Patent application number | Description | Published |
20100333056 | TEMPERATURE-CONTROLLED 3-DIMENSIONAL BUS PLACEMENT - Block placement within each device-containing layer is optimized under the constraint of a simultaneous optimization of interlayer connectivity between the device-containing layer and immediately adjacent device-containing layers. For each functional block within the device-containing layer, lateral heat flow is calculated to laterally adjacent functional blocks. If the lateral heat flow is less than a threshold value for a pair of adjacent functional blocks, placement of the functional blocks and/or interlayer interconnect structure array therebetween or modification of the interlayer interconnect structure array is performed. This routine is repeated for all adjacent pairs of functional blocks in each of the device-containing layers. Subsequently, block placement within each device-containing layer may be optimized under the constraint of a simultaneous optimization of interlayer connectivity across all device-containing layers. This method provides a design having sufficient lateral heat flow in each of the device-containing layers in a semiconductor chip. | 12-30-2010 |
20110121811 | POWER DELIVERY IN A HETEROGENEOUS 3-D STACKED APPARATUS - A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage. | 05-26-2011 |
20110191776 | LOW OVERHEAD DYNAMIC THERMAL MANAGEMENT IN MANY-CORE CLUSTER ARCHITECTURE - A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution. | 08-04-2011 |
20110302582 | TASK ASSIGNMENT ON HETEROGENEOUS THREE-DIMENSIONAL/STACKED MICROARCHITECTURES - A method of enhancing performance of a three-dimensional microarchitecture includes determining a computational demand for performing a task, selecting an optimization criteria for the task, identifying at least one computational resource of the microarchitecture configured to meet the computational demand for performing the task, and calculating an evaluation criteria for the at least one computational resource based on the computational demand for performing the task. The evaluation criteria defines an ability of the computational resource to meet the optimization criteria. The method also includes assigning the task to the computational resource based on the evaluation criteria of the computational resource in order to proactively avoid creating a hot spot on the three-dimensional microarchitecture. | 12-08-2011 |
20120284541 | POWER DELIVERY IN A HETEROGENEOUS 3-D STACKED APPARATUS - A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage. | 11-08-2012 |
20130055185 | VERTICAL POWER BUDGETING AND SHIFTING FOR 3D INTEGRATION - A method is provided for managing power distribution on a 3D chip stack having two or more strata, a plurality of vertical power delivery structures, and multiple stack components. At least two stack components are on different strata. Operating modes are stored that respectively have different power dissipations. A respective effective power budget is determined for each of the at least two stack components based on respective ones of the operating modes targeted therefor, and power characteristics and thermal characteristics of at least some of the stack components inclusive or exclusive of the at least two stack components. The respective ones of the plurality of operating modes targeted for the at least two stack components are selectively accepted or re-allocated based on the respective effective power budget for each of the at least two stack components, power constraints, and thermal constraints. The power constraints include vertical structure electrical constraints. | 02-28-2013 |
20130132535 | Network Data Processsing System - A method and apparatus for processing of data packets by a data processing component comprising a plurality of processing resources. A metric value for a current configuration of the processing resources that are processing the data packets is identified. A new configuration of the processing resources is selected using the metric value. The current configuration of the processing resources is changed to the new configuration and data packets are distributed to the new configuration for processing as the data packets are received. | 05-23-2013 |
20130254526 | EFFECT TRANSLATION AND ASSESSMENT AMONG MICROARCHITECTURE COMPONENTS - Awareness of the relationships among the operating parameters for an individual core and among cores allows dynamic and intelligent management of the multi-core system. The relationships among operating parameters and cores, which can be somewhat opaque, are established with design-time simulations, and adapted with run time data collected from operation of the multi-core system. The relationships are expressed with functions that translate between operating parameters, between different cores, and between operating parameters of different cores. These functions are embodied in circuitry built into the multi-core system. The circuitry will be referred to hereinafter as a translator unit. The translator unit traverses the complex relational dependencies among multiple operating parameters and multiple cores, and determines an outcome with respect to one or more constraints corresponding to those operating parameters and cores. | 09-26-2013 |
20130331996 | Optimizing Heat Transfer in 3-D Chip-Stacks - A computer-implemented method, system, and article of manufacture for optimizing heat transfer in a 3-D chip-stack. The method includes the steps of: receiving a heat-removal effectiveness parameter for a plurality of channel-region areas in the chip-stack, receiving at least one of a flow value and temperature value for at least two of the channel-region areas, comparing the received values for different channel-region areas, and adjusting a flow rate of a liquid flowing to at least one of the two channel-region areas based on the heat-removal effectiveness parameter of the channel-region area receiving the adjustment and the results of the comparison step, where at least one step is carried out using a computer device. | 12-12-2013 |