rack to form a shelf or bay for an electronic device. Each rail may be latched in place and can be selectively installed and removed without use of tools. | 10-22-2009 |
| 20090262501 | Rack With Integrated Rear-Door Heat Exchanger - Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices. | 10-22-2009 |
| 20090284928 | Enhancing the Cooling of Dual In-Line Memory Modules - An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM. | 11-19-2009 |
